An input connection device for an electronic device is provided. The electronic device includes a mother circuit board and a cabinet having a first wall. The input connection device comprises an insulation housing, a conductive connection unit, a circuit board, a switch, a first power wire and a second power wire. The insulation housing is disposed on the first wall and comprises a main body comprising a hollow channel. The conductive connection unit is disposed in the hollow channel and is engaged with the insulation housing. The circuit board is connected with the conductive connection unit directly. The switch has an input part and an output part. The first power wire is connected with the circuit board and the input part of the switch. The second power wire is connected with the output part of the switch and the mother circuit board.

Disclosed are a housing for receiving an electronic device and an electronic system having the same. The electronic system includes a case having lower and upper cases detachably combined with the lower case, a circuit board arranged in an inner space of the case and secured to the lower case such that at least a grounding line and at least a connection line are provided with the circuit board, a plurality of devices arranged on the circuit board such that each device is separated from one another by the grounding line and is connected with one another by the connection line, and at least an electromagnetic shielding member embedded onto the upper case such that the electromagnetic shielding member is in contact with the grounding line around the device to provide a shielding space receiving the device. The device is protected from unexpected electromagnetic waves by the electromagnetic shielding member.

The invention provides a stacked structure of circuit boards applied to a data storage device. The stacked structure comprises a main circuit board and a slave circuit board. The main circuit board comprises a controller, a plurality of flash memories, a first connector, and a first transmission interface. The slave circuit board comprises an operation management chip, a second connector, and a second transmission interface. The operation management chip comprises a microprocessor and a network communication element. The slave circuit board is stacked on the main circuit board, and connected to the first connector of the main circuit board via the second connector. When the slave circuit board receives a specific operation instruction, the microprocessor of the slave circuit board will transmit the specific operation instruction to the electronic apparatus via the second transmission interface, the electronic apparatus executes a corresponding operation according to the specific operation instruction.

An electronic device includes a housing, a first printed circuit board (PCB) provided within the housing, a second PCB provided within the housing, and a battery. The second PCB is separate and distinct from the first PCB and is communicatively coupled to the first PCB. The battery is located in a space separating the first PCB and the second PCB. The battery is configured to provide power to the first PCB and the second PCB.

An electromagnetic interference (EMI) shielded device which includes an object to be shielded and an EMI shielding material encompassing the object. The EMI shielding material is made up of, but not limited to a broadband biopolymer or polymer dissolved in organic solvents, and metal and carbon-based nano-powders or nanoparticles. The specific makeup of the shielding material and fabrication procedure of the shielding material is also included herein.

According to various embodiments, an electronic device may include a housing, and a display disposed to at least part of the housing. The display may include a display panel including at least one pixel, and a substrate layer disposed below the display panel. The substrate layer may include a bendable connecting area extending to the outside of the display panel. The display may further include a display driving circuit disposed to one face of the connecting area, a Flexible Printed Circuit Board (FPCB) electrically coupled with at least part of the connecting area and including a contact area to which a conductor electrically coupled with a ground portion of the electronic device is exposed, and a shielding member electrically coupled with the contact area. The shielding member may be disposed on the FPCB and one face of the connecting area to cover at least part of the display driving circuit. Various other embodiments may also be possible.

Disclosed are a housing for receiving an electronic device and an electronic system having the same. The electronic system includes a case having lower and upper cases detachably combined with the lower case, a circuit board arranged in an inner space of the case and secured to the lower case such that at least a grounding line and at least a connection line are provided with the circuit board, a plurality of devices arranged on the circuit board such that each device is separated from one another by the grounding line and is connected with one another by the connection line, and at least an electromagnetic shielding member embedded onto the upper case such that the electromagnetic shielding member is in contact with the grounding line around the device to provide a shielding space receiving the device. The device is protected from unexpected electromagnetic waves by the electromagnetic shielding member.

Apparatus related to conformal coating implemented with surface mount devices. In some embodiments, a radio-frequency (RF) module includes a packaging substrate configured to receive a plurality of components. The RF also includes a surface mount device (SMD) mounted on the packaging substrate, the SMD including a metal layer that faces upward when mounted. The RF module further includes an overmold formed over the packaging substrate, the overmold dimensioned to cover the SMD. The RF module further includes an opening defined by the overmold at a region over the SMD, the opening having a depth sufficient to expose at least a portion of the metal layer. The RF module further includes a conformal conductive layer formed over the overmold, the conformal conductive layer configured to fill at least a portion of the opening to provide an electrical path between the conformal conductive layer and the metal layer of the SMD.

A circuit board includes a first rigid printed wiring board mounted with an imaging unit, a second rigid printed wiring board mounted with an LED, and a foldable first flexible printed wiring board coupling the first rigid printed wiring board and the second rigid printed wiring board. A shield case is further included for holding the second rigid printed wiring board in a state in which the first flexible printed wiring board is folded an even number of times, a first main face of the second rigid printed wiring board and a first main face of the first rigid printed wiring board face in an identical direction, and the second rigid printed wiring board lies at a separated position from the first main face of the first rigid printed wiring board.

Various embodiments of a wireless connector system are described. The system has a transmitter module and a receiver module that are configured to wirelessly transmit electrical energy and/or data via near field magnetic coupling. The wireless connector system is designed to increase the amount of wirelessly transmitted electrical power over a greater separation distance. The system is configured with various sensing circuits that alert the system to the presence of the receiver module to begin transfer of electrical power as well as undesirable objects and increased temperature that could interfere with the operation of the system. The wireless connector system is a relatively small foot print that is designed to be surface mounted.