A cooling system comprises a container receiving a dielectric cooling liquid and electronic components immersed in the dielectric cooling liquid. A first pump causes a circulation of a first fraction of the dielectric cooling liquid in the container for convection cooling of the electronic components. A second pump withdraws a second fraction of the dielectric cooling liquid from the container and directs the second fraction of the dielectric cooling liquid toward the electronic components for direct cooling of the electronic components. A manifold fluidly connected to an outlet of the second pump receives the second fraction of the dielectric cooling liquid from the second pump. One or more outlet pipes fluidly connected to the manifold bring portions of the second fraction of the dielectric cooling liquid in thermal contact with the electronic components.

A thermal management system includes an auxiliary thermal management unit, the auxiliary thermal management unit includes a vapor inlet line, a liquid outlet line, and a phase change unit. The phase change unit includes a condenser and a compressor. The auxiliary thermal management unit includes a vapor buffer unit coupled between the vapor inlet line and the phase change unit. The auxiliary thermal management unit includes a liquid buffer unit coupled between the liquid outlet line and the phase change unit, where the auxiliary thermal management unit is to form a double-buffered vapor-liquid loop between the vapor inlet line and the liquid outlet line, where the vapor inlet line is coupled to a rack vapor return of an electronic rack to receive vapor and the liquid outlet line is coupled to a rack liquid supply of the electronic rack to supply cooling liquid.

The instant application pertains to new fluid level monitoring apparatus and a cooling system for computer components that employs the fluid level monitoring apparatus. In one embodiment, the liquid level measurement device comprises a load cell and a buoyancy element. The buoyancy element is configured to be partially submerged in the liquid phase. The load cell and the buoyancy element are operably connected such that a change in liquid volume may be determined using Archimedes' principle.

In one embodiment, a cooling system for buffering cooling capacity variations and heat load variations includes a buffering unit with a fluid container and a gas container; and a multi-way valve positioned between a fluid inlet and the buffering unit. The multi-way valve can operate to form multiple fluid loops, which include a fluid loop through the fluid container. When the cooling system in an under-provision period, the buffering unit can store a portion of fluid to the fluid container. When the cooling system is in an over-provision period, fluid stored in an under-provision period can be discharged from the fluid container due to gas pressure in the gas container reaching a threshold.

A high temperature electronic device thermal management system. Data centers contain many large racks of computer servers with electronic devices that generate heat. For the devices to function properly, they must not exceed a maximum temperature. Typical techniques for thermal management of data center electronics involve using sub-ambient temperature coolants via refrigeration cycles, requiring significant input energy to operate. The present thermal management system includes a flow management system to produce elevated coolant temperatures while sustaining safe device temperatures. This allows the coolant to reject to ambient temperatures globally and year-round, enabling reduced energy usage by no longer requiring refrigeration cycles. Further, operation at or above 55° C. would allow for implementation of additional waste heat recovery processes with increased energy efficiency.

A cooling assembly includes an evaporator containing a primary cooling medium, a passive condenser, and a heat exchanger. When a secondary cooling medium is provided to the heat exchanger, the primary cooling medium in the gas phase switches from being received by the passive condenser to the heat exchanger without operating any valves located between the evaporator and the passive condenser and between the evaporator and the heat exchanger. The primary cooling medium circulates between the evaporator and the passive condenser and between the evaporator and the heat exchanger by natural circulation and gravity without a pump in the flow path of the primary cooling medium between the heat exchanger and the evaporator and between the passive condenser and the evaporator to circulate the primary cooling medium.

An electronic rack liquid cooling system includes a rack manifold having a rack liquid supply line or channel and a rack liquid return line or channel. The liquid supply line is to receive first cooling liquid from a cooling liquid source and the liquid return line is to return first warmer liquid carrying the exchanged heat back to the cooling liquid source. The electronic rack further includes an array of server blades arranged in a stack therein. Each server blade includes one or more liquid cold plates associated with one or more information technology (IT) components. The electronic rack further includes a set of one or more liquid distribution units (LDUs) coupled between the rack liquid supply and return lines and the server blades. Each LDU includes a liquid supply port, a liquid return port, one or more pairs of supply sub-ports and return sub-ports, and a plate heat exchanger.

A modular cooling system for data center. An airflow section forms a duct for air flow and a plurality of core units are serially attached to each other and to the airflow section. A blower unit is attached to each of the core units. A plurality of motorized dampers are provided: between each of the core units and the airflow unit, in between each two core units, and between each core unit and its corresponding blower unit. A plurality of fluid ports are attached to each of the core units. At least one of the core units is loaded with one or more equipment selected from: air filter, humidifier, dehumidifier, heat exchanger, evaporator, condenser, chiller, computer room air conditioner (CRAC), dry cooler, a cooling tower or other types of cooling equipment. A combination operation of the components on the compartment and the cooling units enables fast deployment and operation.

Heat dissipation system, a power converter using such a heat dissipation system, and an associated method of thermal management of the power converter are disclosed. The heat dissipation system includes a condenser, a first cooling loop, and a second cooling loop. The first cooling loop is coupled to the condenser and includes a first two-phase heat transfer device. The second cooling loop is coupled to the condenser and includes a second two-phase heat transfer device. The condenser is disposed above the first and second two-phase heat transfer devices.

A charging device module for installation in an electrically driveable vehicle, including a charging device and an internal cooling circuit for cooling the charging device, wherein the internal cooling circuit has connections for connection to a superordinate cooling circuit of the vehicle, wherein the connections comprise at least one inlet and at least one outlet, and a bypass line connects the at least one inlet to the at least one outlet while bypassing the internal cooling circuit, wherein an actuable valve is associated with the at least one inlet, by which valve the flow of coolant through the internal cooling circuit and the bypass line can be controlled.