Changing electrical power needs for buildings often requires the upgrade of the electrical panel, the addition of extra panels, or both. Herein, a single electrical panel hosts power interface modules that connect to multiple power rails within the panel. The modules, which plug into the panel, convert power between the rails, or make and break connections between the rails, under the command of a system controller. The rails are connected to switchgear to which a variety of external power sources and loads can be connected. The modules are cooled by a heat exchanger and the waste heat may be directed outside or used to heat inside the building or heat domestic water.

The present disclosure describes thermal mitigation for an electronic speaker device and associated systems and methods. The thermal mitigation includes monitoring several thermal zones to determine or estimate thermal conditions in corresponding parts of the electronic speaker device. The thermal zones may include a System-on-Chip (SoC) integrated circuit (IC) component, audio components including power-dissipating IC components, and a temperature of an exterior surface of a housing component of the electronic speaker device. To mitigate thermal runaway, different throttling schemes may be triggered based on the thermal zones exceeding certain thermal limits. The throttling schemes may include reducing the amount of power supplied to the SoC, reducing audio power of the audio components to a lower wattage, or manipulating SoC cores such as by disabling one or more of the cores or adjusting utilization of the SoC cores.

A power circuit module includes an electronic circuit board, a heat generating element mounted on a first surface of the electronic circuit board and being a semiconductor electronic component that constitutes a part of a power circuit, a temperature detecting element that detects the temperature of the heat generating element, an electric circuit wiring, a heat dissipating body that dissipates heat of the heat generating element, and a heat conduction sheet having elasticity and flexibility, and a thickness. The heat conduction sheet is between the heat generating element and the heat dissipating body, the temperature detecting element is thermally connected to the heat generating element via the heat conduction sheet and is electrically connected via the electric circuit wiring, and with regard to the sizes of the components, the following relationship holds: temperature detecting element<heat generating element<heat dissipating body.

An arrangement has a converter with an electrical series circuit of modules each having four electronic switching elements and an electrical energy storage device. The arrangement also has a cooling device for cooling the electronic switching elements by way of a liquid coolant and a heat exchanger and a control unit for controlling the electronic switching elements. The control unit controls the electronic switching elements in such a manner that at least one current harmonic is generated in the series circuit if the temperature of the liquid coolant or the temperature of a medium, which is intended to absorb the heat at the heat exchanger, falls below a predetermined limit temperature.

An example computing device includes: a housing; a liquid cooling system; a first compartment of the housing that contains processing components; a second compartment of the housing that contains cooling components of the liquid cooling system; an airgap in the housing that physically separates and thermally isolates the first compartment and the second compartment, the airgap defined by external surfaces of the housing; and, a conduit of the housing that joins the first compartment and the second compartment at a side of the airgap, the conduit routing, internal to the housing, tubing of the liquid cooling system from the first compartment to the second compartment, the tubing conveying liquid that carries heat from the processing components to the cooling components for dissipation.

A method for modeling a thermal circuit of power inverter includes setting a first input node of the thermal circuit to a first measured temperature. The method also includes setting a second input node of the thermal circuit to a second measured temperature. The method also includes determining at least one thermal characteristic of the thermal circuit using, at least, the first measured temperature. The method also includes determining an operating temperature of the thermal circuit based on the at least one thermal characteristic.

The present invention concerns a method for controlling the temperature of a multi-die power module, a multi-die temperature control device. The multi-die temperature control: obtains a signal that is representative of the temperature of one die among the dies of the multi-die power module when the die is not conducting, obtains signals that are representative of a reference temperature that is dependent of the temperature of all the dies of the multi-die power module when the dies are not conducting, compares the signal that is representative of the temperature of one die to the signal that is representative of the reference temperature, reduces the duration of the conducting time of the die or reducing the duration of the conducting time of the other dies of the multi-die power module according to the comparison result.

A power electronics system comprising a environmentally sealed electronics compartment for housing power electronics equipment is provided. The system includes a plenum within the sealed electronic compartment for circulating air. A first liquid cooling loop is configured to cool air flowing through the plenum. A second liquid cooling loop configured to directly cool the power electronics equipment. The system includes a controller configured to independently control the flow rate of the first liquid cooling loop and the second liquid cooling loop.

The electronic power apparatus for electric or hybrid cars comprises an external container, an electronic power circuit housed inside the container and configured for the conversion of an input current/voltage into a predefined output current/voltage, a liquid cooling circuit made at a portion of the container for cooling the electronic power circuit, wherein the container comprises a housing body of the electronic power circuit in a polymeric material and comprises at least one portion provided with the liquid cooling circuit.

A temperature adjustment circuit includes a first pump that circulates a heat medium in at least one of a first temperature adjustment circuit and a second temperature adjustment circuit; a coupling path that couples the first temperature adjustment circuit and the second temperature adjustment circuit to form a coupled circuit; a switching unit capable of switching between a circulation state in which the heat medium circulates in the coupled circuit and a non-circulation state in which the heat medium does not circulate in the coupled circuit; and a control device that controls the switching unit and the first pump. The control device switches the coupled circuit from the non-circulation state to the circulation state in a state in which a rotation speed of the first pump is decreased lower than a rotation speed of the first pump before switching, and increases the rotation speed of the first pump after switching.