An electrical-circuit assembly includes an electrical-device and a heat-sink. The heat-sink has a base having a first-surface and a second-surface. The first-surface is in thermal communication with the electrical-device. The heat sink also has a lid having a third-surface and a fourth-surface. The third-surface faces toward the second-surface. The heat sink also has side-walls disposed between the base and the lid extending from the second-surface to the third-surface. The base, the lid, and the side-walls define a cavity. The heat sink also has a porous-structure extending from the second-surface toward the third-surface terminating a portion of the distance between the second-surface and the third-surface thereby defining a void between the porous-structure and the third-surface. The base, the side-walls, and the porous-structure are integrally formed of a common material. The porous-structure is characterized as having a contiguous-porosity network. The heat sink also has a heat-transfer-fluid disposed within the cavity.

An apparatus is described and includes a printed circuit board (PCB) including at least one connector on a first surface thereof; a cold plate connected to the first surface of the PCB. The cold plate includes at least one tube disposed in a first portion of the cold plate and at least one opening for receiving the at least one connector therethrough, the at least one opening disposed in a second portion of the cold plate. The apparatus further includes a housing including a lower housing portion for supporting the PCB and the cold plate such that the PCB is between the lower housing portion and the cold plate and an upper housing portion over the first portion of the cold plate. The second portion of the cold plate is exposed outside the upper housing portion when the upper and lower housing portions are fastened together.

A road vehicle with an electric drive comprising: at least one pair of drive wheels; a reversible electric machine, which can be connected to the drive wheels; an electronic power converter, which controls the electric machine; an electric energy storage system, which is connected to the electronic power converter; first power wirings comprising at least two first electric wires, which connect the electric machine to the electronic power converter; and second power wirings comprising at least two second electric wires, which connect the electronic power converter to the storage system; and a cooling system, which is thermally coupled to at least one power wiring in order to remove heat from the power wiring.

A thermal circuit having a main conveying direction for a thermal management system of an electrified vehicle, the thermal circuit including a main circuit with a main circuit first conduit portion having a first pump and a heat exchanger provided behind the first pump and a main circuit second conduit portion. The thermal circuit includes a partial circuit with a partial circuit first conduit portion having a second pump and a component arranged to be temperature-controlled behind the second pump and a partial circuit second conduit portion. The thermal circuit further includes a connecting valve connected to the main circuit first conduit portion or the partial circuit first conduit portion and the main circuit second conduit portion or the partial circuit second conduit portion for controlling a volume flow. The thermal circuit includes a first fluid connection connected to the connecting valve, and a second fluid connection.

This disclosure details a coolant distribution module as used in a thermal management systems for thermally managing electrified vehicle components. An exemplary coolant distribution module includes a module body including a plurality of inlet ports and a plurality of outlet ports, a first manifold valve encompassed within the module body, and a second manifold valve encompassed within the module body. The first manifold valve includes a plurality of first valve inputs wherein each first valve input is in communication with at least one inlet port of the plurality of inlet ports, and a plurality of first valve outputs wherein each first valve output is in communication with at least one outlet port of the plurality of outlet ports. The second manifold valve includes a plurality of second valve inputs wherein each second valve input is in communication with at least one inlet port of the plurality of inlet ports, and a plurality of second valve outputs wherein each second valve output is in communication with at least one outlet port of the plurality of outlet ports.

This application discloses a vehicle-mountable device comprising: a first temperature equalization board and a PCB are fastened inside a housing. The first temperature equalization board is close to a first inner wall of the housing. The PCB is close to a second inner wall of the housing. The first inner wall is opposite to the second inner wall. A first protrusion is disposed on a side that is of the first temperature equalization board and that is close to the PCB. A first heat pipe is disposed on a side that is of the first temperature equalization board and that is close to the first inner wall. A first heat emission component is disposed on a side that is of the PCB and that is close to the first temperature equalization board. A position of the first protrusion corresponds to a position of the first heat emission component.

An assembly for stacking a plurality of circuit boards of an electronics package is provided. The assembly may comprise a chassis structure, a first plurality of printed circuit board (PCB), and a second plurality of PCBs, where the second plurality of PCBs are configured to be coupled to connectors of the first plurality of PCBs that are accessible via connection access points in the chassis structure. The first plurality of PCBs is positioned on a first side of the chassis structure, and the second plurality of PCBs are positioned on a second side of the chassis structure. Positioning tolerancing of the second plurality of PCBs relative to the first plurality of PCBs is provided by the connectors of the first plurality of PCBs.

A thermal management device for dissipating heat from an electrical component includes a volume of working fluid configured to change from a liquid state to a vapor state in response to being heated by the electrical component. The thermal management device also includes a working fluid chamber configured to move the working fluid. The working fluid chamber includes an impermeable outer portion and a porous inner portion integrally formed with and connected to the impermeable outer portion. The inner portion is configured to move the working fluid when in the liquid state toward the electrical component. The impermeable outer portion is made of a first material and the porous inner portion is made of a second material. The first material is different from the second material.

Devices, systems, and methods for cooling an autonomous vehicle computing system are provided. A modular cooling device can include a cooling baseplate and one or more modular heat frames. The cooling baseplate can include at least one planar cooling surface, an inlet configured to receive a cooling fluid, an outlet, and at least one cooling channel coupled between the inlet and the outlet. The at least one cooling channel can be configured to allow the cooling fluid to flow between the inlet and the outlet and provide cooling to the at least one planar cooling surface. Each modular heat frame can be configured to house at least one autonomous vehicle computing system component, be coupled parallel to the at least one planar cooling surface, and transfer heat from the at least one autonomous vehicle computing system component housed by the modular heat frame to the cooling baseplate.

In each of a plurality of semiconductor element groups of a power converter, a second semiconductor switching element and a third semiconductor switching element are shifted from each other in a second direction such that at least a portion of fins with which the second semiconductor switching element overlaps as viewed in a direction orthogonal to surfaces of coolers is different from fins with which the third semiconductor switching element overlaps as viewed in the direction orthogonal to the surfaces of the coolers.