A sensor apparatus includes a sensor, a heat pipe, and a cover. The sensor includes a sensor housing. The sensor housing includes a sensor window oriented generally vertically and a top surface fixed relative to the sensor window above the sensor window and oriented generally horizontally. The heat pipe is fixed relative to the sensor, wherein the heat pipe is elongated from a first end to a second end, the first end is contacting the top surface, and the second end is spaced from the top surface. The cover covers the top surface and the heat pipe, and the cover is shaped to define a vertical gap between the top surface and the cover.

A sensor apparatus includes a sensor, a heat pipe, and a cover. The sensor includes a sensor housing. The sensor housing includes a sensor window oriented generally vertically and a top surface fixed relative to the sensor window above the sensor window and oriented generally horizontally. The heat pipe is fixed relative to the sensor, wherein the heat pipe is elongated from a first end to a second end, the first end is contacting the top surface, and the second end is spaced from the top surface. The cover covers the top surface and the heat pipe, and the cover is shaped to define a vertical gap between the top surface and the cover.

An electronic assembly includes a PCB disposed on an end-face of a motor proximate to a first surface thereof and a thermal management assembly (TMA) thermally connected to the PCB. One or more switching semiconductor devices are disposed on the first surface. The TMA includes a cooling jacket disposed around a circumference of the motor, at least one jacket manifold formed through the cooling jacket, a thermal compensation base layer thermally coupled to the cooling jacket and the one or more switching semiconductor devices, and a cooling manifold disposed through the PCB to form a fluid flow path therethrough. The at least one jacket manifold has a fluid inlet and a fluid outlet. Two or more electrically insulated posts, each having a cooling channel, are disposed between the at least one jacket manifold and the cooling manifold and form a fluid circuit between the fluid inlet and the fluid outlet.

Provided is a cooling apparatus including a vaporization unit in which a working fluid evaporates due to a heat source, and a condensation unit in which the evaporated working fluid is condensed, wherein the vaporization unit is divided into a first moving space and a second moving space by a partition wall, a first moving passage connecting the first moving space and the second moving space is formed in one region of the partition wall, and the working fluid introduced through the first moving space moves to the second moving space through the first moving passage to exchange heat.

A power electronics module includes an electrically-conductive substrate including a base portion defining a plurality of orifices that extend through the base portion, the plurality of orifices defining a plurality of jet paths extending along and outward from the plurality of orifices, and a plurality of posts extending outward from the base portion, where individual posts of the plurality of posts are positioned between individual orifices of the plurality of orifices, and a power electronics device coupled to the plurality of posts opposite the base portion, the power electronics device defining a bottom surface that is oriented transverse to the plurality of jet paths.

An energy-moving device (EMD) transfers heat between a low-temperature-rated device (LTRD) and a high-temperature-rated device (HTRD), wherein the LTRD is thermally separated from the HTRD such that the LTRD is not stacked above the HTRD. A temperature-controlling device (TCD) actively transfers heat between the LTRD and the EMD. An air-moving device (AMD) generates an air stream for transferring heat from the EMD to ambient air. A controller receives temperature information about the ambient air, the LTRD, and the HTRD; determines when heat should be removed from the LTRD, when heat should be added to the LTRD, and when no heat needs to be transferred to or from the LTRD; and determines a first voltage for the TCD and a second voltage for the AMD based on the received temperature information. And a neural network updates the voltage values based on how effectively the voltage values have performed.

Techniques are described for managing temperature in an autonomous vehicle. An exemplary method comprises performing autonomous driving operations that operate the autonomous vehicle in an autonomous mode, receiving one or more messages from a temperature sensor associated with an electrical device located on or in the autonomous vehicle while the autonomous vehicle is operated in the autonomous mode, determining a cooling technique to reduce the temperature of electrical device, and performing the cooling technique.

Two-phase cooling systems for autonomous driving super computers (ADSC) are described herein. In some examples, a two-phase cooling system can include a flow channel configured to circulate a flow; an evaporative heat exchanger comprising an inlet for receiving fluid from the flow channel and an outlet for releasing vapor generated from the fluid, the evaporative heat exchanger being configured to collect heat from components of the ADSC and transfer the heat away via the vapor released from the first outlet; a condensing heat exchanger configured to condense the vapor and remove latent heat associated with the vapor, the condensing heat exchanger comprising an inlet to the flow channel for receiving the vapor and an outlet to the flow channel for discharging fluid generated by condensing the vapor; and a pump configured to receive the fluid from the condensing heat exchanger and circulate the fluid to the evaporative heat exchanger.

An aircraft with a thermal management system and method of operating the thermal management system within an aircraft includes an avionics unit adapted to store at least one heat generating component, a first interface operably coupled to the avionics unit and thermally coupled to the at least one heat generating component; and a plurality of heat pipes, wherein a first end of the plurality of heat pipes is coupled to the first interface, defining a hot interface, and a second end of the heat pipes is coupled to the at least one of the fuselage, the wing, the skin, or the support structure.

Methods, systems, devices and apparatuses for a charging apparatus for a vehicle. The charging apparatus includes a first sensor configured to measure or detect a temperature of the electronic device. The charging apparatus includes at least one of a blower, a bypass valve or a vent configured to adjust the temperature of the electronic device or a surface of a charging pad. The charging apparatus includes a processor coupled to the first sensor and the at least one of the blower, the bypass valve or the vent. The processor is configured to determine that the temperature of the electronic device exceeds a first threshold temperature. The processor is configured to control the at least one of the blower, the bypass valve or the vent to increase or decrease the temperature of the electronic device or the surface of the charging pad.