Embedded cooling systems and methods of forming the same are disclosed. An embedded cooling system includes a PCB having a first major surface opposite a second major surface and power device stacks embedded within the PCB between the first major surface and the second major surface. Each power device stack includes a first substrate and a second substrate, and an electrical insulation layer disposed between the first substrate and the second substrate. The embedded cooling system further includes a power device coupled to the first substrate of each power device stack and heat pipes having a first end and a second end spaced a distance apart from the first end. The first end is embedded within the PCB substrate and the second end extends outside of the PCB substrate. The second substrate of the one or more power device stacks is coupled to the one or more heat pipes.

In a radio frequency (RF) amplifier system and a heat dissipation device thereof, the RF amplifier system includes an RF amplifier and a heat dissipation device. The RF amplifier includes an RF power element. The heat dissipation device includes a heat conduction board, a plurality of heat pipes and fins. The heat conduction board is thermally conductively coupled to the RF power element, and one end of the heat pipe is thermally conductively coupled to the heat conduction board. The fins are arranged in parallel and spaced from each other. The other end of each of the heat pipes is inserted through the fins. The heat of the RF power element is conducted to the heat conduction board and the heat pipe, and then the heat is quickly conducted to the fins to be dissipated away quickly, and the RF power element can quickly reach a stable temperature.

A frame portion is a plate-like member to which a cooler is attached for cooling an electric circuit element configured to operate for power conversion that causes generation of heat. The capacitor is a structural member disposed in a direction perpendicular to the frame portion and including a capacitor element electrically connected to the electric circuit element. The capacitor includes a first support surface and a second support surface that are external surfaces facing in opposite directions from each other and parallel to the direction perpendicular to the frame portion. The first frame and the second frame each have an end portion fixed to a connection frame. The first frame includes a first attachment surface fixed to a first support surface. The second frame includes a second attachment surface fixed to a second support surface.

A sub-module cooling device of a power transmission system is proposed. Sub-modules may be arranged in a row on each of multiple layers of a frame. Heat generated by the sub-modules may be transferred to a duct through heat pipes, and the heat transferred through the heat pipes may be discharged to the outside while air coming out from an air conditioner passes through the duct. When the heat generated by the sub-modules is discharged in this manner, a cooling fan may not be required to be installed in each of the sub-modules. Air may be flown by the operation of the air conditioner and may absorb the heat generated by the sub-modules and discharge the heat to the outside.

A starter/generator arrangement includes a starter/generator, a power converter electrically connected to the starter/generator, and coolant circuit with a pump and a condenser in fluid communication with the power converter. The power converter is arranged to flow start mode electrical power in a first direction in a start mode and a second direction in a generate mode. The coolant circuit fluidly couples the pump to the condenser for storing heat in a coolant disposed within the coolant circuit while flowing the start mode electrical power in the first direction. Gas turbine engines and methods of cooling starter/generator arrangements are also described.

In one embodiment, an electronic system includes a printed circuit board, one or more packaged semiconductor devices, and a vapor chamber having a top and a bottom and enclosing a sealed cavity that is partially filled with a coolant. The vapor chamber comprises a thermo-conductive and electro-conductive material. The top of the vapor chamber has one or more depressions formed therein, each depression receiving and thermo-conductively connected to at least part of a bottom of a corresponding packaged semiconductor device, which is mounted through a corresponding aperture in the PCB. A heat sink may be thermo-conductively attached to the bottom of the vapor chamber.

A power module is provided and includes first stack, second stack, and third stacks of layers, a heat pipe, and at least one cold plate or heat sink. The third stack of layers is disposed between the first stack of layers and the second stack of layers and includes a first semiconductor die, a second semiconductor die and a center spacer layer disposed between the first semiconductor die and the second semiconductor die. The heat pipe extends at least partially into the center spacer layer. The at least one cold plate or heat sink receives thermal energy from the first stack of layers and the second stack of layers. The second stack of layers, the third stack of layers, the heat pipe and the at least one cold plate or heat sink facilitate dual sided cooling of each of the first semiconductor die and the second semiconductor die.

A heat sink has a base plate that has a first central portion, a second central portion, and a periphery, a first plurality of heat pipes embedded in the base plate that are arranged to convey heat away from the first central portion, and a second plurality of the heat pipes embedded in the base plate that are arranged to convey heat away from the second central portion, each of the heat pipes of the first and second pluralities having a hot end for receiving heat flow and a cool end for releasing heat flow. A switch package comprises an inner casing half mounted to a module facing surface of the heat sink base plate, a semiconductor module mounted to the module facing surface of the heat sink within the inner casing half, and an outer casing half that encloses the heat sink.

A power conversion apparatus includes: a converter main circuit converting AC power into DC power; an inverter main circuit converting, into AC power, the DC power obtained by conversion by the converter main circuit; and a common cooler cooling first switching elements included in the inverter main circuit and second switching elements included in the converter main circuit. The first switching elements are modularized in units of one or more elements to form first modules. The second switching elements are modularized in units of one or more elements to form second modules. The first and second modules are mounted on a first surface of a base of the cooler. The first modules are arranged in a first direction on the first surface. The second modules are arranged such that two or more second modules are continuously arranged in a second direction orthogonal to the first direction on the first surface.

Heat dissipation system, a power converter using such a heat dissipation system, and an associated method of thermal management of the power converter are disclosed. The heat dissipation system includes a condenser, a first cooling loop, and a second cooling loop. The first cooling loop is coupled to the condenser and includes a first two-phase heat transfer device. The second cooling loop is coupled to the condenser and includes a second two-phase heat transfer device. The condenser is disposed above the first and second two-phase heat transfer devices.