A fluid phase change thermal management cooling method and apparatus for removing heat from a source of heat, the method comprising the steps of: filling a cooling chamber with volume V1 of a fluid phase change thermal management cooling apparatus with a fluid in its liquid phase; increasing the volume of the cooling chamber to volume V2 to va-pourise a portion of the fluid from its liquid phase to its vapour phase such that there is substantially only the fluid in its liquid phase and fluid in its vapour phase within the volume V2; allowing a dwell time that provides for at least some of the fluid in its liquid phase that has contact with a heated surface of the cooling chamber to be vaporised; and repeating the steps where timing of the steps and dwell time between steps is selected to control heat build-up within selected limits.

A liquid-submersible thermal management system includes a shell, a heat-generating component, a working fluid, and at least one heat-dispersing element. The shell defines an immersion chamber where the heat-generating component is located in the immersion chamber. The working fluid is positioned in the immersion chamber and at least partially surrounds the heat-generating component so the working fluid receives heat from the heat-generating component. The at least one heat-dispersing element is positioned on exterior surface of the shell to conduct heat from the shell into the heat-dispersing element.

The present application discloses a machine cabinet. In one embodiment, the machine cabinet comprises a housing, and an inner chamber, a liquid working medium accommodating area, a heat exchanger and a delivery passage disposed in the housing, wherein the inner chamber is in a vacuum state and configured to accommodate electronic devices to be cooled; the liquid working medium accommodating area is configured to accommodate a liquid working medium, the liquid working medium is converted into a gas working medium to enter the heat exchanger after cooling the electronic devices to be cooled; the heat exchanger is configured to liquefy the gas working medium into a liquid working medium and guide the liquid working medium obtained by liquefying the gas working medium into the delivery passage; and the delivery passage is connected with the heat exchanger and the liquid working medium accommodating area and is configured to guide the liquid working medium obtained by liquefying the gas working medium into the liquid working medium accommodating area. The embodiment eliminates the influence of the humidity, cleanness and the like to the electronic devices due to the air circulation, and thus lengthens the service life of the electronic devices.

Systems and methods to provide a prefabricated module design for heterogeneous data centers are described. An apparatus to provide cooling for an electronic rack of a data center comprises a plurality of lines. A main chassis is coupled to the plurality of lines. The main chassis is configured to be integrated on the electronic rack. An extension chassis is coupled to the main chassis. The extension chassis is configured to move relative to the main chassis. A plurality of connection ports are coupled to the extension chassis to provide connections between the electronic rack and one or more external sources. The plurality of connection ports are configured to move relative to the plurality of lines that are at fixed locations on the electronic rack.

A two-phase immersion type heat dissipation substrate is in contact with a heat generating element, and includes an immersion type heat dissipation base and at least one first and at least one second fin assembly that are formed on an upper surface thereof. The at least one first fin assembly is located directly above at least one high-temperature heat source area of the heat generating element, and the at least one second fin assembly is located directly above an area that is not the at least one high-temperature heat source area of the heat generating element. The at least one first and at least one second fin assembly include multiple first fins and multiple second fins, respectively. An arrangement density of the first fins is greater than that of the second fins, and a fin height of the first fins is greater than that of the second fins.

A two-phase fluid management system, may include a sealed container and a mobile condenser that moves within the sealed container. The sealed container may include a plurality of input ports, each to receive a two-phase fluid as vapor from a respective one of a plurality of IT enclosures and a plurality of output ports, each to return the two-phase fluid as liquid to the respective one of the plurality of IT enclosures. The mobile condenser may be coupled to or include an actuator to move the mobile condenser to a respective one of a plurality of positions within the sealed container. An air intake and air outlet of the mobile condenser may form a sealed connection with a pair of condenser ports when the mobile condenser moves to the respective one of the plurality of positions.

Systems, apparatuses and methods to provide a hybrid cooling for servers of a data center are described. A cooling plate comprises an inlet port to receive a coolant from a coolant source. The coolant is a two-phase coolant that transforms from a liquid state into vapor when being attached to an electronic device to extract heat from the electronic device. The cooling plate comprises an outlet port to output at least a portion of the coolant back to the coolant source. The cooling plate comprises a vapor port to output the vapor generated from the coolant to a condenser that is configured to condense the vapor back to the liquid state.

A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. Advantageously, a pH indicator is employed to monitor the dielectric fluid.

The embodiments of the present application provide a cooling system for data center based on a hyperbola cooling tower. The cooling system includes a compressor, a condenser, a primary fluorine pump, a secondary fluorine pump, a throttling apparatus, an evaporator, and a server. The server is configured to receive data information uploaded from the compressor, the condenser, the primary fluorine pump, the secondary fluorine pump, the throttling apparatus, and the evaporator, calculates the operation frequency of the compressor based on the data information, and control the condenser, the primary fluorine pump, the secondary fluorine pump and the throttling apparatus to transport the refrigerant to the evaporator.

A cooling module includes a first casing, a second casing, and a cooling unit. The first casing includes a lower chamber filled with at least one working fluid. The first casing includes a heat source connecting face. The second casing includes an upper chamber. The cooling unit is located between the first and second casings. The cooling unit includes a plurality of tubes. Each of the plurality of tubes includes an end intercommunicating with the lower chamber and another end intercommunicating with the upper chamber, thereby the lower and upper chambers intercommunicate with each other. A plurality of cooling fin units is coupled to outer peripheries of the plurality of tubes. An angle between each of the plurality of tubes and the heat source connecting face is larger than 0° and smaller than 90°, or each of the plurality of tubes is parallel to the heat source connecting face.