The present disclosure provides a cooling system. The cooling system includes: a first set of fans mounted on an inward-facing side of an air inlet on an outer shell of a case; a second set of fans mounted on an inward-facing side of an air outlet on the outer shell of the case, for generating, in cooperation with the first set of fans, a high-pressure airflow from the air inlet to the air outlet; a first heat sink connected to heat generating component in the case, for absorbing heat from the heat generating component and transferring the absorbed heat to a second heat sink; and the second heat sink mounted on an inward-facing side of the second set of fans and cooled by the high-pressure airflow.

A sensor assembly for a vehicle includes a base, a sensor body mounted to the base and rotatable relative to the base around an axis in a direction of rotation, and a cover. The sensor body includes a sensor window and a wall having heat fins elongated circumferentially relative to the axis. The cover is positioned to cover the heat fins. The cover includes an inlet open in the direction of rotation. The cover defines an airflow path from the inlet through the heat fins. The cover includes an outlet positioned to direct air across the sensor window.

An electronic control device includes a first circuit board having a first mounting surface on which a first electronic component is mounted, a second circuit board having a second mounting surface on which a second electronic component is mounted, and a base member disposed between the first mounting surface and the second mounting surface so as to face the first electronic component and the second electronic component, where a first heat-conducting material is disposed between the base member and the first electronic component, a second heat-conducting material is disposed between the base member and the second electronic component, the base member includes a first region that at least does not overlap the second circuit board when viewed in a line-of-sight direction normal to the first mounting surface and the second mounting surface, and a second region that overlaps both of the first circuit board and the second circuit board when viewed in the line-of-sight direction, a heat dissipation unit including a plurality of heat dissipation fins is provided in the first region of the base member, and a ventilation hole penetrating between the heat dissipation unit and an outside is provided in the second region of the base member.

In a housing of a vehicle control device are formed a suction port for taking outdoor air and a discharge port for discharging air taken in through the suction port. A flow passage that connects the suction port and the discharge port is formed inside the housing. A blocking member, a radiator, and a blower are provided in the flow passage. The blocking member is provided at a position where the blocking member faces at least a portion of an opening face of the suction port in the flow passage and a distance between the blocking member and the suction port is in a predetermined range.

An electronic device for a vehicle includes a substrate and a semiconductor package. The substrate is arranged to extend along a flowing path of wind produced by a fan unit. The semiconductor package is disposed on the substrate to be cooled by the wind. When an inflow port from which the wind is drawn by the fan unit is defined to include a flowing path having a first cross-section area, the semiconductor package is disposed in a space including a flowing path having a cross-section area that is larger than the first cross-section area.

An in-vehicle computing apparatus comprises a mainboard, a heat dissipation component, and a target printed circuit board (PCB). A system on chip (SOC) and a connection component are disposed on the target PCB. A side of the mainboard is attached to the heat dissipation component. The target PCB is located on a side of the heat dissipation component that faces away from the mainboard, and is detachably connected to the heat dissipation component by using the connection component.

An electrical vehicle (EV) connector includes a hybrid cooling system with a first cooling device for cooling a first portion of the connector in an area of effect of the first cooling device, and a second cooling device for cooling a second portion of the connector in an area of effect of the second cooling device. The first portion and the second portion are thermally connected to each other; and the area of effect of the first cooling device is configured for not overlapping or only insignificantly overlapping the area of effect of the second cooling device.

A method and apparatus for heat-dissipation in an avionics chassis can include a housing having an outer surface, defining an exterior of the housing, an inner surface, defining an interior of the housing, and a set of walls at least partially separating the exterior of the housing from the interior of the housing, a heat generating component located within the interior of the housing, and a thermal plane thermally coupled to the heat generating component and configured to direct heat away from the heat generating component.

This power conversion device for a railway vehicle includes a first radiation fin radiating heat from a semiconductor device and a second radiation fin arranged at a prescribed interval from the first radiation fin in a traveling direction for radiating heat from the semiconductor device. At least either one of the first and second radiation fins includes an air duct formed by partially not providing a plurality of fin portions.

A cooling device for a railroad vehicle that cools a heat generating body housed in a storage box set on the floor of the railroad vehicle includes a heat conduction plate configuring a part of a side surface of the storage box, the heat generating body being mounted on one surface side of the heat conduction plate, a plurality of heat pipes inclined to project from the other surface side to an upper side of the heat conduction plate, a plurality of fins fixed to the plurality of heat pipes, and a cover that includes opening sections, and covers the cooling device. A total of areas of the opening sections located on the base side of the heat pipes is formed larger than a total of areas of the opening sections located on the distal end portion side of the heat pipes.