A cooling device for a railroad vehicle that cools a heat generating body housed in a storage box set on the floor of the railroad vehicle includes a heat conduction plate configuring a part of a side surface of the storage box, the heat generating body being mounted on one surface side of the heat conduction plate, a plurality of heat pipes inclined to project from the other surface side to an upper side of the heat conduction plate, a plurality of fins fixed to the plurality of heat pipes, and a cover that includes opening sections, and covers the cooling device. A total of areas of the opening sections located on the base side of the heat pipes is formed larger than a total of areas of the opening sections located on the distal end portion side of the heat pipes.

A vapor chamber composed of a lower shell, an upper shell and a working fluid is revealed. The upper and lower shells made of metal composite plates are connected closely to form a vacuum sealed cavity which the working fluid is filled in. The metal composite plate includes a metal matrix and a copper layer bonded to a surface of at least one side of the metal matrix. The metal matrix includes stainless steel and an aluminum silicon carbide (Al/SiC) metal matrix composite. The copper layer of the metal composite plate is treated by stamping process to form a support member inside the cavity. Thus complicated, polluting and high cost etching process is no more required. Therefore the production efficiency is improved and the cost is reduced. The metal matrix of the metal composite plate provides sufficient structural strength.

A method for charging at least one electric energy accumulator of a motor vehicle, wherein electric energy from a charging station external to the motor vehicle is transferred via a detachable electrical connection to the energy accumulator, wherein a cooling fluid is taken from the charging station via a detachable cooling fluid connection to at least one cooling element of the motor vehicle, so that thermal energy from the energy accumulator is transferred via the cooling element to the cooling fluid and taken away by the cooling fluid, wherein the liquid cooling fluid is mixed with a gas before and/or during its transfer to the cooling element, so that a cooling fluid/gas mixture is formed, wherein at least a portion of the cooling fluid is evaporated into gas during the transfer of the thermal energy from the energy accumulator to the cooling fluid.

A power device comprises at least one power semiconductor module comprising a wide bandgap semiconductor element; and a cooling system for actively cooling the wide bandgap semiconductor element with a cooling medium, wherein the cooling system comprises a refrigeration device for lowering a temperature of the cooling medium below an ambient temperature of the power device; wherein the cooling system is adapted for lowering the temperature of the cooling medium in such a way that a temperature of the wide bandgap semiconductor element is below 100° C.

An electronics cooling arrangement includes a housing configured to contain a coolant and an electronic device disposed within the housing. The electronic device has a passageway with at least one inlet and at least one outlet and is configured to allow fluid flowing between the inlet and the outlet to cool the electronic device.

An immersion cooled electronics arrangement includes a sealed housing, a coolant contained within the sealed housing, and an electronic device disposed within the sealed housing. The sealed housing has a variable-volume alterable between at least a first volume and a second volume in response to changes in pressure within the sealed chamber to reduce the rate of pressure change in the sealed housing over time form heating of the coolant.

The invention provides a single radiator cooling system for use in hybrid electric vehicles, the system comprising a surface in thermal communication with electronics, and subcooled boiling fluid contacting the surface. The invention also provides a single radiator method for simultaneously cooling electronics and an internal combustion engine in a hybrid electric vehicle, the method comprising separating a coolant fluid into a first portion and a second portion; directing the first portion to the electronics and the second portion to the internal combustion engine for a time sufficient to maintain the temperature of the electronics at or below 175° C.; combining the first and second portion to reestablish the coolant fluid; and treating the reestablished coolant fluid to the single radiator for a time sufficient to decrease the temperature of the reestablished coolant fluid to the temperature it had before separation.

A heat transfer apparatus includes a heat chamber and a heat dissipating structure coupled to the heat chamber so as to jointly form a closed thermal circuit. The heat dissipating structure includes an outlet channel that leads off from the heat chamber and issues at an end that is remote from the heat chamber into a return duct which issues into the heat chamber. The return duct has a dimension which is smaller than a dimension of the outlet channel. The heat chamber is a boiling chamber or a steam chamber and the heat dissipating structure is a channel structure having steam regions and fluid regions. The heat chamber and the heat dissipating structure together form a pulsating or oscillating heating structure mechanism.

An electronics cooling arrangement includes a housing, an electronic device disposed within the housing, and a solid-liquid phase change material disposed within the housing and is in thermal communication with the electronic device to absorb heat generated by the electronic device. A method of cooling an electronic device and a vehicular electronics cooling system are also described.

An immersion cooled electronic arrangement includes a sealed housing, a coolant contained within the housing, and an electronic device submerged within the coolant. An agitator is disposed within the housing to control passive heat transfer between the electronic device and the coolant. An immersion cooling system and related method are also described.