A container data center is provided. The data center is provided in a shipping container, and the container data center includes a cooling system including a plurality of cooling devices for cooling the data center; a power supply and distribution system including a power supply circuit for supplying power to the data center; and a control system electrically connected to the cooling system and the power supply and distribution system; wherein the control system comprises a plurality of control devices, the plurality of control devices each configured to control a part of the cooling devices, and when a first part of the plurality of control devices cannot work, a working mode of a second part of the control devices is adjusted to control the plurality of the cooling devices.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a plurality of in-rack coolant distribution units (IRCDUs) include a first IRCDU and a second IRCDU that are interchangeable within a rack depending on a type of coolant to be provided to a rack from a coolant distribution unit (CDU), so that a first IRCDU that is calibrated to a first coolant can distribute a first coolant and a second IRCDU that is calibrated to a second coolant can distribute a second coolant to a rack manifold of a rack.

An information processing apparatus includes a fan that cools a first processor, a dust-proof bezel that prevents dust from entering a casing, a memory, and a second processor coupled to the memory. The second processor is configured to measure a temperature of the first processor and an air volume of an air flow which passes through the dust-proof bezel, compare a registered air volume to the measured air volume when the temperature matches a registered temperature included in comparison information stored in the memory. The registered air volume being included in the comparison information in association with the matched temperature and the comparison information including a registered temperature of the first processor and a registered air volume of an air flow generated by the fan in association with each other. The second processor determines an abnormality in the dust-proof bezel based on a comparison result.

Technologies for allocating resources of managed nodes to workloads to balance multiple resource allocation objectives include an orchestrator server to receive resource allocation objective data indicative of multiple resource allocation objectives to be satisfied. The orchestrator server is additionally to determine an initial assignment of a set of workloads among the managed nodes and receive telemetry data from the managed nodes. The orchestrator server is further to determine, as a function of the telemetry data and the resource allocation objective data, an adjustment to the assignment of the workloads to increase an achievement of at least one of the resource allocation objectives without decreasing an achievement of another of the resource allocation objectives, and apply the adjustments to the assignments of the workloads among the managed nodes as the workloads are performed. Other embodiments are also described and claimed.

In some examples, a method includes: determining workload constraints for placement of information technology (IT) equipment within a data center; determining physical constraints for placement of the IT equipment; inferring hardware placement capabilities of IT equipment racks within the data center; and generating a ranked list of locations for IT equipment placement within the data center based on the determined workload constraints, determined physical constraints, and inferred hardware placement capabilities.

An immersion cooling system includes an electronic component, a thermally conductive dielectric liquid, and a tank defining a tank interior configured to receive the electronic component and the thermally conductive dielectric liquid for cooling the electronic component. The immersion cooling system also includes a wall positioned external to the tank to coordinate with the tank to define an overflow gap extending between the tank and the wall. The overflow gap is configured to receive an overflow of the thermally conductive dielectric liquid from the tank interior.

Embodiments are disclosed of a cooling apparatus with one or more cold plates, each adapted to be thermally coupled to a heat-generating electronic component on a piece of IT equipment. A fluid control module is mounted to the substrate and fluidly coupled to the cold plates. The fluid control module includes a fluid inlet with an inlet mechanism adapted to enable and disable the fluid inlet; the inlet mechanism enables the fluid inlet when energized and disables the fluid inlet when de-energized. The fluid control module also includes a fluid outlet with an outlet mechanism adapted to enable and disable the fluid outlet; the outlet mechanism enables the fluid outlet when energized and disables the fluid outlet when de-energized. A dedicated power supply is electrically coupled to the inlet mechanism and the outlet mechanism, and when the inlet mechanism is de-energized, the outlet mechanism is also de-energized after a delay.

Systems and methods for operating a datacenter are disclosed. In at least one embodiment, hybrid cooling unit is disclosed wherein an evaporative cooler is to provide a source of cooled air and a liquid heat exchanger is to provide a source of cooled liquid for cooling one or more electronic components, the hybrid cooling unit further including an air inlet to direct a flow of external air to remove heat from the evaporative cooler and the liquid heat exchanger.

A thermal management system includes a cooling unit, a condenser, and a processor. The processor is located within a server, and the system also includes a phase change cooling device in thermal communication with the processor, and in fluid communication with the condenser. The system also includes a single phase cooling device in thermal communication with the phase change cooling device, and in fluid communication with the liquid cooling unit. The system also includes a temperature sensor in thermal communication with the single phase cooling device, and a fluid pump to move fluid between the liquid cooling unit and the single phase cooling device. A TEC device may also be implemented between the phase change cooling device and the single phase cooling device.

In one embodiment, an immersion cooling system comprising one or more electronic devices submerged in a two-phase liquid coolant, a first cooling loop to provide cooling liquid to the immersion system, wherein the first cooling loop comprises a first condenser unit, a first liquid supply line, and a first vapor return line, and a second cooling loop to provide cooling liquid to the immersion system, wherein the second cooling loop comprises a second condenser unit, a second liquid supply line, and a second vapor return line. The apparatus further includes a first pressure sensor coupled to the first vapor return line, a second pressure sensor coupled to the second vapor return line and at least one main cooling source comprising a fluid control valve controlled based on the first pressure sensor and the second pressure sensor.