A cooling device of an optical element includes a circulation passage through which a fluid circulates. The circulation passage includes a window portion that is disposed on an incidence side or an emission side of the optical element and transmits light, an evaporation portion that is connected to the window portion and includes a plurality of channel portions, and a heat radiation portion that radiates heat of the fluid. The fluid transmits the light in a liquid state. The fluid is a liquid in the window portion. The fluid that is a liquid evaporates to vapor in the plurality of channel portions. The fluid that is vapor condenses into a liquid in the heat radiation portion. A sectional area of each channel portion is less than a sectional area of a boundary between the window portion and the evaporation portion.

The present disclosure provides a display module and a backlight module. The display module includes a back plate, a light source disposed on the inner side of the back plate, and a heat pipe, wherein the back plate is provided with vertically bent walls bent inwards around thereof, and wherein one side of a portion of the heat pipe is configured to abut against the light source, and the other side thereof is configured to abut against the vertically bent walls of the back plate.

Examples are disclosed that relate to heat transfer devices comprising a vapor chamber and a flexible hinge. One disclosed example provides an electronic device comprising a first portion and a second portion connected by a hinge region, and a vapor chamber extending from the first portion to the second portion across the hinge region, the vapor chamber comprising a first layer comprising titanium, a second layer comprising titanium joined to the first layer to form the vapor chamber, a working fluid within the vapor chamber, and a third layer comprising titanium positioned between the first layer and the second layer, the third layer comprising one or more features configured to conduct the working fluid via capillary action.

A display device is provided to achieve air circulation through an inner structure or an outer structure of the display device for efficient heat dissipation. The display device includes a housing, a display module mounted in the housing, a closed-loop air circulation system, and an open-loop air circulation system. The closed-loop air circulation system includes a first channel defined between a front surface of the display module and a front surface of the housing so as to extend along the front surface of the display module, and a second channel defined between one side surface of the display module and one side surface of the housing that is opposite the one side surface of the display module. The first channel is configured to receive air from a first end of the second channel and to discharge the air to a second end of the second channel.

A display device includes a display panel, a heat spread sheet below the display panel and in contact with a first surface of the display panel, and a heat storage sheet in contact with at least a portion of the heat spread sheet. The heat spread sheet includes a first phase change material. The heat storage sheet includes a second phase change material having a boiling point greater than a boiling point of the first phase change material.

A heat sink is applied to a display unit and has a heat conductor, at least one first cooling fan, and at least one second cooling fan. The heat conductor has a heat-conducting member, multiple first cooling fins, and multiple second cooling fins. The heat-conducting member has a base portion, an extending portion formed on the base portion, and multiple channels formed in the heat-conducting member and filled with a working fluid. The first cooling fins are formed on the base portion. The second cooling fins are formed on the extending portion. The at least one first cooling fan is disposed on the base portion. The at least one second cooling fan is disposed on the extending portion. The heat conductor can be sectioned and the working fluid can change phases for heat dissipation, providing a good heat dissipation effect to the heat sink is good.

There is disclosed a digital signage including a display panel, a housing having the display panel arranged in one surface, the housing comprising a closed inner space, a cooling unit provided in a predetermined portion of the housing, the cooling unit comprising a hole configured to suck and exhaust external air, a heat pipe comprising one end positioned in the inner space of the housing to be coupled to a back surface of the display and the other end positioned in the cooling unit, with a liquid flowing therein to move heat, and a driving circuit board coupled to a back surface of the heat pipe to control driving of the display panel, such that the digital signage having a slim design can exhaust the heat generated from a display panel and a driving circuit board effectively.

A thermal dissipation system for wearable electronic devices transfers heat away from a housing enclosing a heat source and dissipates the heat through a region of the support assembly that is noncontiguous with the housing. The support assembly may be coupled to the housing to enable the housing to be worn by a user. Various regions of the support assembly have different thermal resistances between a thermal conduit and an ambient environment. The thermal resistances may decrease as the thermal conduit becomes farther away from the heat source. The variations in thermal resistances enable modulation of relative heat flux between the various regions. For example, heat may be internally routed through the wearable electronic device to be dissipated through a surface that a user does not typically touch during operation.

A heat radiating member includes a first plate extending in a first direction and including a first non-folding area, a second non-folding area, and a folding area disposed between the first non-folding area and the second non-folding area and including a plurality of first openings, a second plate extending in the first direction, spaced apart from the first plate in a second direction intersecting the first direction, and including a plurality of second openings in the folding area, and a plurality of pillars disposed between the first plate and the second plate in the first non-folding area and the second non-folding area and connecting the first plate and the second plate. A first separation distance between two adjacent ones of the plurality of first openings and a second separation distance between two adjacent ones of the plurality of second openings are different in the first direction.

A heat dissipation structure of an electronic device includes a casing, an upper motherboard located within the casing, a lower motherboard located within the casing and space apart from the upper motherboard, and a heat dissipation device located between the upper motherboard and the lower motherboard. The heat dissipation device extends out from between the upper motherboard and the lower motherboard to contact the casing. Between the upper motherboard and the lower motherboard is located a plurality of heat generating components directly in contact with the heat dissipation device, so that heat generated by the heat generating components is dissipated to the casing.