An electrical assembly may include a first contactor, a second contactor, a bus bar assembly electrically connected to the first contactor and the second contactor, a cooling member, a bracket configured to connect the cooling member to the first contactor and the second contactor, and/or potting material that may be disposed at least partially between the bus bar assembly and the cooling member. A method of assembling an electrical assembly may include disposing the first contactor and the second contactor on a fixture, connecting the bus bar assembly to the first contactor and the second contactor, connecting the bracket to the bus bar assembly, the first contactor, and/or the second contactor, connecting the cooling member to the bracket, and/or providing the potting material between the bus bar assembly and the cooling member.

Converter device configured to convert direct voltage and current into alternating voltage and current to be supplied to a load (L). The converter device comprises a bank (11) of capacitors (12), a plurality of power semiconductors (13), a heat sink (14) and a casing (15).

A power adapter includes a housing, an electronic assembly and a protective assembly. The housing has a receiving cavity, and the housing is provided with at least one heat dissipation hole penetrating to the receiving cavity. The electronic assembly comprises a plurality of electronic elements located in the receiving cavity. The protective assembly comprises a connection portion connected to an outer wall of the housing and extending outward, and a protective portion connected to an extension end of the connection portion, the protective portion is spaced apart from the housing. The projection of the protective portion toward the housing covers the heat dissipation hole. The protective portion of the power adapter may shield the heat dissipation hole to prevent external dust from falling into the receiving cavity through the heat dissipation hole. Heat dissipated by the electronic assembly may be dissipated out through the heat dissipation hole.

A semiconductor module including a cooling apparatus and a semiconductor device mounted on the cooling apparatus is provided. The cooling apparatus includes a cooling fin arranged below the semiconductor device, a main-body portion flow channel through which a coolant flows in a predetermined direction to cool the cooling fin, a first coolant flow channel that is connected to one side of the main-body portion flow channel and has a first inclined portion upwardly inclined toward the main-body portion flow channel, and a conveying channel that, when seen from above, lets the coolant into the first coolant flow channel from a direction perpendicular to the predetermined direction or lets the coolant out of the first coolant flow channel in the direction perpendicular to the predetermined direction.

The semiconductor device according to the present invention includes a semiconductor module, a cooling member, and a heat transfer member. The semiconductor module includes a switching element and a diode connected in antiparallel to each other. The heat transfer member is disposed between the semiconductor module and the cooling member so as to transfer heat generated by the switching element and the diode to the cooling member. The heat transfer member has a mounting surface on which the switching element and the diode are mounted side by side and a surface which is opposite to the mounting surface and is disposed in contact with the cooling member. In the heat transfer member, the thermal conductivity in a first direction parallel to the mounting surface is higher than the thermal conductivity in a second direction perpendicular to the mounting surface.

Provided is an electric power converter, including: a casing; a heat radiating plate having a first main surface and a second main surface; and a substrate which is fixed to the main surface and to which a heat generating component is mounted, wherein the casing has an inner wall surface in which a first tapered portion is formed, wherein the heat radiating plate includes a second tapered portion which is connected to the first tapered portion in a heat exchangeable manner and slid with respect to the first tapered portion, wherein the heat radiating plate is configured to be displaced in a first direction with respect to the casing by the second tapered portion being slid with respect to the first tapered portion, and wherein the heat generating component is connected to the casing in a heat exchangeable manner by the heat radiating plate being displaced in the first direction.

Methods, systems, and apparatuses for a power card for use in a vehicle. The power card includes an N lead frame, a P lead frame, and an O lead frame each having a body portion and a terminal portion. The O lead frame is located between the N lead frame and the P lead frame. The power card includes a first power device located between the N lead frame and the O lead frame, with a first side coupled to the body portion of the N lead frame and a second side coupled to the body portion of the O lead frame. The power card includes a second power device located between the O lead frame and the P lead frame, with a first side coupled to the body portion of the O lead frame and a second side coupled to the body portion of the P lead frame.

A converter comprises: a housing including an inner space; electronic components disposed in the inner space; a first pipe disposed on the outer surface of the housing and comprising a first-first pipe and a first-second pipe arranged in parallel to and spaced apart from each other; and a second pipe coupled at both ends thereof to the first-first pipe and the first-second pipe, respectively.

The heatsink cooling arrangement, fitted to cool a semiconductor component, is transferring heat to a backplate heatsink and secures a mechanical stabile assembly of PCBA, encapsulation, heatsink cooling arrangement to a backplate heatsink, which is fast and easy to assemble with usage of few- or no tools.

This power conversion device includes: a semiconductor power module including a module busbar; a capacitor module including a capacitor element, a capacitor case formed in a bottomed tubular shape and storing the capacitor element with sealing resin interposed therebetween and a capacitor busbar having one end electrically connected to the capacitor element and another end extending outward from the capacitor case and electrically connected to the module busbar; and a power conversion device case formed in bottomed tubular shape and storing the semiconductor power module and the capacitor module. An outer surface of a bottom wall of the capacitor case and an inner surface of a bottom wall of the power conversion device case are thermally connected to each other. The capacitor module has a heat dissipation member located toward an opening side of the capacitor case relative to the capacitor element and thermally connected to the sealing resin.