In at least one embodiment, the liquid circulation system comprises a rotor located within a tank, a stator having a plurality of coils outside the tank, and an exterior tank wall that is non-magnetic and that is located next to the rotor and between the rotor and the stator,
wherein an axis (R) of rotation of the rotor is in parallel with the exterior tank wall, the coils of the stator are arranged along the axis (R) of rotation of the rotor so that the rotor is configured to be rotated by the stator in a touchless manner through the exterior tank wall by means of a varying electromagnetic field driven by the stator to circulate a liquid within the tank.

An electronic module is provided with a housing with a base and walls extending transversely from the base. The housing comprises an inlet port and an outlet port formed through the walls. A circuit board assembly is supported by the housing and includes electronics that generate heat during operation. A cold plate is mounted to the walls of the housing to define a manifold. The housing and the cold plate are in thermal communication with the circuit board assembly for transferring heat generated by the electronics. A baffle is disposed within the manifold for directing coolant flow. Elastic material is disposed over a distal end of the baffle and adapted to engage a lower surface of the cold plate in an interference fit to block coolant leakage.

A cooling system for a capacitor may include a housing for the capacitor, the housing comprising of a bottom surface, a top surface, and at least one side surface connecting the bottom surface and the top surface, the housing further including: a bottom inlet manifold and a bottom outlet manifold extending along the bottom surface; an inlet side channel extending along the side surface, the inlet side channel being in fluid communication with the bottom inlet manifold; an outlet side channel extending along the side surface, the outlet side channel being in fluid communication with the bottom outlet manifold; a top inlet manifold extending along the top surface, the top inlet manifold being in fluid communication with the inlet side channel; and a top outlet manifold extending along the top surface, the top outlet manifold being in fluid communication with the outlet side channel.

Design and packaging of wide bandgap (WBG) power electronic power stages are disclosed herein. An example apparatus includes a first printed circuit board (PCB) including: a first voltage phase circuit cluster; a second voltage phase circuit cluster; and a cluster of traces, the cluster of traces routed substantially perpendicular to the second voltage phase circuit cluster; a second PCB positioned below the first PCB; and a connector to connect the first PCB to the second PCB, the connector electrically coupled to the first voltage phase circuit cluster by the cluster of traces.

In an electronic component cooling device, a cooler cools an electronic component, a coolant temperature acquisition unit acquires a temperature of a coolant, a coolant flow rate acquisition unit acquires the flow rate of the coolant, a heat loss estimation unit estimates a heat loss from the electronic component, and a loss threshold calculation unit calculates an upper limit threshold of the heat loss from the electronic component based on the coolant temperature and the coolant flow rate. A coolant flow rate control unit controls the flow rate of the coolant and is configured to, in response to an estimated heat loss which is the heat loss from the electronic component that has been estimated by the heat loss estimation unit exceeding the upper limit threshold, increase the flow rate of the coolant circulating through the cooler.

A cooling device for cooling a plurality of electronic components mounted on a circuit board. The device includes a contact sheet shaped for conforming to the plurality of electronic components and comprising a mating face for mating against the plurality of electronic components and a cooled face. An enclosure is mounted to the cooled face and defines a coolant transport circuit for circulating coolant liquid therethrough. A coupling may be provided for biassing the mating face toward the plurality of electronic components.

An electronic control unit (ECU) with separable cooling and memory modules is described. The cooling module has an integrated liquid-cooling circuit with a direct connection to the cooling circuit. The memory module includes an independent memory that can store data and be tested independent of the cooling module. The cooling module and the memory module contact at thermal-contact surfaces to enable cooling when installed in a vehicle. In this way, the cooling module may provide cooling through the thermal-contact surface to one or more memory modules and the memory module may be implemented without an internal cooling system.

In various embodiments, a cooling assembly includes a heat-generating device, a metal inverse opal (MIO) layer, a shared coolant reservoir, a passive heat exchange circuit, and an active heat exchange circuit. The MIO layer is bonded to the heat-generating device. The shared coolant reservoir contains a coolant fluid. The passive heat exchange circuit directs coolant fluid from the shared coolant reservoir through the MIO layer and back to the shared coolant reservoir. The active heat exchange circuit includes a pump and a heat exchanger, wherein the active heat exchange circuit draws the coolant fluid from the shared coolant reservoir through the heat exchanger and returns the coolant fluid to the shared coolant reservoir.

A motor drive architecture is provided. The motor drive architecture includes a three-dimensional (3D) stack of cold plates on which power electronic components for an electric machine are mountable and supporting structures. Each cold plate has an annular shape with internal fluid pathways. The supporting structures hold the cold plates in the 3D stack. At least one supporting structure defines an internal cavity bifurcated into an internal inlet fluid pathway configured to direct fluid into the internal fluid pathways of each cold plate and an internal outlet fluid pathway receptive of the fluid from the internal fluid pathways of each cold plate.

Disclosed herein are power electronics assemblies which include a printed circuit board (PCB) having a plurality of conductive layers and a cold plate contacting the PCB. The cold plate includes a manifold constructed from an electrically insulating material and including a first cavity and a second cavity. The cold plate further includes a first heat sink positioned in the first cavity and thermally coupled to the plurality of conductive layers. The cold plate further includes a second heat sink positioned in the second cavity and thermally coupled to the plurality of conductive layers.