A power converter includes a heat generator configured to generate heat through power conversion, and a case housing the heat generator. The case includes a case member that is made of resin and defines an opening, and a cooler that is made of metal and disposed to cover the opening. The cooler includes a cooling water passage for cooling the heat generator. The case member includes an upper case member that defines an upper opening to be covered by a cover member, and a lower case member that defines the opening covered by the cooler. One of the upper case member and the lower case member has an input side attachment portion to be attached to an input terminal and the other of the upper case member and the lower case member has an output side attachment portion to be attached to an output terminal.

A heat exchanger comprising a pair of metal plates joined along corresponding mating surfaces, wherein at least one of the metal plates comprises a plurality of connected recesses which form a fluid circuit between the plates when the plates are joined, wherein the fluid circuit comprises an inlet, an inlet manifold, an outlet, an outlet manifold, and a plurality of flowpaths extending between and fluidly connecting the inlet manifold and outlet manifold, and wherein one or more of the plurality of flowpaths comprise a fluid passage and a flow constriction and wherein a ratio of the hydraulic diameter of the flow constriction to the hydraulic diameter of the fluid passage increases with increasing distance from the inlet.

A heat dissipator includes a plate-shaped base portion that extends in a first direction along a direction where a refrigerant flows and in a second direction orthogonal to the first direction and has a thickness in a third direction, and fins that protrude from the base portion to one side in the third direction, extend in the first direction, are arranged in the second direction, and guide the refrigerant. A second of the fins is provided continuously on one side in the first direction that is a downstream side of a first of the fins, and a third fin that is provided continuously on another side in the first direction of the first fin, and includes an end on the one side in the third direction on the other side in the third direction.

The present invention generally relates to a modular microjet cooler. The modular microjet cooler may be attached to a packaged heat generating device that is mounted on a printed circuit board. The modular microjet cooler has an inlet allowing supply fluid to be directed through microjet nozzles toward an impingement surface on the packaged device. The modular microjet cooler also has one or more outlets that allow exhaust fluid to be removed. The modular microjet cooler is attached to the device after it has been packaged. Further, the modular microjet cooler may be attached to the packaged device either before or after it is mounted to the printed circuit board.

Motor vehicle comprising an electric motor for driving the motor vehicle and a power converter device for supplying an alternating current to the electric motor, the power converter device having a cooling device, and the cooling device comprising at least one coolant connection, which is fluidically connected to a coolant port of the electric motor to form a common cooling circuit.

An inverter apparatus of a mobility has a structure in which a power module and a cooler are stacked so that an overall size of the inverter apparatus is reduced, and the cooler is pressed by a cover so that the cooler and the power module are in contact with each other, increasing the cooling performance of the cooler.

A pulse inverter for operating an electric machine of a motor vehicle from a motor vehicle battery, including a housing for delimiting an interior, a power electronics system, provided in the interior of the housing, for converting direct current to alternating current, a first cooling circuit configured to dissipate heat from an outer side of the housing facing away from the power electronics system, and a second cooling circuit, which is separated from the first cooling circuit and communicates with the interior of the housing, configured to directly liquid-cool the power electronics system with an electrically insulating fluid. (FIG. 1)

An apparatus for measuring a flow of current through at least one electrical conductor of an electrotechnical device which is disposed in a cooling channel, wherein a non-conductive cooling medium flows through the cooling channel during operation of the electrotechnical apparatus, the apparatus including a flux conductor which is disposed around the at least one electrical conductor, and an evaluation circuit which is coupled to the flux conductor and is configured to determine the flow of current through the at least one electrical conductor by evaluating an electrical parameter of the flux conductor, wherein at least a part of the flux conductor is disposed in the cooling channel.

A cooling device for dissipating heat from articles to be cooled, such as power electronic modules, having at least one preferably rigid heat sink which consists in particular of solid material, preferably composed of metal, for example composed of aluminium, and which is intended to absorb heat from one or more articles to be cooled, and having a cooling fluid chamber for accommodating cooling fluid, in particular cooling liquid, to which the heat absorbed by the heat sink can be transferred. The cooling device has at least two preferably rigid heat sinks which consist in particular of solid material and which are connected to one another in an articulated manner, in particular by way of a heat sink joint, in such a way that the two heat sinks are movable relative to one another in different, in particular parallel planes.

An arrangement having a cooling device for dissipating heat from articles to be cooled which has at least one heat sink that has a heat absorption surface composed of metal and that is intended to absorb heat from one or more articles to be cooled, and also a cooling fluid chamber for accommodating cooling fluid to which the heat absorbed by the heat sink can be transferred, and having at least one article to be cooled which has a preferably planar heat emission surface composed of metal. To optimize the heat conduction between the heat sink and the article to be cooled, the heat absorption surface of the heat sink bears directly against the heat emission surface of the article to be cooled without an intermediate layer composed of air-displacing material, or, if necessary, with the use of an intermediate layer composed of air-displacing material that is thin.