A thermal energy management system for an electrified vehicle component includes an electronic component, a heat sink, and at least one heat pipe configured to communicate thermal energy from the electronic component to the heat sink to cool the electronic component.

A coolant for cooling an electrical/electronic element by direct immersion cooling, comprising a partially fluorinated ether with the structure (of compound 1) wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4 are independently selected from the group CF.sub.3, alkyl, fluoroalkyl, perfluoroalkyl, haloalkyl perfluorohaloalkyl.

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A passive cooling system for aircraft electronics includes an electronics chassis having a chassis exterior and defining a chassis interior; a heat spreader having a body located in the chassis interior; a heatsink located in the chassis interior; a cold plate operably coupled to the electronic chassis and thermally coupled to the heatsink; a first plurality of heat pipes thermally coupled with the cold plate; and a second plurality of heat pipes thermally coupling the heatsink with the heat spreader.

The various implementations described herein include methods, devices, and systems for cooling a vehicular electronics system. In one aspect, a vehicular refrigerant system includes: (1) a refrigerant loop having a compressor configured to compress a refrigerant, a condenser configured to condense the compressed refrigerant, an expansion device configured to enable expansion of the condensed refrigerant, and a heat exchanger configured to transfer heat from a liquid coolant to the expanded refrigerant; (2) a liquid coolant loop configured to transfer heat from an electronics system via the liquid coolant; and (3) a controller configured to: (a) obtain operating data regarding the refrigerant, the liquid coolant, and/or the electronics system; and (b) adjust operation of the refrigerant loop and/or the liquid coolant loop based on the obtained operating data.

Technologies for embedded and immersed heat pipes in automated driving system computers (ADSC) are described herein. In some examples, an ADSC can include one or more cold plates including one or more fluid channels, the one or more fluid channels being configured to circulate a first working fluid from a respective ingress point to a respective egress point; one or more processors coupled to the one or more cold plates; one or more heat pipes coupled to or embedded in the one or more cold plates and configured to collect heat from the one or more processors and transfer the heat away from the one or more processors via a second working fluid in the one or more heat pipes; and a chassis housing the one or more cold plates, the one or more processors, and the one or more heat pipes.

Various technologies described herein pertain to a sensor for an autonomous vehicle that includes one or more heat dissipation features. A sensor includes a top cover and a bottom cover, where the top cover and the bottom cover form at least a portion of a casing of the sensor. The sensor includes a coldplate, a first printed circuit board, and a second printed circuit board. A top side of the first printed circuit board is coupled to the top cover and a bottom side of the first printed circuit board is coupled to a top side of the coldplate. A top side of the second printed circuit board is coupled to a bottom side of the coldplate and a bottom side of the second printed circuit board is coupled to the bottom cover. Various features described herein enhance heat transfer from components on the first and second printed circuit boards.

A heat transport system includes: a two-phase closed loop heat pipe; a pump disposed in a liquid conduit or a vapor conduit of the loop heat pipe to exert a circulation drive force on a working fluid; a tilt sensor that detects a tilt of the loop heat pipe; and a controller configured to run the pump if the tilt is greater than a predetermined tilt threshold and stop the pump if the tilt is equal to or smaller than the tilt threshold.

The present invention discloses a superconducting bulk cooling apparatus and cooling method for a high-temperature superconducting magnetic levitation vehicle. The superconducting bulk cooling apparatus for the high-temperature superconducting magnetic levitation vehicle includes a refrigerating machine, a vacuum box and a Dewar tank. A condensing tank is arranged in the vacuum box, and the condensing tank is communicated with the Dewar tank through a nitrogen siphon pipe and a liquid nitrogen return pipe; a heat exchanger connected with the refrigerating machine is arranged in the condensing tank; and a flexible isolation pipe for thermally insulating and isolating the nitrogen siphon pipe and the liquid nitrogen return pipe is connected between the vacuum box and the Dewar tank. The present invention pumps the phase-change nitrogen out of the Dewar tank through a siphoning effect, so that the immersion cooling of high-temperature superconducting bulks is separated from the re-condensation of the nitrogen.

Example implementations relate to a leak mitigation system for a cooling system in a computing infrastructure. The leak mitigation system may include tank that is pre-pressurized, a valve unit fluidly coupled to the tank and a cooling loop, and controller operatively coupled to the valve unit. The cooling loop comprises one or more tubes to facilitate a flow of a coolant to cool one or more computing devices. The controller may detect a leak of the coolant from the cooling loop, and in response to detection of the leak of the coolant, the controller may operate the valve unit to establish a fluid coupling between the tank and the cooling loop to transfer at least a portion of the coolant away from the cooling loop.

This application discloses a vehicle-mounted device comprising: a first temperature equalization board and a PCB are fastened inside a housing. The first temperature equalization board is close to a first inner wall of the housing. The PCB is close to a second inner wall of the housing. The first inner wall is opposite to the second inner wall. A first protrusion is disposed on a side that is of the first temperature equalization board and that is close to the PCB. A first heat pipe is disposed on a side that is of the first temperature equalization board and that is close to the first inner wall. A first heat emission component is disposed on a side that is of the PCB and that is close to the first temperature equalization board. A position of the first protrusion corresponds to a position of the first heat emission component.