Systems, methods, and computer-readable media are disclosed for a systems and methods for improved LIDAR return light capture efficiency. One example method may include comparing, by a controller including a processor and at a first time, a first temperature of a first computing element to a first threshold temperature and a second temperature of a second computing element to a second threshold temperature. The example method may also include sending, based on a determination that the first temperature is below the first threshold temperature and the second temperature is above the second threshold temperature, a first signal to a switch to activate a data output corresponding to the second computing element. The example method may also include sending, to the second computing element, a second signal to cause a third computing element to increase heat dissipation from the third computing element to the first computing element. The example method may also include receiving, from the first computing element, a third temperature of the first computing element at a second time. The example method may also include comparing the third temperature of the first computing element to the first threshold temperature. The example method may also include determining that the third temperature of the first computing element is at or above the first threshold temperature at the second time. The example method may also include sending, based on a determination that that the third temperature is at or above the first threshold temperature, a third signal to the switch to activate a data output corresponding to the first computing element.

A sensing device for a vehicular sensing system includes a housing having a front housing portion and a metallic rear housing portion. A first printed circuit board and a second printed circuit board are disposed in the housing. The second printed circuit board is electrically connected to the first printed circuit board, which has an electrical connector for electrically connecting the sensing device to a vehicle wire harness. The second printed circuit board has circuitry thereat, with the circuitry generating heat when the sensing device is operating. The rear housing portion comprises a thermally conductive element that extends through an aperture of the first printed circuit board and is thermally coupled at the second printed circuit board. The thermally conductive element conducts heat generated by the circuitry of the second printed circuit board to the rear housing portion to dissipate the heat from the sensing device.

An in-vehicle computing apparatus comprises a mainboard, a heat dissipation component, and a target printed circuit board (PCB). A system on chip (SOC) and a connection component are disposed on the target PCB. A side of the mainboard is attached to the heat dissipation component. The target PCB is located on a side of the heat dissipation component that faces away from the mainboard, and is detachably connected to the heat dissipation component by using the connection component.

A gyroscopic roll stabilizer comprises a gimbal having a support frame and enclosure configured to maintain a below-ambient pressure, a flywheel assembly including a flywheel and flywheel shaft, one or more bearings for rotatably mounting the flywheel inside the enclosure, a motor for rotating the flywheel, and bearing cooling system for cooling the bearings supporting the flywheel. The bearing cooling system enables heat generated by the bearings to be transferred through the flywheel shaft to a heat sink disposed within a cavity in the end of the flywheel shaft, or to a liquid coolant circulating within the cavity.

Air in a thermally insulated space, which has been expanded by heat resulting from heating treatment for curing a thermosetting potting material, is prevented from entering the potting material. A casing has a partition wall that partitions an opening into a heat-generating-electronic-component placement section, where a heat generating electronic component is placed, and an adjacent section that is adjacent to the heat-generating-electronic-component placement section, when a heat releasing member is fixed to the opening. The heat-generating-electronic-component placement section is filled with a thermosetting potting material for moisture prevention up to a height which allows at least the heat generating electronic component to be buried in the potting material. The adjacent section has in the casing a communicating portion that communicates with a position which is apart from the heat-generating-electronic-component placement section filled with the potting material.

The present invention provides an electricity storage unit in which the influence of noise from a circuit portion can be suppressed, and the circuit portion and a power storage element can be consolidated. The electricity storage unit includes a circuit portion on which an electronic component is mounted, power storage elements, and a holding member that holds the power storage elements. The holding member includes an electrically conductive shield wall portion between the circuit portion and the power storage elements, and the shield wall portion shields noise generated by the circuit portion. The electricity storage unit may further have an electrically conductive heat dissipation member that dissipates heat from the circuit portion.

The objective of the present invention is to provide an electronic control device with which it is possible to improve the flow of hot water, during molding, between openings through which connectors penetrate, in a case of an electronic control device, the size of which has increased as a result of an increase in the level of functionality of the electronic control device, while suppressing deformation of said case. There are at least three connectors. At least three openings through which the connectors are inserted are provided in one plane in a case. A printed circuit board is housed inside the case, and the connectors are electrically connected thereto. The third opening is disposed between the first opening and the second opening. The third opening is disposed in a position furthest from a center C of a plane, in the longitudinal direction of the case.

A method and apparatus for heat-dissipation in an avionics chassis can include a housing having an outer surface, defining an exterior of the housing, an inner surface, defining an interior of the housing, and a set of walls at least partially separating the exterior of the housing from the interior of the housing, a heat generating component located within the interior of the housing, and a thermal plane thermally coupled to the heat generating component and configured to direct heat away from the heat generating component.

An electronic control device includes a heating element, a substrate, and a housing. The heating element includes an electronic component. The heating element is mounted to the substrate. The substrate is fixed to the housing via a substrate fixing portion. The housing includes a plurality of projecting portions projecting to the substrate side from a reference surface. The plurality of projecting portions have mutually different heights from the reference surface. The reference surface is a surface opposing the substrate and a reference of a height of the housing. The projecting portion highest in the height from the reference surface among the plurality of projecting portions is in contact with a surface of the substrate via a heat dissipation member. The surface of the substrate is on an opposite side of a surface where the heating element is mounted.

This power conversion device for a railway vehicle includes a first radiation fin radiating heat from a semiconductor device and a second radiation fin arranged at a prescribed interval from the first radiation fin in a traveling direction for radiating heat from the semiconductor device. At least either one of the first and second radiation fins includes an air duct formed by partially not providing a plurality of fin portions.