A power converter includes: a first circuit board; a cooling body; a housing, wherein the cooling body and the housing surround the first circuit board; a heat-generating component which is arranged on a side of the first circuit board facing the cooling body and which is coupled to the cooling body in a heat-conducting manner; and further components. The cooling body, the housing and the first circuit board border a first volume, in which the heat-generating component is arranged. The cooling body, the housing and the first circuit board border a second volume, in which the further components are arranged.

The resin material 336 is arranged in a first region 421 surrounded by the fin base 440, the inclined portion 343 of the cover member 340, and the outermost peripheral heat dissipation fins 334 arranged on the outermost peripheral side. Then, the resin material 336 is caused to protrude to the first region 421. That is, the resin material 336 is arranged in the first region 421. In a cross section perpendicular to the refrigerant flow direction (Y direction), a cross-sectional area of the first region 421 is larger than an average cross-sectional area 423 of the adjacent heat dissipation fins 331. Then, a cross-sectional area of a second region 422 formed between the resin material 336 arranged in the first region 421 and the outermost peripheral heat dissipation fin 334 arranged on the outermost peripheral side is smaller than the average cross-sectional area 423 of the heat dissipation fins.

An electronic device is disclosed. The electronic device includes a first electronic component, a first power regulator disposed above the first electronic component. The first power regulator is configured to receive a first power along a lateral surface of the first electronic component without passing the first electronic component and to provide a second power to the first electronic component. The electronic device also includes a passive component disposed in an electrical path between the first electronic component and the first power regulator.

A method includes attaching a power electronic substrate to a bottom of a frame. The frame has a box-like rectangular shape with an open top and an open bottom. The method further includes disposing an external conductive terminal on the frame. The external conductive terminal has at least one terminal stub that extends on to the front surface of the power electronic substrate. The method further includes welding the at least one terminal stub to at least one circuit trace disposed on the front surface of the power electronic substrate.

A power module includes a heat sink, a power unit formed at least partially inside the heat sink and/or on the heat sink and comprising a semiconductor element and a substrate, and a device designed to enclose the power unit and to center a control unit with respect to the power unit. The device includes a frame designed to surround the substrate at least partially, a first projecting section designed to engage in a recess or an opening of the heat sink, and a second projecting section designed to engage in a recess or an opening or a notch of the control unit and to have an outline which when viewed in cross-section is at least essentially star-shaped with at least a first leg, a second leg and a third leg.

A liquid cooled enclosure for transfer heat from a printed circuit board assembly (PCBA) which is disposed inside the liquid cooled enclosure is introduced. The liquid cooled enclosure includes a first cover structure, a cooler structure and a second cover structure. The cooler structure, which is mounted on the first cover structure, includes a hollow tube with a predefined shape pattern. The second cover structure includes an elastic pad that is disposed on a surface of the second cover structure. The PCBA is floatingly mounted on the elastic pad of the second cover structure, and the elastic pad is configured to push the PCBA toward the cooler structure such that heat from the PCBA is dissipated via the cooler structure.

A module includes a substrate, which has a polygonal shape in a plan view, an electronic component and an electronic component, which are mounted on a main surface of the substrate, and side electrodes, which are provided on at least two side surfaces of a plurality of side surfaces that form the polygonal shape of the substrate. A conductor film coupled to the electronic component and a conductor film coupled to the electronic component are provided on the substrate. The conductor film extends to reach a side surface of the at least two side surfaces to be coupled to a side electrode provided on the side surface. The conductor film extends to reach a side surface of the at least two side surfaces, which is different from the side surface, to be coupled to a side electrode provided on the side surface.

Electronic equipment includes a plurality of heat generating elements, a single heat sink, and a single cover. The heat generating elements are arranged adjacent to one another in a one-dimensional array in a predetermined alignment direction. The faces of the heat generating elements on one side are fixed directly or indirectly to the heat sink. The faces of the heat generating elements on the other side are in direct or indirect contact with the cover. The cover is fixedly screwed to the heat sink at opposite ends in the alignment direction on the outer side of the heat generating elements. The heat generating elements are sandwiched and held between the heat sink and the cover. This allows heat generated by the heat generating elements to be efficiently radiated via the heat sink and allows the heat generating elements to be easily connected to the heat sink.

A mechanical enclosure for a power converter is disclosed. In some embodiments, the mechanical enclosure comprises a base; a first compartment configured for receiving one or more electronic devices; and a second compartment configured for receiving a magnetic device, the second compartment formed by a cavity protruding from a bottom surface of the base.

A generator control unit (GCU) having thermal control includes a GCU housing having a first side and a second side. A printed wiring board (PWB) is within the GCU housing between the first side and the second side. The PWB includes a component side that faces a first side of the GCU housing. At least one through via is positioned through a thickness of the PWB. At least one boss is positioned on the component side of the PWB. The at least one boss extends from a component of the PWB to the first side of the GCU housing.