An inverter system is provided, by which the magnitudes of currents flowing through inverter modules are substantially equal. The inverter system includes multiple inverter modules connected in parallel, where input terminals of all the multiple inverter modules are connected to a same direct current input bus, and output terminals of all the multiple inverter modules are connected to a same alternating current output bus. An input contact S1 of the direct current input bus and an output contact S2 of the alternating current output bus are such located that a difference between impedances of any two branches between S1 and S2 does not exceed a preset value.

A temperature adjustment circuit includes a first pump that circulates a heat medium in at least one of a first temperature adjustment circuit and a second temperature adjustment circuit; a coupling path that couples the first temperature adjustment circuit and the second temperature adjustment circuit to form a coupled circuit; a switching unit capable of switching between a circulation state in which the heat medium circulates in the coupled circuit and a non-circulation state in which the heat medium does not circulate in the coupled circuit; and a control device that controls the switching unit and the first pump. The control device switches the coupled circuit from the non-circulation state to the circulation state in a state in which a rotation speed of the first pump is decreased lower than a rotation speed of the first pump before switching, and increases the rotation speed of the first pump after switching.

The present invention discloses a two-phase immersion-cooling micro-grooved boiler, which is mainly used for heat dissipation of heat generating objects. The boiler comprises a heat transfer member and a capillary layer positioned in tight contact with a surface of the heat transfer member. The capillary layer has an array of micro-grooves which divides the capillary layer into a plurality of heat dissipating units. The bottom surface of the micro-grooves is coated with a thermal resistance layer. While the boiler operates, the working liquid can flow into the heat dissipating units from the sidewall of the micro-grooves without being blocked from contact with the heat transfer member by boiling-triggered bubbles. As a result, dry-out of the heat transfer member can be avoided, thereby improving the heat exchange efficiency of the boiler and the flow-back rate of the working fluid.

A system includes a power device unit coupled to a substrate. An upper cooling assembly is thermally coupled to an upper side of the substrate. A lower cooling assembly is thermally coupled to a lower side of the substrate. A gate driver unit is coupled to the upper cooling assembly. At least one upper via is formed through the upper cooling electrically coupling the gate driver unit to the power device unit. A capacitor unit is coupled to the lower cooling assembly. At least one lower via formed through the lower cooling assembly electrically coupling the capacitor unit to the power device unit.

A semiconductor device has a joint part in which a first conducting part and a second conducting part are joined by a joint material. The first conducting part has a high wettability region and a low wettability region in a surface opposite to the second conducting part. The low wettability region is adjacent to the high wettability region to define an outer periphery of the high wettability region and has wettability lower than the high wettability region to the joint material. The high wettability region has an overlap region overlapping a formation region of the joint part in the second conducting part in a planar view, and a non-overlap region connected to the overlap region and not overlapping the formation region of the joint part in the second conducting part. The non-overlap region includes a holding region capable of holding the joint material that is surplus for the joint part.

Thermal structures and, more particularly, improved thermal structures for heat transfer devices and spatial power-combining devices are disclosed. A spatial power-combining device may include a plurality of amplifier assemblies and each amplifier assembly includes a body structure that supports an input antenna structure, an amplifier, and an output antenna structure. One or more heat sinks may be partially or completely embedded within a body structure of such amplifier assemblies to provide effective heat dissipation paths away from amplifiers. Heat sinks may include single-phase or two-phase materials and may include pre-fabricated complex thermal structures. Embedded heat sinks may be provided by progressively forming unitary body structures around heat sinks by additive manufacturing techniques.

A two-phase cold plate includes an outer enclosure having a fluid inlet and a fluid outlet each fluidly coupled to a fluid pathway, an inner enclosure having a vapor cavity and a vapor outlet, and one or more wicking structures disposed in the outer enclosure. The one or more wicking structures fluidly couple the fluid pathway of the outer enclosure with the vapor cavity of the inner enclosure and the one or more wicking structures comprise a plurality of nucleation sites configured to induce vaporization of a cooling fluid and facilitate vapor flow into the vapor cavity of the inner enclosure.

A power electronics unit, a vapor compression system incorporating the power electronics unit, and a method of cooling a power electronics unit are provided. The power electronics unit includes a semiconductor portion and an inductor portion. Approximately 80% of the heat generated by the power electronics unit may be derived from the semiconductor portion. Approximately 20% of the heat generated by the power electronics unit may be derived from the inductor portion. The semiconductor portion is cooled using at least one fan. The inductor portion is cooled using a working fluid (e.g., a refrigerant). The working fluid may be provided from upstream of the evaporator in the vapor compression system. Limiting the use working fluid to only cool the inductor portion of the power electronics unit may minimize the impact of the power electronics unit on the vapor compression system.

A converter comprises: a housing; a plurality of heat generating elements arranged at one surface of the housing; and a fluid channel arranged at the other surface of the housing, wherein the fluid channel includes an inlet and an outlet which connect and pass through an outside and an inside of the housing, is formed by a single line from the inlet to the outlet, has a constant cross-sectional area, and is arranged at a position where the fluid channel overlaps the plurality of heat generating elements in a vertical direction.

A housing for an inverter includes circuit elements and a cooling system, wherein the housing has four openings and the cooling system includes two channels arranged in the housing, each of which is connected to two different openings, and a condenser is arranged below the housing, wherein two openings from different channels are connected for communication by means of a connecting element arranged outside the housing and the connecting element is of rigid design and extends past the side of the condenser.