H05K7/2099

Hybrid thermal management for liquid crystal on silicon head-up displays

Aspects of the disclosure include hybrid thermal management systems configured to control an operating temperature of a liquid crystal on silicon (LCoS) based head-up display (HUD) unit. An exemplary thermal management system can include a liquid crystal on silicon layer and a phase change material on a surface of the liquid crystal on silicon layer. A thermoelectric device is positioned in direct contact with the phase change material and a heat sink is positioned on a surface of the thermoelectric device. The thermal management system can further include a controller configured to adjust a thermoelectric device current of the thermoelectric device responsive to a temperature of the liquid crystal on silicon layer.

OUTDOOR DISPLAY APPARATUS
20220071050 · 2022-03-03 · ·

An outdoor display apparatus comprises a case including an inlet and an outlet, a display module disposed inside the case and including a display panel on which an image seen through at least a portion of the case is displayed, and a heat exchanger. The heat exchanger comprises a first portion located on a first flow path formed to circulate air to the display module, a second portion to receive heat from the first portion, and located on a second flow path on which outside air is heat-exchanged with air, and a phase change material provided to circulate between the first and second portions, and provided to change a phase from a fluid to a gas. The case comprises a partition wall provided to isolate the first flow path and the second flow path from each other, and the first portion and the second portion are disposed obliquely.

DISPLAY DEVICE
20210337700 · 2021-10-28 · ·

A display device is disclosed. The display device includes a display panel, a vapor chamber positioned behind the display panel, a board, which is positioned behind the vapor chamber and is coupled to the vapor chamber, and an adhesive member disposed between the display panel and the vapor chamber so as to be coupled thereto, wherein the vapor chamber includes a first plate, which defines a front surface thereof and faces the display panel, a second plate, which defines a rear surface thereof and is coupled to the first plate, and fluid flowing in a space defined between the first plate and the second plate, and wherein the first plate includes a coupler, which is depressed rearwards from the first plate and to which the adhesive member is coupled.

Cooler for display, and display device having same

The present disclosure relates to a cooler and to a display device having the same, where a heat-exchanger of the cooler is arranged on a side surface of a display unit in order to simplify the structure and to make a slimmer display device. The cooler includes a closed air circulation pathway circulating between the front, rear and sides of the display unit; an open air flow pathway that flows in the length direction of the side of the display unit; and a cooling module that is installed on the side of the display along the length direction of the display, and that includes the heat-exchanger, where the closed air circulation path and the open air flow part are adjacent, thereby causing heat-exchange.

Heat management device and method of manufacture

A heat-management device includes an array of recesses distributed across an external surface of a thermally conductive body. The device includes an array of protrusions interspersed with the array of recesses that form a network of cavities within an internal volume of the thermally conductive body. The array of recesses and the array of protrusions define a non-planar interface that is complementary to a curved surface of a heat source. A fluid volume can be retained within the network of cavities at a pressure lower than atmospheric pressure. The heat management device includes a cooling operation mode wherein the fluid volume absorbs heat from the heat source through the non-planar interface and dissipates heat away from the heat source through the network of cavities.

DISPLAY MODULE
20210242188 · 2021-08-05 ·

A display module includes a display panel on which an image is displayed, a driver chip which supplies a driving voltage to the display panel, a thermoelectric element disposed on a first surface of the display panel and which overlaps the driver chip in a plan view, and an embedded battery disposed on the first surface of the display panel, spaced apart from the thermoelectric element, and electrically connected to the driver chip and the thermoelectric element to supply power to the driver chip and the thermoelectric element.

Electronic device comprising heat-dissipating structure

An electronic device according to various embodiments of the disclosure may include a housing including a front plate and a rear plate facing the front plate, a display exposed through at least part of the front plate, an intermediate plate interposed between the display and the rear plate, and including a first face facing the display and a second face facing the rear plate, a first printed circuit board interposed between the display and the intermediate plate, a first electronic component attached to a first portion of the second face, a second electronic component attached to a second portion, away from the first portion, of the second face, and a first heat-dissipating structure extended between the first portion and the second portion along the second face.

Electronic device including heat dissipation structure

An electronic device is provided. The electronic device includes a housing including a front plate, a rear plate facing away from the front plate, and a side structure surrounding a space between the front plate and the rear plate, a heat dissipation member accommodated inside the housing, at least one antenna module disposed adjacent to the side structure or at least partially accommodated in the side structure, the at least one antenna module being disposed to be inclined or perpendicular relative to the front plate or the rear plate, and a fixing member coupled to and at least partially surrounding the antenna module. The fixing member may include a first heat transfer portion at least partially surrounding a rear face of the antenna module, and a second heat transfer portion disposed in contact with the heat dissipation member.

ELECTRONIC DEVICE COMPRISING THERMAL MANAGEMENT CHAMBER USING BOILING
20230413484 · 2023-12-21 ·

An electronic device according to various embodiments comprises: a housing including a heat source and a thermal management chamber thermally coupled to the heat source; and a display disposed on the housing on the opposite side from the heat source. The thermal management chamber includes a working fluid, and is configured to generate bubbles in the working fluid at or above the boiling critical temperature of the working fluid. The thermal management chamber may include: a first wall located adjacent to the heat source and having a first hydrophilic surface; a second wall located on the opposite side from the first wall and spaced apart from the heat source, and having a second hydrophobic surface, and a plurality of third walls located between the first wall and the second wall.

Mounting device with heat pipe disposed inside and display device having the same
10907909 · 2021-02-02 · ·

A display device includes a display module from which heat is emitted; a connection rod coupled to the display module and with which the display module is mountable to a structure disposed external to the display device and spaced apart from the display module along a first direction, the connection rod lengthwise extending along the first direction; and a heat pipe disposed inside the connection rod and lengthwise extending along the first direction.