Presented are electronic power module assemblies with direct-cooling vapor chamber systems, methods for making/using such power module assemblies, and vehicles equipped with such power module assemblies. A power module assembly includes an outer housing with an internal coolant chamber that circulates therethrough a coolant fluid. A power semiconductor switching device is mounted to the module's housing, separated from the coolant chamber and isolated from the coolant fluid. The power device selectively modifies electric current transmitted between a power source and an electrical load. A two-phase, heat-spreading vapor chamber device includes an outer casing with a casing segment that is mounted to the module housing, fluidly sealed to the internal coolant chamber and exposed to the coolant fluid. Another casing segment includes an inboard-facing casing surface that is mounted to an outboard-facing surface of the power device, and an outboard-facing casing surface mounted to an inboard-facing surface of the power device.

Technologies for embedded and immersed heat pipes in automated driving system computers (ADSC) are described herein. In some examples, an ADSC can include one or more cold plates including one or more fluid channels, the one or more fluid channels being configured to circulate a first working fluid from a respective ingress point to a respective egress point; one or more processors coupled to the one or more cold plates; one or more heat pipes coupled to or embedded in the one or more cold plates and configured to collect heat from the one or more processors and transfer the heat away from the one or more processors via a second working fluid in the one or more heat pipes; and a chassis housing the one or more cold plates, the one or more processors, and the one or more heat pipes.

Technologies for embedded and immersed vapor chambers in automated driving system computers (ADSC) are described herein. In some examples, an ADSC can include one or more cold plates including one or more fluid channels, the one or more fluid channels being configured to circulate a first working fluid from a respective ingress point to a respective egress point; one or more processors coupled to the one or more cold plates; one or more vapor chambers coupled to or embedded in the one or more cold plates and configured to collect heat from the one or more processors and transfer the heat away from the one or more processors via a second working fluid in the one or more vapor chambers; and a chassis housing the one or more cold plates, the one or more processors, and the one or more vapor chambers.

An electronic assembly includes a PCB disposed on an end-face of a motor proximate to a first surface thereof and a thermal management assembly (TMA) thermally connected to the PCB. One or more switching semiconductor devices are disposed on the first surface. The TMA includes a cooling jacket disposed around a circumference of the motor, at least one jacket manifold formed through the cooling jacket, a thermal compensation base layer thermally coupled to the cooling jacket and the one or more switching semiconductor devices, and a cooling manifold disposed through the PCB to form a fluid flow path therethrough. The at least one jacket manifold has a fluid inlet and a fluid outlet. Two or more electrically insulated posts, each having a cooling channel, are disposed between the at least one jacket manifold and the cooling manifold and form a fluid circuit between the fluid inlet and the fluid outlet.

Embodiments of the disclosure relate to apparatuses for enhanced thermal management of a planar inductor assembly. In one embodiment, a cooling package for an inductor assembly includes a cold plate and a heat-spreading bracket mechanically coupled to the cold plate at a first end of the heat-spreading bracket. The cold plate has a slotted recess for mounting a first inductor core along a first end thereof. The heat-spreading bracket is configured to apply a clamping force to a second inductor core at a second end opposite to the first end of the heat-spreading bracket.

A thermal management assembly may implement cooling techniques to cool at least a portion of a computer system with one or more cooling systems. The techniques may include using a thermal management assembly in fluid communication with the cooling system(s) to supply fluid from at least one of the cooling systems to at least a portion of the computer system. The techniques may also or instead include using a first thermal coupling to transfer thermal energy between the first cooling system and the computer system and a second thermal coupling to transfer thermal energy between the second cooling system and the computer system. Cooling a computer system using the cooling techniques described herein lowers an operating temperature of the computer system thereby mitigating heat related computer failure.

A thermal management assembly may implement cooling techniques to cool at least a portion of a computer system with one or more cooling systems. The techniques may include using a thermal management assembly in fluid communication with the cooling system(s) to supply fluid from at least one of the cooling systems to at least a portion of the computer system. The techniques may also or instead include using a first thermal coupling to transfer thermal energy between the first cooling system and the computer system and a second thermal coupling to transfer thermal energy between the second cooling system and the computer system. Cooling a computer system using the cooling techniques described herein lowers an operating temperature of the computer system thereby mitigating heat related computer failure.

The present disclosure relates to an electrical equipment cooling system for a vehicle. For this, an embodiment relates to an electrical equipment cooling system for a vehicle, in which a condenser 300 and a fan unit 400 are disposed to be tilted with respect to a direction in which a running wind is inhaled.

The present disclosure provides a cooling system. The cooling system includes: a first set of fans mounted on an inward-facing side of an air inlet on an outer shell of a case; a second set of fans mounted on an inward-facing side of an air outlet on the outer shell of the case, for generating, in cooperation with the first set of fans, a high-pressure airflow from the air inlet to the air outlet; a first heat sink connected to heat generating component in the case, for absorbing heat from the heat generating component and transferring the absorbed heat to a second heat sink; and the second heat sink mounted on an inward-facing side of the second set of fans and cooled by the high-pressure airflow.

A thermal management device for dissipating heat from an electrical component includes a volume of working fluid configured to change from a liquid state to a vapor state in response to being heated by the electrical component. The thermal management device also includes a working fluid chamber configured to move the working fluid. The working fluid chamber includes an impermeable outer portion and a porous inner portion integrally formed with and connected to the impermeable outer portion. The inner portion is configured to move the working fluid when in the liquid state toward the electrical component. The impermeable outer portion is made of a first material and the porous inner portion is made of a second material. The first material is different from the second material.