A temperature regulating device regulates temperature of the magnetic circuit component incorporated in a power converter and including a magnetic core and a coil wound around the magnetic core and includes a cooling device that cools the magnetic circuit component, a temperature estimation device that estimates a temperature of the magnetic circuit component, a target temperature determination device that determines a target temperature of the magnetic circuit component, at which a loss of the magnetic circuit component is lowered, based on a relationship between temperature and loss of the magnetic circuit component, and a cooling suppressor that, when the temperature of the magnetic circuit component estimated by the temperature estimation device is equal to or lower than a predetermined temperature lower than the target temperature, suppresses the cooling of the magnetic circuit component by the cooling device so that the temperature of the magnetic circuit component reaches the target temperature.

A method for heat dissipation control of a charging base is applied to a terminal device, and includes: receiving a trigger message configured to represent a wireless communication connection between the terminal device and the charging base; displaying an interaction interface for heat dissipation control according to the trigger message; and sending a control instruction corresponding to the selection information to the charging base based on selection information generated in response to acting on the interaction interface for heat dissipation control. An apparatus for heat dissipation control of a charging base, a terminal device and a charging base for charging the terminal device are also disclosed.

A power electronics system comprising a environmentally sealed electronics compartment for housing power electronics equipment is provided. The system includes a plenum within the sealed electronic compartment for circulating air. A first liquid cooling loop is configured to cool air flowing through the plenum. A second liquid cooling loop configured to directly cool the power electronics equipment. The system includes a controller configured to independently control the flow rate of the first liquid cooling loop and the second liquid cooling loop.

A power converter, including a housing, an air channel that is installed in the housing and that has a top part and a leg part forming a T-shape, and a plurality of power conversion units that are arranged in the housing on opposite sides of the leg part of the air channel, each power conversion unit having at least one cooling fin formed thereon that projects into the top part of the air channel.

A thermal management system for tightly controlling temperature of a thermal load (e.g., onboard an aircraft) includes: a pressurized tank for storing an expendable coolant; a control valve downstream of the pressurized tank for controlling a flow rate of the expendable coolant; a heat exchanger downstream of the control valve for transferring heat from a thermal load to the expendable coolant at a predetermined temperature; a back pressure regulator (BPR) downstream of the heat exchanger, the BPR having a set point controlled to maintain the expendable coolant at the predetermined temperature in the heat exchanger; optionally, a sensor or orifice downstream of the heat exchanger for determining vapor quality at an exit of the heat exchanger; and a system exit downstream of the BPR for removing some or all of the expendable coolant from the thermal management system after transferring heat from the thermal load to the expendable coolant.

The present disclosure describes thermal mitigation for an electronic speaker device and associated systems and methods. The thermal mitigation includes monitoring several thermal zones to determine or estimate thermal conditions in corresponding parts of the electronic speaker device. The thermal zones may include a System-on-Chip (SoC) integrated circuit (IC) component, audio components including power-dissipating IC components, and a temperature of an exterior surface of a housing component of the electronic speaker device. To mitigate thermal runaway, different throttling schemes may be triggered based on the thermal zones exceeding certain thermal limits. The throttling schemes may include reducing the amount of power supplied to the SoC, reducing audio power of the audio components to a lower wattage, or manipulating SoC cores such as by disabling one or more of the cores or adjusting utilization of the SoC cores.

Provided is a power conversion device capable of directly performing a protection operation according to the state of a cooler. A control unit includes: a semiconductor switching element loss calculation unit which calculates a loss in a semiconductor switching element with use of a switching state of the semiconductor switching element, and a current detection value or a voltage detection value; and a cooler state estimation unit which estimates a state of a cooler on the basis of a loss calculation value from the semiconductor switching element loss calculation unit and a temperature detection value from a temperature detector. The control unit limits current flowing to the semiconductor switching element on the basis of the state of the cooler.

An apparatus for cooling electronic components includes a chassis having a hot side compartment having one or more first electrical components and a cold side compartment having one or more second electrical components. A coolant channel is connected to the cold side compartment. At least one thermoelectric cooler (TEC) is positioned within the cold side compartment. The TEC has a cold plate and a hot plate, the hot plate being connected to the coolant channel and the cold plate being connected to the one or more second electrical components. A method for cooling electronic components using at least one TEC includes identifying an amount of heat to be removed from the one or more second electronic components and determining the TEC with the peak performance based on a best Delta T. The method includes monitoring the Delta T and adjusting the input voltage to maintain the optimum Delta T.

A heat pipe assembly includes walls having porous wick linings, an insulating layer coupled with at least one of the walls, and an interior chamber sealed by the walls. The linings hold a liquid phase of a working fluid in the interior chamber. The insulating layer is directly against a conductive component of an electromagnetic power conversion device such that heat from the conductive component vaporizes the working fluid in the porous wick lining of the at least one wall and the working fluid condenses at or within the porous wick lining of at least one other wall to cool the conductive component of the electromagnetic power conversion device. The assembly can be placed in direct contact with the device while the device is operating and/or experiencing time-varying magnetic fields that cause the device to operate.

An example computing device includes: a housing; a liquid cooling system; a first compartment of the housing that contains processing components; a second compartment of the housing that contains cooling components of the liquid cooling system; an airgap in the housing that physically separates and thermally isolates the first compartment and the second compartment, the airgap defined by external surfaces of the housing; and, a conduit of the housing that joins the first compartment and the second compartment at a side of the airgap, the conduit routing, internal to the housing, tubing of the liquid cooling system from the first compartment to the second compartment, the tubing conveying liquid that carries heat from the processing components to the cooling components for dissipation