Provided is an electronic equipment which can effectively reduce unexpected unnecessary radiation. In the electronic equipment, a circuit board on which a noise source that is an electronic part becoming a source of the unnecessary radiation is mounted and a circuit board mounting plate on which the circuit board is mounted are disposed substantially parallel with a space put therebetween. In the electronic equipment, a partition plate is disposed, which functions as a noise reflecting surface on which an indirect wave emitted from the noise source towards the circuit board mounting plate is reflected. Further, an indirect wave dispersing member is disposed between the circuit board and the circuit board mounting plate so as to block spacing between the noise source and the partition plate.

An electronic device and a shielding film are disclosed herein. The electronic device includes a printed circuit board and at least one electrical component mounted on the printed circuit board. The shielding film is disposed on at least a part of the printed circuit board to block electromagnetic waves generated by the printed circuit board and/or the electronic component. The shielding film includes a plurality of layers, and is attached to at least part of the printed circuit board and contacting an upper side surface of the electronic component, wherein at least part of the shielding film includes a nano-conductive fiber and is electrically connected with a ground part of the printed circuit board through the nano-conductive fiber.

An integrated circuit (IC), a display device and an anti-interference method thereof are provided. The IC includes an input pad, a source driving circuit and an anti-interference circuit. The input pad receives an input signal comprising image data from the external. The source driving circuit is coupled to the input pad to receive the input signal. The anti-interference circuit is coupled to the input pad to provide a variable capacitance. The anti-interference circuit adjusts the variable capacitance from a normal capacitance value to at least one anti-interference capacitance value when an interference event occurs to the input signal. The anti-interference circuit maintains the variable capacitance at the normal capacitance value when the interference event does not occur.

A cooling assembly for an IOT wireless gateway device that includes a motherboard structure operatively coupled to one side of a first motherboard component, which is operatively coupled on the other side to one side of a first gap pad for conducting heat, an EMI shield operatively coupled to the other side of the first gap pad and surrounding the sides of the first motherboard component, the EMI shield also operatively coupled to the motherboard structure, the outside of the EMI shield operatively coupled to one side of a second gap pad for conducting heat, and a first heat sink operatively coupled to the other side of the second gap pad for conducting heat.

An electronic device may include a printed circuit board (PCB) including at least one electronic component, and an electrically conductive enclosure surrounding the at least one electronic component to provide electromagnetic interference (EMI) shielding for the at least one component. The electrically conductive enclosure may include a frame, made of a resilient, electrically conductive material, on a mounting surface of the PCB, surrounding the at least one component, and an electrically conductive shielding cover extending across an open top area defined by the frame. The frame may be attached to the PCB and the cover by an electrically conductive material to provide for electrical continuity. The frame may be made of a resilient, electrically conductive material so that the frame may compress in response to an externally applied force, and may return to an original, non-compressed form upon removal of the externally applied force.

An improved F-connector can be mounted perpendicularly on a printed circuit board to reduce radiated emissions by using an integrated shield flange on the F-connector body. The improved F-connector is attached to a shield frame that is part of an RF shield containment box mounted on the printed circuit board. In one embodiment, the shield flange is integral to the improved F-connector body and is manufactured to fill the gap between an RF shield frame and a corresponding RF shield cover. The improved F-connector with integral shielding flange mounted on the shield frame utilizes the shield flange of the improved F-connector to fill the physical gaps between the shield cover the improved F-connector. With reduced or eliminated physical gaps, the radiated emission of the assembly are either reduced or eliminated.

A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

An electronic device module includes: a substrate; at least one electronic device mounted on a first surface of the substrate; a connection portion mounted on the first surface of the substrate; and a shielding portion disposed along an external surface of the connection portion and electrically connected to a ground of the substrate through at least one connection conductor.

An electromagnetic interference (EMI) shielded device which includes an object to be shielded and an EMI shielding material encompassing the object. The EMI shielding material is made up of, but not limited to a broadband biopolymer or polymer dissolved in organic solvents and shielding guest material. The specific makeup of the shielding material and fabrication procedure of the shielding material is also included herein.

An interposer substrate includes a metal member; and a connection substrate disposed on at least portion of one side surface of the metal member. The connection substrate includes circuit patterns exposed from each of one surface of the connection substrate and the other surface of the connection substrate opposing the one surface, and one of a plurality of side surfaces of the connection substrate connecting one side and the other side of the connection substrate is attached to at least a portion of the one side surface of the metal member.