The present disclosure relates to a display apparatus. A display apparatus according to an embodiment of the present disclosure includes a display panel configured to display images, a heat dissipation member disposed on one side of the display panel, and a printed circuit board disposed on one side of the heat dissipation member. The heat dissipation member includes a first portion overlapping the printed circuit board, and a second portion disposed in an area spaced apart from the printed circuit board at a certain interval.

A siphon-type heat dissipation device includes a first plate body, a second plate body and a working liquid. An accommodation space is formed between the first plate body and the second plate body. The working liquid is accumulated in a lower portion of the accommodation space. A heat source is attached on the siphon-type heat dissipation device. After a heat energy generated by the heat source is transferred into the working liquid, the heat energy is absorbed by the working liquid, so that a portion of the working liquid is vaporized into a working vapor. After the working vapor ascends to an upper portion of the accommodation space, the heat energy is dissipated to surroundings, and the working vapor is condensed and changed into the working liquid. The working liquid flows back to the lower portion of the accommodation space.

An electromagnetic interference shielding structure is disclosed. The electromagnetic interference shielding structure includes an insulating member covering at least one circuit element mounted on a printed circuit board (PCB), a shielding member covering the insulating member, and a heat dissipator having a surface adhering to the shielding member to transfer heat emitted from the at least one circuit element to a place where temperature is relatively low.

An electromagnetic interference shielding structure is disclosed. The electromagnetic interference shielding structure includes an insulating member covering at least one circuit element mounted on a printed circuit board (PCB), a shielding member covering the insulating member, and a heat dissipator having a surface adhering to the shielding member to transfer heat emitted from the at least one circuit element to a place where temperature is relatively low.

A display device includes a display panel, a heating element located on a back side of a light-emitting surface of the display panel, and a support component located on the back side of the light-emitting surface of the display panel. The support component includes a loop heat dissipation cavity located inside the support component and a working fluid located in the loop heat dissipation chamber. A part of the loop heat dissipation cavity overlaps the heating element, and the loop type heat dissipation cavity includes at least one anti-backflow channel.

A device includes a micro-organic light emitting diode (-OLED) display panel and an electronic component. An electrical connector electrically couples the -OLED display panel and the electronic component. A standoff is disposed between the electronic component and the -OLED display panel. The standoff physically couples the electronic component and the -OLED display panel with a gap therebetween. The gap thermally decouples the electronic component from the -OLED display panel. A U-shaped heat sink can be disposed in the standoff, and heat generated by the -OLED display can be mitigated by a system fan when a U-shaped heat sink is disposed in the standoff.

There is disclosed a digital signage including a display panel, a housing having the display panel arranged in one surface, the housing comprising a closed inner space, a cooling unit provided in a predetermined portion of the housing, the cooling unit comprising a hole configured to suck and exhaust external air, a heat pipe comprising one end positioned in the inner space of the housing to be coupled to a back surface of the display and the other end positioned in the cooling unit, with a liquid flowing therein to move heat, and a driving circuit board coupled to a back surface of the heat pipe to control driving of the display panel, such that the digital signage having a slim design can exhaust the heat generated from a display panel and a driving circuit board effectively.

A heat dissipating device that includes a first heat spreader layer, a second heat spreader layer, a first spacer, a second spacer, a first phase change material (PCM), and a second phase change material (PCM). The first heat spreader layer includes a first spreader surface and a second spreader surface. The second heat spreader layer includes a third spreader surface and a fourth spreader surface. The first spacer is coupled to the first heat spreader layer and the second heat spreader layer. The second spacer is coupled to the first heat spreader layer and the second heat spreader layer. The first PCM is located between the first heat spreader layer and the second heat spreader layer. The first PCM is surrounded by the first spacer. The second PCM is between the first heat spreader layer, the second heat spreader layer, the first spacer and the second spacer.

A heat dissipating device that includes a first heat spreader layer, a second heat spreader layer, a first spacer, a second spacer, a first phase change material (PCM), and a second phase change material (PCM). The first heat spreader layer includes a first spreader surface and a second spreader surface. The second heat spreader layer includes a third spreader surface and a fourth spreader surface. The first spacer is coupled to the first heat spreader layer and the second heat spreader layer. The second spacer is coupled to the first heat spreader layer and the second heat spreader layer. The first PCM is located between the first heat spreader layer and the second heat spreader layer. The first PCM is surrounded by the first spacer. The second PCM is between the first heat spreader layer, the second heat spreader layer, the first spacer and the second spacer.

An embodiment of the present application discloses a backlight module and a display device. The backlight module device: a frame body, wherein the frame body includes at least one accommodation chamber; a backlight source disposed on a side of the accommodation chamber; and a heat dissipation enhancement layer disposed in the accommodation chamber, wherein heat dissipation enhancement layer including a liquid heat dissipation agent. The embodiment of the present application by the heat dissipation enhancement layer including the liquid heat dissipation agent, can accelerate heat dissipation to mitigate difficulty to heat dissipation due to high power consumption such that a range of environments of use of the backlight module is improved.