In an electronic component cooling device, a cooler cools an electronic component, a coolant temperature acquisition unit acquires a temperature of a coolant, a coolant flow rate acquisition unit acquires the flow rate of the coolant, a heat loss estimation unit estimates a heat loss from the electronic component, and a loss threshold calculation unit calculates an upper limit threshold of the heat loss from the electronic component based on the coolant temperature and the coolant flow rate. A coolant flow rate control unit controls the flow rate of the coolant and is configured to, in response to an estimated heat loss which is the heat loss from the electronic component that has been estimated by the heat loss estimation unit exceeding the upper limit threshold, increase the flow rate of the coolant circulating through the cooler.

An electric device includes a first power supply portion having a first conductive section configured to electrically connect a power source and an electrical component and a second conductive section configured to be integrally connected to the first conductive section and extend away from the first conductive section, a second power supply portion connecting to the second conductive section, and a capacitor. A thermal resistance per unit length in a second extension direction of the second power supply portion is higher than a thermal resistance per unit length in a first extension direction of the first power supply portion.

In various embodiments, a cooling assembly includes a heat-generating device, a metal inverse opal (MIO) layer, a shared coolant reservoir, a passive heat exchange circuit, and an active heat exchange circuit. The MIO layer is bonded to the heat-generating device. The shared coolant reservoir contains a coolant fluid. The passive heat exchange circuit directs coolant fluid from the shared coolant reservoir through the MIO layer and back to the shared coolant reservoir. The active heat exchange circuit includes a pump and a heat exchanger, wherein the active heat exchange circuit draws the coolant fluid from the shared coolant reservoir through the heat exchanger and returns the coolant fluid to the shared coolant reservoir.

A power supply includes a casing; an AC-to-DC converter; an inverter electrically coupled to the AC-to-DC converter; a transformer having a primary side and a secondary side, wherein the inverter is electrically coupled to the primary side of the transformer; an output rectifier electrically coupled to the secondary side of the transformer; a fan, disposed in the casing and configured to remove heat from the casing generated by the AC-to-DC converter, the inverter and the output rectifier; and a fan controller configured to control when the fan is operational, wherein the fan controller is configured to execute a state machine that is configured to change states based at least on a dynamically adjustable counter.

An electronic device in accordance with one embodiment may include a load that receives power and performs an operation; and a power supply that supplies power to the load, the power supply including: a rectifier configured to rectify an input alternating current (AC) voltage; a converter including at least one first switching element and configured to convert the rectified input AC voltage into a direct current (DC) voltage; an inverter including a plurality of second switching elements and configured to convert the DC voltage into an AC voltage; a plurality of temperature sensors configured to detect the temperature of each of a plurality of switching elements including the at least one first switching element and the plurality of second switching elements; and a processor configured to determine whether a temperature failure occurs in the plurality of switching elements based on a temperature difference between the plurality of switching elements or a temperature variation amount of each of the plurality of switching elements and performs temperature protection control on the plurality of switching elements based on determining that the temperature failure occurs.

A power module for electric drives is provided which comprises at least one exciter circuit with at least one power semiconductor, wherein the power module is molded and the exciter circuit with the at least one power semiconductor is integrated in the molded power module. A traction inverter is also provided which comprises a water-cooled main cooler, wherein the main cooler comprises a bearing surface which is configured to receive power modules, wherein the traction inverter comprises at least one molded power module, and wherein the main cooler forms a cooling connection which is configured to receive the molded power module on the main cooler.

An example computing device includes: a housing; a liquid cooling system; a first compartment of the housing that contains processing components; a second compartment of the housing that contains cooling components of the liquid cooling system; an airgap in the housing that physically separates and thermally isolates the first compartment and the second compartment, the airgap defined by external surfaces of the housing; and, a conduit of the housing that joins the first compartment and the second compartment at a side of the airgap, the conduit routing, internal to the housing, tubing of the liquid cooling system from the first compartment to the second compartment, the tubing conveying liquid that carries heat from the processing components to the cooling components for dissipation.

The invention relates to a device for operating a voltage converter (1), in particular a DC converter, of a motor vehicle, which voltage converter has at least two parallel-connected converter strands (4, 5) which are connected between a high-voltage side (2) and a low voltage side (3) of the voltage converter (1) for converting the voltage, having at least one cooling device (8) carrying a coolant (9) and assigned to the converter strands (4, 5), wherein each of the converter strands (4, 5) is assigned at least one temperature sensor (6, 7), comprising the following steps: a) detecting an input voltage, an output voltage and an operating current of each converter strand (4, 5), b) detecting a current converter strand temperature by means of the respective temperature sensor (6, 7), c) determining a respective coolant temperature as a function of the values detected in steps a) and b), d) comparing the two determined coolant temperatures (T_1, T_2) with each other and e) determining the serviceability of the temperature sensors (6, 7) on the basis of the result of the comparison.

A method for heat dissipation control of a charging base is applied to a terminal device, and includes: receiving a trigger message configured to represent a wireless communication connection between the terminal device and the charging base; displaying an interaction interface for heat dissipation control according to the trigger message; and sending a control instruction corresponding to the selection information to the charging base based on selection information generated in response to acting on the interaction interface for heat dissipation control. An apparatus for heat dissipation control of a charging base, a terminal device and a charging base for charging the terminal device are also disclosed.

An induction charging device for a vehicle charging system may include a magnetic field conductor, a control device, a temperature-control device configured to temperature-control the magnetic field conductor, and an induction coil configured to at least one of transmit and receive a wireless energy transmission. The temperature-control device configured such that a temperature-control fluid is flowable therethrough. The induction charging device may include a first temperature sensor configured to determine a temperature of a temperature-control side of the magnetic field conductor. The induction charging device may include at least one of (i) a second temperature sensor configured to determine a temperature of a coil side of the magnetic field conductor, and (ii) a temperature-control fluid temperature sensor configured to measure a temperature-control fluid temperature of the temperature-control fluid in the temperature-control device. The control device may be configured to limit a thermal load of the magnetic field conductor.