A hard drive enclosure with functionality of quick-release, is for application in a host computer, and comprises: an accommodating unit, a plurality of removable units, a connection inter face module, and a connection module. Wherein the accommodating unit has an accommodating space and a receiving opening. And the plurality of removable units is inserted into the accommodating space through the receiving opening, and each of the plurality of removable units carries with a storage device. In the present invention, according to particular design of electrical connectors constituted by printed circuit board assembly, so as to improve insufficient space for electrical routing. In other words, the hard drive enclosure of the present invention includes advantages of decreasing assembly time and low production cost.

Wireless electronic devices include one or more wireless antennas to provide for wireless communications. The antenna cables are routed internally within the device and typically noise from components located on a circuit board may couple to the antenna cables and cause a degradation in wireless performance, impact antenna sensitivity and cause packet loss. Utilizing raised pathways in a heat sink utilized for thermal transfer of heat to a housing enables tunnels to be formed between the housing and the heat sink. Routing the antenna cables through the tunnels improves noise isolation for the antenna cables while still maintaining the heat transfer. The raised pathways are configured to not interfere with components on the circuit board or components included in the housing. The wireless antennas may be mounted within the housing instead of on the board so no portion of the antenna cables are located on the circuit board.

An electronic device includes a printed board, a frame for fixing the printed board, a connector fixed at a position along one side of a front surface of the printed board, and an electrically conductive member. An indented portion is formed at a position of the one side facing the connector. The electrically conductive member has a portion arranged in the indented portion, and is expanded and contracted in a direction along the one side and a thickness direction of the printed board by an external force. The electrically conductive member has an upper surface, a lower surface, and a side surface in contact, respectively, with a shell of the connector, one surface of the frame, at least one side-surface portion which is part of a portion forming the indented portion and extends along a direction crossing the one side. The electrically conductive member is electrically connected with a ground of the printed board via the side-surface portion.

An electronic device having a shielding structure disposed around electronic components and having high heat dissipation performance is provided. The electronic device includes a circuit board, at least one electronic component mounted on a surface of the circuit board, a shielding sheet attached to the surface of the circuit board to cover the at least one electronic component, a thermal interface material stacked on the shielding sheet to overlap the at least one electronic component, and a heat dissipation member disposed to face the surface of the circuit board, being in surface contact with the thermal interface material, and fastened to at least a portion of the circuit board by a fixing member. Various other embodiments may be possible.

A module includes: a substrate having a main surface and a side surface; an electronic component mounted on the main surface; a sealing resin that covers the main surface and the electronic component; and a shield film that covers a surface of the sealing resin and the side surface of the substrate. The sealing resin includes: a resin component containing an organic resin as a main component; and a granular filler containing an inorganic oxide as a main component. On a surface of the sealing resin, which is in contact with the shield film, parts of some grains of the filler are exposed from the resin component, a surface of the resin component includes a nitrogen functional group, and the shield film is formed of a metal that is a passivation metal and a transition metal or an alloy containing the metal.

Disclosed are a housing for receiving an electronic device and an electronic system having the same. The electronic system includes a case having lower and upper cases detachably combined with the lower case, a circuit board arranged in an inner space of the case and secured to the lower case such that at least a grounding line and at least a connection line are provided with the circuit board, a plurality of devices arranged on the circuit board such that each device is separated from one another by the grounding line and is connected with one another by the connection line, and at least an electromagnetic shielding member embedded onto the upper case such that the electromagnetic shielding member is in contact with the grounding line around the device to provide a shielding space receiving the device. The device is protected from unexpected electromagnetic waves by the electromagnetic shielding member.

A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.

An electronic control device includes a housing that stores a substrate on which an electronic component is mounted, a first capacitance unit formed between the housing and the electronic component, and a second capacitance unit formed between the housing and the substrate, in which a noise transmission path is formed between the housing and the substrate via the first capacitance unit and the second capacitance unit.

A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.

An electronic device and a shielding film are disclosed herein. The electronic device includes a printed circuit board and at least one electrical component mounted on the printed circuit board. The shielding film is disposed on at least a part of the printed circuit board to block electromagnetic waves generated by the printed circuit board and/or the electronic component. The shielding film includes a plurality of layers, and is attached to at least part of the printed circuit board and contacting an upper side surface of the electronic component, wherein at least part of the shielding film includes a nano-conductive fiber and is electrically connected with a ground part of the printed circuit board through the nano-conductive fiber.