The invention relates to a circuit board (1), preferably for a circuit for operating a lighting means, comprising a retaining bow (2), which is arranged on a planar top side (11) of the circuit board (1) and mechanically connected to the circuit board (1); and comprising a through-bore (3), which is arranged at least partially below the retaining bow (2); wherein the through-bore (3) has at least one taper (31) and wherein a housing (5) for protecting the circuit board (1) can be mechanically fastened by means of the retaining bow (2) and the taper (31). The retaining bow (2) is arranged on the circuit board (1) by means of a solder joint (32). The invention further relates to a system for a circuit for operating a lighting means and to a method for fastening a housing (5) to a circuit board (1).

An electronic apparatus having noise suppression mechanism is provided that includes a circuit board, a wireless communication circuit, a digital signal generation circuit, a metal shield and a grounding metal pillar. The wireless communication circuit is disposed on a chip disposing area of the circuit board and performs wireless communication within a wireless signal frequency range. The digital signal generation circuit is disposed on the chip disposing area and generates a digital signal transmitted through a transmission path within the chip disposing area. The metal shield is coupled to the circuit board to cover the chip disposing area. The grounding metal pillar is disposed on the chip disposing area of the circuit board. The grounding metal pillar extends for contacting the metal shield and increases a resonant frequency of the metal shield.

A wireless communication module with improved performance and a mobile object that is equipped with the wireless communication module with the improved performance are provided. The mobile object is equipped with a wireless communication module. The wireless communication module includes a substrate, a first element, and a second element. The substrate includes ground layers. The first element is arranged on the substrate and amplifies an input RF signal. The second element is arranged on the substrate and different from the first element. Each of the ground layers has a groove formed between the first element and the second element.

A receiver or transmitter designed for a broad range of frequencies requires a pre-select filter for incoming signals or a post-select filter for outgoing signals to minimize spurious signal responses. In conventional receivers, several discrete RF filters are used and a switched filter bank is created utilizing a large amount of space. A filter bank comprising a plurality of stacked shielded filters would enable different filter technologies and topologies to be used together, as other passive and active circuits may be combined into the one surface mountable component in order to save on PCB space.

A printed board including an external interface, a frame ground trace electrically connected to the external interface, a circuit member spaced from the frame ground trace, and a resonance trace disposed between the frame ground trace and the circuit member with a gap present between the resonance trace and the frame ground trace. The resonance trace is connected to the circuit member at at least two positions. The resonance trace and the circuit member together form a loop member configured in the form of a closed circuit of the resonance trace and the circuit member.

An electrical device (1) is provided, comprising an electrical high-frequency filter (9) and a shield (6) separating the filter from at least one further electrical component (9, 13) of the device, a signal conductor (17) which operably connects the filter (9) to the further component (9, 13) and traverses the shield (6) for transmitting a signal from the filter (9) to the component (9, 13) and a feedthrough capacitor system (19) being electrically arranged between the signal conductor (17) and the shield (6). The feedthrough capacitor system (19) comprises, in particular being formed essentially by, a plurality of surface mount capacitors (41) electrically arranged between the signal conductor (17) and the shield (6), the surface mount capacitors (41) in particular being surface mounted on a circuit board (11), which may be a printed circuit board.

An electronic control unit includes; a circuit board including a plurality of layers, the layers including a plurality of ground layers having different thicknesses from one another; a drain line connected to the circuit board; a switching device configured to selectively connect the drain line to one of the plurality of ground layers based on a frequency of an electromagnetic wave inside a vehicle cabin; and a controller configured to control the connection of the switching device based on the frequency of the electromagnetic wave inside the vehicle cabin.

A printed circuit board (PCB) stack having a plurality of layers is received. A conformal coating layer is applied to one or more external layers of the plurality of layers. A conductive ink is applied to one or more portions of the protective conformal coating layer to form one or more conductive features on the protective conformal coating layer.

Apparatuses and associated methods for mounting PCBs and other electronics boards in portable medical equipment and/or other portable and non-portable electronic devices are disclosed herein. In some embodiments, the technology disclosed herein can provide PCB mounting systems that isolate the PCB from detrimental shock, vibration, and/or strain, while also providing electrical ground paths that greatly reduce EMI and other electrical disturbances. Some embodiments of the mounting systems described herein include both elastomeric (e.g., rubber) components and resilient metallic grounding members that, when assembled together, provide favorable shock mounting as well as robust electrical grounding without the inconvenience of using separate shock mounts, grounding straps, etc.

An apparatus for grounding a heat sink utilizing shape-memory alloy includes a printed circuit board, a logic chip, a heat sink, and a first grounding member, wherein the first grounding member is a shape-memory alloy. The apparatus further includes the logic chip electrically coupled to the printed circuit board and the heat sink disposed on a top surface of the logic chip. The apparatus further includes a first end of the first grounding member electrically coupled to the heat sink, wherein a second end of the grounding first member is disposed on a first ground land of the printed circuit board.