A double-sided cold plate includes a manifold comprising openings extending from a first surface of the manifold through the manifold to a second surface of the manifold forming recesses within the manifold and an inlet channel and an outlet channel fluidly coupled to the recesses within the manifold, a plurality of first heat sinks coupled to the first surface of the manifold enclosing the openings on the first surface, and a plurality of second heat sinks positioned adjacent each other along a length of the manifold and coupled to the second surface of the manifold, enclosing the openings on the second surface, a width of the plurality of second heat sinks is greater than a width of the manifold thereby forming an overhanging portion on each lengthwise side of the manifold, the overhanging portion configured to mechanically support a plurality of electrical components positioned around a perimeter of the manifold.

Various examples are provided for high voltage isolation. The isolation can be provided for discrete non-isolated devices using an electrically isolating substrate that is thermally conductive. In one example, a module includes a plurality of switching devices connected in series; one or more rubber buffer disposed between switching device pairs of the plurality of switching devices; and thermal interfaces disposed between switching devices of the switching device pairs and cooling surfaces of the module, the thermal interfaces electrically isolating the switching devices from the cooling surface. In another example, an extreme fast charger (EFC) station includes an active front end (AFE) module that includes at least one module, where the module is a half-bridge power module. The EFC station can include a dual-active-bridge (DAB) high voltage (HV) module that includes at least one module, where the module is a half-bridge power module.

A power distribution assembly is disclosed for use with at least one computer in a data centre. The power distribution assembly (11) comprises i) at least one controller (14) comprising at least one heat sensitive component (16) and ii) at least one cooling arrangement (17) comprising a casing (18) configured to contain a coolant (19). At least a portion of the coolant (19) is configured to come into contact with at least part of the controller (14) and/or at least one component for transferring heat away from the at least one controller (14)/component (16) towards at least one wall of the casing (18). This arrangement ensures that even in increased temperature data centres, there is provided consistent and reliable operation of heat sensitive components in smart power strips through dedicated cooling of the components (16).

A system includes a vessel, a cooling fluid in the vessel, and at least one power magnetics assembly in the vessel and immersed in the cooling fluid. The system further includes at least one heat sink having a surface in contact with the cooling fluid in the vessel and at least one power semiconductor device mounted on the at least one heat sink. The cooling fluid may be electrically insulating and the vessel may be sealed.

An isolated power converter and a hydrogen production system are provided. An electrical connection structure in the isolated power converter includes N secondary winding output bus bars, N rectifier circuit input bus bars, and a positive-negative bus bar, where N is greater than or equal to 1. A secondary winding may include M tapping points, and the secondary winding output bus bar and the rectifier circuit input bus bar that correspond to the secondary winding each include M copper bars that are insulated and stacked. The M tapping points of the secondary winding overlap the M copper bars of the secondary winding output bus bar at input ends of the M copper bars, respectively. The positive-negative bus bar includes two copper bars that are insulated and stacked.

An electrical device, e.g., an inverter or converter, includes a first and a second printed circuit board. The first printed circuit board includes protruding tab regions, and a respective tab region protrudes into a respective recess of the second printed circuit board. Contact pins, e.g., of one or more plug connector parts, protrude into holes of the second printed circuit board.

A heat sink is provided for a power inverter of an electric motor of a vehicle. The heat sink includes a coolant inlet, a coolant outlet, a first cooling segment and a second cooling segment. The heat sink also includes a coolant channel system for cooling one or more power modules A power inverter including the heat sink and a vehicle including the power inverter are also provided.

An on-board telematic device intended to be attached to a metal part (3) of a body of a motor vehicle comprises, according to the invention, a housing (1) integrating a printed circuit board (5), a face of which supports at least one electronic power component (6), a radiofrequency antenna (7), intended to extend through an opening of the metal part (3), and a metal screen (9) interposed between a lower part of the antenna (7), on the one hand, and the printed circuit board (5) and said at least one component, on the other hand, in order to isolate the antenna from parasitic emissions. The component (6) is placed in line with the metal screen (9) and in thermal contact with a portion of said screen, and said screen (9) is made of a thermally conductive material so as to form a thermal transfer means between the electronic power component (6) and the metal part (3).

An inverter apparatus of a mobility has a structure in which a power module and a cooler are stacked so that an overall size of the inverter apparatus is reduced, and the cooler is pressed by a cover so that the cooler and the power module are in contact with each other, increasing the cooling performance of the cooler.

A power converter includes semiconductor modules, a capacitor, a circuit board, a casing, a busbar and a shield layer. The capacitor is electrically connected to the semiconductor modules. The casing accommodates the circuit board, the semiconductor modules and the capacitor. The busbar has an input terminal portion, an output terminal portion and an electric pathway connecting the input terminal portion and the output terminal portion. The electric pathway is connected to at least one of electronic components including the semiconductor modules and the capacitor. The busbar has a built-in portion incorporated into the casing. The shield layer is electrically conductive and provided on an inner surface or an outer surface of the casing such that the shield layer covers the built-in portion.