The disclosure discloses a device for terminal heat dissipation and a mobile terminal, including: a heat source chip, a heat pipe, and a shield, wherein the shield is located between the heat source chip and the heat pipe, and is connected with the heat source chip and with the heat pipe via the same type of flexible thermal conductive solid; and a microporous array is arranged at a connection position between the flexible thermal conductive solids, which are in contact with the shield. By means of the disclosure, the problem in the related art that heat cannot be quickly conducted to the h at pipe due to the back and forth conversion of the conductive medium in the thermal conductive path is solved, and h at can therefore be quickly conducted to the heat pipe, speeding up an effect of heat dissipation.

A wearable display device includes a device body, a heat dissipation processing module, and an inflation actuation module. The device body includes a front cover, a side cover, a fillable gas bag, a circuit board, and a microprocessor. The heat dissipation processing module includes a first actuator corresponding to the microprocessor for performing heat exchange for the microprocessor. The inflation actuation module includes a base member, a gas communication channel, a second actuator, and a valve component. When the second actuator and the valve component are driven, the valve component is opened to control gas introduction of the second actuator, and the second actuator is actuated to transmit the gas to the gas communication channel for gas collection, and the second actuator further transmits the gas to the fillable gas bag for inflating the fillable gas bag, so as to allow a user to wear the wearable display device stably.

A display module includes a display panel on which an image is displayed, a driver chip which supplies a driving voltage to the display panel, a thermoelectric element disposed on a first surface of the display panel and which overlaps the driver chip in a plan view, and an embedded battery disposed on the first surface of the display panel, spaced apart from the thermoelectric element, and electrically connected to the driver chip and the thermoelectric element to supply power to the driver chip and the thermoelectric element.

Examples of the disclosure relate to an oscillating heat pipe comprising for cooling components within a bendable electronic device. The oscillating heat pipe comprises at least one condenser region to be positioned in a first portion of the bendable electronic device and at least one evaporator region to be positioned in a second portion of the bendable electronic device. The oscillating heat pipe also comprises at least one bendable region provided between the condenser region and the evaporator region and configured to extend across a hinge of a bendable electronic device wherein at least one bendable region comprises a polymer tubing supported by a flexible helical support structure.

A display device is disclosed. The display device includes a display panel, a frame positioned behind the display panel, a PCB coupled to the frame and including a heating element, and a vapor chamber including an internal space for fluid to flow, wherein the vapor chamber includes a heat-absorbing part in contact with the heating element, a heat-releasing part positioned above the heat-absorbing part and spaced apart from the PCB, and a plurality of lines formed at an outer side of the vapor chamber, wherein the plurality of lines extend in a first direction corresponding to an axis that connects a center of the heat-absorbing part to a center of the heat-releasing part.

A device includes a micro-organic light emitting diode (μ-OLED) display panel and an electronic component. An electrical connector electrically couples the μ-OLED display panel and the electronic component. A standoff is disposed between the electronic component and the μ-OLED display panel. The standoff physically couples the electronic component and the μ-OLED display panel with a gap therebetween. The gap thermally decouples the electronic component from the μ-OLED display panel. A U-shaped heat sink can be disposed in the standoff, and heat generated by the μ-OLED display can be mitigated by a system fan when a U-shaped heat sink is disposed in the standoff.

A wearable display device is disclosed and includes a main body and a driving module. The main body includes a frame, two temple arms and at least one monitor. The two temple arms are respectively connected with two ends of the frame, and the monitor is disposed on the frame. The driving module is disposed within the frame and includes a microprocessor, an optical display module and a heat dissipation component. The optical display module is electrically coupled with the microprocessor and configured for displaying an optical image on the at least one monitor. The heat dissipation component includes a heat dissipation base and two heat pipes. The two heat pipes are disposed on the heat dissipation base adjacent to the microprocessor. When the heat generated by the microprocessor is conducted to the heat dissipation base, the two heat pipes perform heat exchange with the heat dissipation base.

A wearable display device is disclosed and includes a main body, a heat dissipation processing module and an inflatable actuation module. The main body includes a front cover, a lateral cover, an inflatable airbag, a circuit board and a microprocessor. The heat dissipation processing module is configured to perform heat exchange with the microprocessor, and includes a first actuator, a heat pipe and a cooling chip. The inflatable actuation module includes a base, a ventilation channel, a second actuator and a valve component. When the second actuator and the valve component are driven, the valve component is opened and the second actuator is enabled, the gas is transported and inflates the inflatable airbag through the ventilation channel, so that the main body is stably fitted and positioned on the head of the wearer.

An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

Disclosed is a display device. The display device of the present disclosure includes: a display panel; a frame located in a rearward direction of the display panel; a PCB which is coupled to the frame, and has a first heating element and a second heating element that are spaced apart from each other; and a vapor chamber in contact with the first heating element and the second heating element, wherein the vapor chamber includes: a first vapor chamber which contacts the first heating element, contains a first fluid, and provides a first space in which the first fluid convects; a second vapor chamber which contacts the second heating element, contains a second fluid, and provides a second space in which the second fluid convects; a coupling portion which partitions the first space and the second space at between the first vapor chamber and the second vapor chamber; a first wick which is adjacent to the coupling portion inside the first vapor chamber, and extends along the coupling portion, and through which the first fluid moves; and a second wick which is adjacent to the coupling portion inside the second vapor chamber, and extends along the coupling portion, and through which a flow path of the second fluid moves.