Apparatus and method for providing an electromagnetic interference (EMI) shield for removable engagement with a printed circuit board (PCB). A shaped electrically conductive member has a substantially planar member portion with multiple lateral member edges. The sidewalls are disposed at respective lateral member edges and are substantially orthogonal to the substantially planar member portion. At least one of the sidewalls includes at least one first snap-fit latching feature to engage a respective complementary second snap-fit latching feature disposed at one or more of multiple peripheral portions of a PCB.

A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

A heat sink for cooling an electronic component includes a substrate comprising an electrically non-conductive material and an inlet port and an outlet port extending outward from the substrate. The inlet and outlet ports are fluidically coupled to a fluid flow surface of the heat sink by passages that extend through a portion of the substrate. The heat sink also includes a shield comprising an electrically conductive material. The shield is disposed atop or within the substrate and is configured to suppress electromagnetic interference generated by an electronic component coupled to the heat sink.

A device for cooling an electronic component includes a substrate having a component mounting surface and a fluid flow surface recessed relative to the component mounting surface. The device also includes an inlet orifice positioned proximate a first end of the fluid flow surface and an outlet orifice positioned proximate a second end of the fluid flow surface. A pattern of surface features is arranged on the fluid flow surface. The pattern of surface features is configured to entrain a coolant flowing across the fluid flow surface and redirect the coolant upward and away from the fluid flow surface.

The present disclosure relates to an interposer. The interposer includes: a support body formed of a ceramic material, a connection electrode configured to the top surface and bottom surface of the support body, and a shielding member disposed at an outer surface of the support body. At least a part of the support body is disposed along the edge of a substrate, and electrically connects the substrate and a substrate. The interposer is formed of a ceramic material and thus make it possible to implement a fine pattern, to improve dimensional stability by preventing the bending deformation of ceramic green sheets, and to raise the reliability of signal transmission. Therefore, the interposer can contribute to implementing high performance of an electronic device and reducing the size of the electronic device.

An electromagnetic interference (EMI) shielded device which includes an object to be shielded and an EMI shielding material encompassing the object. The EMI shielding material is made up of, but not limited to a broadband biopolymer or polymer dissolved in organic solvents and shielding guest material. The specific makeup of the shielding material and fabrication procedure of the shielding material is also included herein.

A high-frequency module includes a wiring board, a component that is mounted on an upper surface of the wiring board, a sealing resin layer that is laminated on the upper surface of the wiring board and that seals the component, a first shield layer that is laminated on the sealing resin layer so as to cover an opposite surface of the sealing resin layer and a peripheral side surface of the sealing resin layer, the opposite surface being opposite to the upper surface of the wiring board, and a second shield layer that is laminated on a portion of the first shield layer that covers the peripheral side surface of the sealing resin layer. In this case, even if the first shield layer cannot be made thick enough for obtaining desired shield characteristics, the second shield layer can provide a thickness corresponding to the insufficient thickness.

A computing component is described. The computing component includes a cosmetic prefabricated sheet of material. In some embodiments, the cosmetic prefabricated sheet of material may have a cosmetic surface and a protrusion surface. The computing component includes a protrusion extending from the protrusion surface of the cosmetic prefabricated sheet of material. In some embodiments, the cosmetic surface of the cosmetic prefabricated sheet of material is uniform in appearance to the naked eye. In some embodiments, the protrusion may have a base and an end. The base may have a cross-sectional width and the end may have a cross-sectional width. A difference in the cross-sectional width of the base and the cross-sectional width of the end may be less than 250 microns.

An electrical device includes an electrical conductor and a printed circuit board assembly (PCBA). The PCBA includes a planar substrate having first and second primary surfaces. The second primary surface is adjacent to the electrical conductor. A point field detector is mounted to the first primary surface. A magnetic shielding array is constructed of a magnetic material, e.g., having a relative magnetic permeability of about 100-1000. The magnetic shielding array is mounted to or situated on the first and/or second primary surface of the planar substrate, and includes first and second flux shield portions flanking the point field detector. The point field detector and the magnetic shielding array are both located on the same side of the electrical conductor with respect to each other.

A first trench is formed in a first sealing resin layer, which seals first electronic components and second electronic components on one main surface of a circuit board, and a second trench is formed in a second sealing resin layer, which seals third electronic components and fourth electronic components on another main surface. The first trench is formed between the first electronic components and the second electronic components when viewed in plan view, extending from an upper surface of the first sealing resin layer toward a surface opposite from the one main surface of the first sealing resin layer, and the second trench is formed between the third electronic components and the fourth electronic components when viewed in plan view, extending from a lower surface of the second sealing resin layer toward a surface opposite from the other main surface of the second sealing resin layer.