Patent classifications
H05K7/20881
THERMAL MANAGEMENT SYSTEM FOR A VEHICLE UTILIZING A MULTI-PORT VALVE ASSEMBLY
A thermal management system and method for a vehicle, including: a heat-cold source thermal management circuit; an energy storage system thermal management circuit; a power electronics thermal management circuit; and a multi-port valve assembly coupled to the heat-cold source thermal management circuit, the energy storage system thermal management circuit, and the power electronics thermal management circuit and adapted to, responsive to an operating state of the vehicle, selectively couple and isolate the heat-cold source thermal management circuit, the energy storage system thermal management circuit, and the power electronics thermal management circuit to and from one another.
Cooling system
The present disclosure provides a cooling system. The cooling system includes: a first set of fans mounted on an inward-facing side of an air inlet on an outer shell of a case; a second set of fans mounted on an inward-facing side of an air outlet on the outer shell of the case, for generating, in cooperation with the first set of fans, a high-pressure airflow from the air inlet to the air outlet; a first heat sink connected to heat generating component in the case, for absorbing heat from the heat generating component and transferring the absorbed heat to a second heat sink; and the second heat sink mounted on an inward-facing side of the second set of fans and cooled by the high-pressure airflow.
Methods and apparatus for controlling the environment of electronic systems in vehicles
According to one aspect, an apparatus includes a first system that generates heat, and a cooling arrangement. The cooling arrangement cools the first system, and includes a coolant source and a distribution arrangement. The coolant source provides a coolant in a first state that is distributed by the distribution arrangement to absorb the heat. The cooling arrangement includes a control arrangement and a heating arrangement. The control arrangement maintains the coolant in the first state at least a set point, the set point being a temperature that is above a dew point, by determining when to activate the heating arrangement to warm the coolant in the first state and, when it is determined by the control arrangement that the heating arrangement is to be activated, activating the heating arrangement to warm the coolant in the first state to maintain the temperature of the coolant at the set point.
EV Charging Connector and EV Charging Station
An electrical vehicle (EV) connector includes a hybrid cooling system with a first cooling device for cooling a first portion of the connector in an area of effect of the first cooling device, and a second cooling device for cooling a second portion of the connector in an area of effect of the second cooling device. The first portion and the second portion are thermally connected to each other; and the area of effect of the first cooling device is configured for not overlapping or only insignificantly overlapping the area of effect of the second cooling device.
THERMAL CAPACITANCE SYSTEM
A system for cooling electronics includes at least two modular thermal energy storage cards stacked in one of a horizontal or a vertical stack, where the stack provides cooling to a portion to electronics. The cards include: a thermally conductive enclosure bounding an interior cavity, a cell wall structure that includes cells disposed within the interior cavity and in thermal communication with the thermally conductive enclosure, a phase change material having a melting point where the phase change material disposed within the cells and in thermal communication with cell walls of the cells, and a thermally conductive interface disposed between the thermally conductive enclosure and a portion of the electronics that includes a heat generating surface. The thermally conductive interface extends from the interior cavity a distance beyond the interior cavity of the enclosure and is in contact with the heat generating surface.
Superconducting bulk cooling apparatus and cooling method for high-temperature superconducting magnetic levitation vehicle
The present invention discloses a superconducting bulk cooling apparatus and cooling method for a high-temperature superconducting magnetic levitation vehicle. The superconducting bulk cooling apparatus for the high-temperature superconducting magnetic levitation vehicle includes a refrigerating machine, a vacuum box and a Dewar tank. A condensing tank is arranged in the vacuum box, and the condensing tank is communicated with the Dewar tank through a nitrogen siphon pipe and a liquid nitrogen return pipe; a heat exchanger connected with the refrigerating machine is arranged in the condensing tank; and a flexible isolation pipe for thermally insulating and isolating the nitrogen siphon pipe and the liquid nitrogen return pipe is connected between the vacuum box and the Dewar tank. The present invention pumps the phase-change nitrogen out of the Dewar tank through a siphoning effect, so that the immersion cooling of high-temperature superconducting bulks is separated from the re-condensation of the nitrogen.
COOLING DEVICE FOR RAILROAD VEHICLE
A cooling device for a railroad vehicle that cools a heat generating body housed in a storage box set on the floor of the railroad vehicle includes a heat conduction plate configuring a part of a side surface of the storage box, the heat generating body being mounted on one surface side of the heat conduction plate, a plurality of heat pipes inclined to project from the other surface side to an upper side of the heat conduction plate, a plurality of fins fixed to the plurality of heat pipes, and a cover that includes opening sections, and covers the cooling device. A total of areas of the opening sections located on the base side of the heat pipes is formed larger than a total of areas of the opening sections located on the distal end portion side of the heat pipes.
ELECTRIC DEVICE AND ELECTRIC DEVICE MANUFACTURING METHOD
An electric device includes a case, an electric component that is provided in the case and has a main body section and a lead terminal extending from the main body section, the main body section being supported on the case, a circuit board that is provided in the case and has a connecting hole through which the lead terminal is inserted, and a guide member that has a guide hole positioned relative to the connecting hole, the lead terminal being disposed to penetrate through the guide hole.
IMMERSION COOLING SYSTEMS AND METHODS
An immersion cooled electronic arrangement includes a sealed housing, a coolant contained within the housing, and an electronic device submerged within the coolant. An agitator is disposed within the housing to control passive heat transfer between the electronic device and the coolant. An immersion cooling system and related method are also described.
Thermal management system for tightly controlling temperature of a thermal load
A thermal management system for tightly controlling temperature of a thermal load (e.g., onboard an aircraft) includes: a pressurized tank for storing an expendable coolant; a control valve downstream of the pressurized tank for controlling a flow rate of the expendable coolant; a heat exchanger downstream of the control valve for transferring heat from a thermal load to the expendable coolant at a predetermined temperature; a back pressure regulator (BPR) downstream of the heat exchanger, the BPR having a set point controlled to maintain the expendable coolant at the predetermined temperature in the heat exchanger; optionally, a sensor or orifice downstream of the heat exchanger for determining vapor quality at an exit of the heat exchanger; and a system exit downstream of the BPR for removing some or all of the expendable coolant from the thermal management system after transferring heat from the thermal load to the expendable coolant.