The present invention relates to a method for exchanging heat with an object said method comprising using a heat transfer fluid wherein said heat transfer fluid comprises one or more chemical compounds having the general formula: (I) wherein: R.sub.1, R.sub.2, R.sub.3, R.sub.4 can be the same or different, linear or branched, partially fluorinated alkyl groups having a C1-C6 carbon chain.

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A device and a method for cooling one or several high-performance computers or circuits located in one or more housings and including a dual-circuit cooling system. The high-performance computers or circuits are dipped into a dielectric first cooling liquid in a cuboid basin with a completely fluid-tight configuration and a first cooling circuit with a pump is arranged in the basin for the circulation of the first cooling liquid, with the first cooling liquid being forced to flow through the housings of the high-performance computers or circuits during circulation, thus cooling them. In the basin, a heat exchanger, a forward flow and a return flow of a second cooling circuit with the second cooling liquid are accommodated, and the heat exchanger is dipped into the first cooling liquid and the first liquid is cooled by a second cooling liquid.

A negative pressure liquid cooling system and a method for controlling a negative pressure liquid cooling system are provided, and the negative pressure liquid cooling system separately controls pressures at an inlet and an outlet of a cold plate, so that the pressures at the inlet and the outlet of the cold plate remain negative. In this way, when a pipeline between the inlet and the outlet of the cold plate is perforated, a pressure at the outlet of the cold plate can be separately controlled to remain negative, so that a coolant is suppressed in the pipeline, and a coolant leakage phenomenon is avoided. Therefore, damage or a security threat to a to-be-cooled electronic device that is caused by leakage of a conductive operating medium such as water is avoided.

An electric water heater with a computing device used to heat water from a residential or industrial water tank while executing useful computational tasks for a network. It includes a water tank, a heat exchanger, a computing device, a connectivity system to connect the computing device to a network, the network supplying computing tasks to the computing device, such that running the computing tasks results in a heat production, and a temperature control system to control the heat production from the computing device responsive to the water and heat exchanging fluid temperatures. The computational tasks are defined by one or more network user.

A reliable, leak-tolerant liquid cooling system with a backup air-cooling system for computers is provided. The system may use a vacuum pump and a liquid pump and/or an air compressor in combination to provide negative fluid pressure so that liquid does not leak out of the system near electrical components. Alternatively, the system can use a single vacuum pump and a valve assembly to circulate coolant. The system distributes flow and pressure with a series of pressure regulating valves so that an array of computers can be serviced by a single cooling system. The system provides both air and liquid cooling so that if the liquid cooling system does not provide adequate cooling, the air cooling system will be automatically activated. The heat may be removed from the building efficiently with a cooling tower. A connector system is provided to automatically evacuate the liquid from the heat exchangers before they are disconnected. Various turbulators are also provided, as well as a system and method for optimizing the heat transfer characteristics of a heat exchanger to minimize total energy requirements.

Embodiments are disclosed of an apparatus multiple information technology (IT) units arranged into an IT cluster. Each IT unit includes an IT container paired with a corresponding cooler. The IT cluster includes first and second rows, each row having an upstream end and a downstream end and including one or more IT units positioned adjacent to and abutting each other. The cooler of each IT unit in each row is either fluidly coupled by an intra-row fluid connection to the IT container of the next downstream IT unit in the same row or is fluidly coupled by an inter-row fluid connection to the IT container of an IT unit in the second row. The cluster includes at least one pair of inter-row fluid connections, so that the pair of inter-row fluid connections, the intra-row fluid connections in the first row, and the intra-row fluid connections in the second row, form at least one fluid loop within the IT cluster. The internal and external loop are arranged in different modular designs.

In one embodiment, a cooling system for buffering cooling capacity variations and heat load variations includes a buffering unit with a fluid container and a gas container; and a multi-way valve positioned between a fluid inlet and the buffering unit. The multi-way valve can operate to form multiple fluid loops, which include a fluid loop through the fluid container. When the cooling system in an under-provision period, the buffering unit can store a portion of fluid to the fluid container. When the cooling system is in an over-provision period, fluid stored in an under-provision period can be discharged from the fluid container due to gas pressure in the gas container reaching a threshold.

An apparatus, such as a power routing apparatus, includes an enclosure having first and second compartments having respective first and second opposing walls. A cooling structure is disposed between the first and second compartments and has a coolant passage defined therein configured to support a coolant flow in a direction parallel to the first and second opposing walls. First and second semiconductor switches (e.g., static switches) are disposed on the first and second walls on opposite sides of the coolant passage and are configured to be cooled by the coolant flow.

A module including a cooling unit that cools a heat-generating component provided on a substrate; a connection pipe that is connected to the cooling unit; and a fixation portion that is provided at a position at which stress from the connection pipe to the cooling unit is reduced, and that fixes the connection pipe.

Embodiments are disclosed of an apparatus multiple information technology (IT) units arranged into an IT cluster. Each IT unit includes an IT container paired with a corresponding cooler. The IT cluster includes first and second rows, each row having an upstream end and a downstream end and including one or more IT units positioned adjacent to and abutting each other. The cooler of each IT unit in each row is either fluidly coupled by an intra-row fluid connection to the IT container of the next downstream IT unit in the same row or is fluidly coupled by an inter-row fluid connection to the IT container of an IT unit in the second row. The cluster includes at least one pair of inter-row fluid connections, so that the pair of inter-row fluid connections, the intra-row fluid connections in the first row, and the intra-row fluid connections in the second row, form at least one fluid loop within the IT cluster. The internal and external loop are arranged in different modular designs.