A module includes a wiring substrate; a component; a metal pin attached to a land electrode formed at one main surface and has a first extending portion extends from the one main surface, a second extending portion that is bent and extends from one end of the first extending portion on an opposite side from the one end surface, and a third extending portion that is bent and extends from one end of the second extending portion on an opposite side from the first extending portion to approach the one main surface; a sealing resin layer that covers the one main surface, the component, and the metal pin; and a shield layer that covers a side surface of the wiring substrate, a surface of the sealing resin layer, and the upper surface and the side outer surface of the metal pin.

An electronic device including a shield structure is provided. The electronic device includes a first device including a first magnetic substance, a second device including a second magnetic substance, and a shield structure configured to shield at least part of a magnetic force generated between the first magnetic substance and the second magnetic substance, wherein the shield structure includes a shield member disposed between the first device and the second device and including a property of a magnetic substance, and a connecting member physically connected to at least part of the shield member and including a property of a nonmagnetic substance, wherein at least part of the connecting member is physically connected to a circuit board.

An electronic module having at least two electronic components mounted on a substrate. The electronic components are covered by a dielectric material. The dielectric material has a recess between adjacent electronic components. The surface of the recess facing at least one electronic component is coated with a conductive layer while the opposite surface to that coated recess surface is substantially free of a conductive layer. Also disclosed is a process for making the above-specified electronic module.

Disclosed is an electromagnetic wave shielding structure. The electromagnetic wave shielding structure comprises: a printed circuit board having a plurality of elements mounted therein and having a ground pad surrounding the plurality of elements; an insulation member made of a pre-molded insulating material and attached to the printed circuit board to surround the plurality of elements; and a conductive coating layer covering an exterior surface of the insulation member, wherein the conductive coating layer is connected to the ground pad.

An electronic device module includes: a substrate; at least one electronic device mounted on a first surface of the substrate; a connection portion mounted on the first surface of the substrate; and a shielding portion disposed along an external surface of the connection portion and electrically connected to a ground of the substrate through at least one connection conductor.

A module includes a wiring board having a first main surface, a first component mounted on the first main surface and having a first height H1, a second component mounted on the first main surface and having a second height H2 lower than the first height H1, and a sealing resin arranged so as to cover the first component and the second component while covering the first main surface. Compared to a first connection terminal used for connection between the first component and the first main surface, a second connection terminal used for connection between the second component and the first main surface has a higher height. A surface of the first component on a side far from the first main surface and a surface of the second component on a side far from the first main surface are exposed from the sealing resin.

A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.

A device to support a cooking container for a smart under range being installed under a lower surface of a table comprises a body pad, a cooking container supporting part placed on the body pad, a temperature sensing part placed inside the body pad, a transmitting circuit part provided inside the body pad and transferring a temperature sensed by the temperature sensing part to an outside, and a power supply part supplying power to the transmitting circuit part.

Various embodiments of a wireless connector system are described. The system has a transmitter module and a receiver module that are configured to wirelessly transmit electrical energy and/or data via near field magnetic coupling. The wireless connector system is designed to increase the amount of wirelessly transmitted electrical power over a greater separation distance. The system is configured with various sensing circuits that alert the system to the presence of the receiver module to begin transfer of electrical power as well as undesirable objects and increased temperature that could interfere with the operation of the system. The wireless connector system is a relatively small foot print that is designed to be surface mounted.

Various embodiments of a wireless connector system are described. The system has a transmitter module and a receiver module that are configured to wirelessly transmit electrical energy and/or data via near field magnetic coupling. The wireless connector system is designed to increase the amount of wirelessly transmitted electrical power over a greater separation distance. The system is configured with various sensing circuits that alert the system to the presence of the receiver module to begin transfer of electrical power as well as undesirable objects and increased temperature that could interfere with the operation of the system. The wireless connector system is a relatively small foot print that is designed to be surface mounted.