An integrated power electronic package includes a cold plate having a microcontroller, driver circuit, and power module embedded within a top surface of the cold plate. A 3D-printed circuit board is printed on and/or around the microcontroller, driver circuit, and power module to create electrical connections between the components. Additional electrical components are mounted to the 3D-printed circuit board to form the integrated power electronics package. The cold plate further includes a hollow interior recess having a plurality of fins. The plurality of fins have varying densities to allow targeted cooling of the microcontroller, driver circuit, and power module embedded in the cold plate.

A power electronics assembly may include a power electronics device, a packaging assembly, a thermal management system, and an emitter. The packaging assembly supports power electronics device. The thermal management system supports the packaging assembly and includes a thermal plate to deliver coolant for thermally communicating with the device. The thermal plate defines a channel with a wall. The emitter is arranged with the wall to form a peristaltic pump to adjust a cross-sectional area of the channel to control a flow of coolant therethrough. A membrane may be partially secured to the wall and include one of dielectric particles or magnetic particles. The emitter may selectively output one of a voltage, an electric field, or a magnetic field to impart a force on the particles to move the membrane and adjust the cross-sectional area of the channel to control a flow of coolant therethrough.

A vehicle, a vehicle power electronics assembly, and a method of packaging and cooling an inductor assembly are provided. The vehicle has a vehicle electrical system with a variable voltage converter (VVC) and an inductor assembly. The inductor assembly has a core and a winding. A bobbin is connected to and surrounds an outer perimeter of the inductor assembly. The bobbin defines an inlet, an internal fluid passage, and a series of nozzles. The nozzles in the series of nozzles are spaced apart from one another about the bobbin and are positioned to spray fluid directly onto the winding. A fluid system is connected to the inlet to provide pressurized fluid to the inlet.

An immersion cooled electronic arrangement includes a sealed housing, a coolant contained within the housing, and an electronic device submerged within the coolant. An agitator is disposed within the housing to control passive heat transfer between the electronic device and the coolant. An immersion cooling system and related method are also described.

A cooling device for cooling electronic components mounted on a circuit board. The device comprises a hollow body defining a coolant transport circuit for circulating coolant fluid there thorough. The hollow body comprises a plurality of flattened regions linked by duct regions, wherein the flattened regions and duct regions are formed as continuous regions of the body. When the body is secured to the circuit board, each flattened region is configured to align with one or more electronic components for transferring heat away.

A control unit for use in the engine compartment or in the transmission of a motor vehicle. The control unit has a line section for an engine or transmission fluid, a circuit carrier, and a base plate. The base body is mounted on the base plate. The circuit carrier is arranged between the base body and the base plate. The base body has a plurality of parallel channels each having a respective outlet. At least one of the plurality of parallel channels forms a portion of the line section. A separate cover is mounted on the base body, the cover having a single inlet coupled to the plurality of parallel channels. The cover is, other than only the inlet, connected to the base body in a fluid-tight manner, and the inlet is the only fluid passage through the cover.

An electronic device for a motor vehicle, includes a first housing portion to receive one or more first electronic components, a second housing portion to receive one or more second electronic components, the second housing assembled with the first housing, and a coolant fluid inlet and a coolant fluid outlet, a coolant channel being provided in the electronic device for the coolant fluid flowing from the inlet to the outlet so as to cool all or part of the first electronic components and/or all or part of the second electronic components, said channel having, over most of the course thereof in the device, in particular over the whole of the course thereof in the device, a section perpendicular to the flow direction of the fluid which is: exclusively provided in the first housing portion or exclusively provided in the second housing portion.

A gyroscopic roll stabilizer comprises a gimbal having a support frame and enclosure configured to maintain a below-ambient pressure, a flywheel assembly including a flywheel and flywheel shaft, one or more bearings for rotatably mounting the flywheel inside the enclosure, a motor for rotating the flywheel, and bearing cooling system for cooling the bearings supporting the flywheel. The bearing cooling system enables heat generated by the bearings to be transferred through the flywheel shaft to a heat sink disposed within a cavity in the end of the flywheel shaft, or to a liquid coolant circulating within the cavity.

It is an object of the present disclosure to provide a non-aqueous coolant composition that is excellent in insulation property and has improved heat transfer characteristics. The embodiment is a non-water coolant composition that comprises at least one amine compound as a non-aqueous base. The amine compound is at least one selected from the group consisting of an aliphatic amine compound, an aromatic amine compound, an alkanolamine compound, an amido amine compound, an amine oxide compound, a heterocyclic amine compound, and an ether amine compound.

A semiconductor module comprising a semiconductor apparatus and a cooling apparatus, where: the semiconductor apparatus includes a semiconductor chip and a circuit board on which the semiconductor chip is mounted; and the cooling apparatus includes: a top plate on which the semiconductor apparatus is mounted; a jacket including a side wall connected to the top plate, a bottom plate connected to the side wall and facing the top plate, and a cooling pin fin extending in such a manner as to taper from the bottom plate toward the top plate, where at least the bottom plate and the cooling pin fin are integrally formed, and at least one of ends of the cooling pin fin is firmly fixed to the top plate; and a coolant flow portion defined by the top plate and the jacket and for flow of coolant.