An apparatus to cool electronics in an autonomous vehicle, where the autonomous vehicle includes significant computing power to receive data from on-board sensor, cellular data and user interactions and to navigate an environment to a predetermined location. The cooling system includes a radiator, fan, pump and cold plate. The cold plate is formed from two plates with extended surfaces that are mated together so that the cavities around the extended surfaces form a flow passage. The electronics processing the data and navigating are mounted on the outside surface of the cold plate.

Systems, methods, and computer-readable media are disclosed. An example coolant system can be configured in an autonomous vehicle. The system can include a first coolant loop configured with a first series of coolant hoses to communicate a first volume of coolant fluid between a first reservoir, a first coolant pump, a three-way heat exchanger, and a computer system heat exchanger and a second coolant loop configured with a second series of coolant hoses to communicate a second volume of coolant fluid between a second reservoir, a second coolant pump, the three way heat exchanger, and the computer system heat exchanger. The system can further include a third coolant loop configured with a third series of coolant hoses to communicate third volume of coolant fluid between the three-way heat exchanger and an engine heat exchanger of the vehicle.

A heat exchanger is described herein. Specifically, the heat exchanger contains plates configured to pass a heat transfer fluid therethrough. The plates are interconnected via features that are integrated into the plates. The heat exchanger also contains frames that are connected to the plates and configured to guide electrical components along an insertion axis such that heat generating surfaces of the electrical components are in contact with the plates on insertion. The heat exchanger is thereby configured to allow for reliable heat dissipation for a plurality of electrical components within a small space while allowing the electrical components to be easily installed and serviced.

This document describes inlet and outlet channels for a heat exchanger that provides a compact profile with consistent cooling performances among heat exchanger plates. For example, a manifold of a cooling system includes an inlet channel and an outlet channel designed to connect to multiple plates of a heat exchanger. The inlet and outlet channels include a junction portion, a connection portion, and a transfer portion. The junction portion includes opposing inclined contact surfaces that are inclined relative to a horizontal plane of the plates and mate with corresponding inclined contact surfaces of the plates. The connection portion accepts coolant hoses. The transfer portion is located between the junction portion and connection portions. The described channels of the manifold are especially useful for automotive applications that generally have tight assembly spaces.

A cooling system for an eco-friendly vehicle is provided. The system includes an electronic component cooling device that cools an electronic component of an eco-friendly vehicle and a battery cooling device that cools a battery installed within the eco-friendly vehicle. A connector connects the electronic component cooling device and the battery cooling device with each other.

The present disclosure relates to a cooling device for a power battery system, a power battery system for a vehicle comprising the cooling device, and a vehicle. The cooling device is disposed at a bottom of the power battery system and includes a chamber defined by a casing. The chamber includes: a first region where a liquid cooling plate assembly is disposed; and a second region sealingly separated from the first region and accommodating a piping system for coolant communication. The liquid cooling plate assembly extends from a bottom of the first region to a bottom of the second region, and the piping system is in fluid communication with a flow passage of the liquid cooling plate assembly. In the cooling device of the present disclosure, the piping system is all disposed outside the battery system. Thus, battery cells or high-voltage devices inside the battery system would not be affected even if the coolant leaks at the piping system, which greatly improves safety of the battery system.

Technologies for embedded and immersed heat pipes in automated driving system computers (ADSC) are described herein. In some examples, an ADSC can include one or more cold plates including one or more fluid channels, the one or more fluid channels being configured to circulate a first working fluid from a respective ingress point to a respective egress point; one or more processors coupled to the one or more cold plates; one or more heat pipes coupled to or embedded in the one or more cold plates and configured to collect heat from the one or more processors and transfer the heat away from the one or more processors via a second working fluid in the one or more heat pipes; and a chassis housing the one or more cold plates, the one or more processors, and the one or more heat pipes.

This application discloses a vehicle-mounted device comprising: a first temperature equalization board and a PCB are fastened inside a housing. The first temperature equalization board is close to a first inner wall of the housing. The PCB is close to a second inner wall of the housing. The first inner wall is opposite to the second inner wall. A first protrusion is disposed on a side that is of the first temperature equalization board and that is close to the PCB. A first heat pipe is disposed on a side that is of the first temperature equalization board and that is close to the first inner wall. A first heat emission component is disposed on a side that is of the PCB and that is close to the first temperature equalization board. A position of the first protrusion corresponds to a position of the first heat emission component.

A water-cooled heat dissipation device and an electrical device are provided. The water-cooled heat dissipation device includes a first water-cooled plate and a sealing plate. The first water-cooled plate includes a first water-cooled substrate and multiple first heat dissipation fins arranged on the first water-cooled substrate. The sealing plate includes a sealing plate substrate and multiple second heat dissipation fins arranged on the sealing plate substrate and each arranged between two first heat dissipation fins, and the water-cooled substrate is hermetically matched with the sealing plate substrate to form a water-cooled cavity for accommodating the first heat dissipation fins and the second heat dissipation fins. In the water-cooled heat dissipation device according to the present application, the second heat dissipation fins are provided on the sealing plate substrate, so as to increase the overall heat dissipation area of the water-cooled heat dissipation device.

Technologies for embedded and immersed vapor chambers in automated driving system computers (ADSC) are described herein. In some examples, an ADSC can include one or more cold plates including one or more fluid channels, the one or more fluid channels being configured to circulate a first working fluid from a respective ingress point to a respective egress point; one or more processors coupled to the one or more cold plates; one or more vapor chambers coupled to or embedded in the one or more cold plates and configured to collect heat from the one or more processors and transfer the heat away from the one or more processors via a second working fluid in the one or more vapor chambers; and a chassis housing the one or more cold plates, the one or more processors, and the one or more vapor chambers.