Disclosed is a composite comprising from about 50 wt. % to about 97 wt. % of a thermoplastic resin, wherein the thermoplastic resin comprises a polyester; and from about 3 wt. % to about 15 wt. % of a carbon-based filler, wherein the carbon-based filler has a primary surface area of from about 500 to about 1000 m.sup.2/g, wherein the composite exhibits a dielectric constant ε′ of between 5 and 30 and a dissipation loss ε″ of between 0.5 and 45, measured at frequencies between about 10 and about 120 GHz. A molded sample of the composite exhibits a percent reflected power measured in transmission mode of at least 15% when observed according to a Free Space method at frequencies from about 75 GHz to 110 GHz.

The present invention provides an electromagnetic wave shielding film that can be made thinner and that has a higher folding endurance. The electromagnetic wave shielding film of the present invention is an electromagnetic wave shielding film including: a conductive adhesive layer containing conductive particles and an adhesive resin composition, wherein in a cut surface of the conductive adhesive layer after heating and pressurizing the electromagnetic wave shielding film at 150° C. and 2 MPa for 30 minutes, the conductive particles have an average aspect ratio of 18 or more, and an area percentage of the adhesive resin composition is 60 to 95% relative to a total area of the cut surface.

An electromagnetic wave absorbing particle dispersoid is provided that includes at least electromagnetic wave absorbing particles and a thermoplastic resin, wherein the electromagnetic wave absorbing particles contain hexagonal tungsten bronze having oxygen deficiency, wherein the tungsten bronze is expressed by a general formula: M.sub.xWO.sub.3-y (where one or more elements M include at least one or more species selected from among K, Rb, and Cs, 0.15≤x≤0.33, and 0<y≤0.46), and wherein oxygen vacancy concentration N.sub.V in the electromagnetic wave absorbing particles is greater than or equal to 4.3×10.sup.14 cm.sup.−3 and less than or equal to 8.0×10.sup.21 cm.sup.−3.

Provided is an electromagnetic wave shielding film capable of reducing a space formed between the electromagnetic wave shielding film and an electronic component on a wiring substrate and to increase an electromagnetic wave shielding effect. An electromagnetic wave shielding film 1 includes a conductive layer 3 having stretchability and a property of hardly returning to an original state thereof when once stretched, and an adhesion layer 4 formed on one surface of the conductive layer 3 and having insulating properties. The conductive layer 3 is made of a conductive composition, including a resin having stretchability and a property of hardly returning to an original state thereof when once stretched and a conductive filler filled with the resin. The resin has a tensile permanent set of 2.5% or more and 90% or less.

Disclosed is a localized shield to protect integrated circuit (IC) components within a package module from electromagnetic interference (EMI). Conventional EMI shielding solutions, such as a compartment shield, protect an entire package but do not provide localized protection or grounding of IC components. To construct the EMI shield disclosed herein, a layer of conductive epoxy is deposited on an upper conductive surface of the IC component, then the component is encapsulated in mold compound. Excess mold compound is ground down to expose the epoxy layer, and a conformal shield layer is applied over the mold compound such that the conductive epoxy layer forms a ground path between the conformal shield and the conductive surface of the IC component.

Disclosed is a localized shield to protect integrated circuit (IC) components within a package module from electromagnetic interference (EMI). Conventional EMI shielding solutions, such as a compartment shield, protect an entire package but do not provide localized protection or grounding of IC components. To construct the EMI shield disclosed herein, a layer of conductive epoxy is deposited on an upper conductive surface of the IC component, then the component is encapsulated in mold compound. Excess mold compound is ground down to expose the epoxy layer, and a conformal shield layer is applied over the mold compound such that the conductive epoxy layer forms a ground path between the conformal shield and the conductive surface of the IC component.

A composite article includes a lightning strike protection coating on a composite substrate. The lightning strike protection coating is formed from electrically conductive material and includes protrusions spaced along the length and width of a portion of the substrate surface. To form the lightning strike protection coating, a form is pressed against electrically conductive coating material on the composite substrate while the electrically conductive coating material is flowable. For example, the form can be a release film used in a composite vacuum bagging process. Suitable release film can have depressions along an inner surface that define an imprint of the coating protrusions. After curing, the coating can be covered with a layer of paint that conceals the protrusions but still allows lightning streamers to penetrate the paint at the protrusions.

An electrically conductive composite powder having improved corrosion resistance is provided for microwave shielding applications. The electrically conductive composite powder composition includes a core of particles having a low density and a high dielectric constant; a nickel layer that is coated onto the core of particles; and a corrosion resistant alloy layer that is deposited onto the nickel layer. The electrically conductive composite powder exhibits excellent corrosion resistance performance, while also being substantially lower in cost that conventional Ag/glass shields. The electrically conductive composite powder can be used across a broad frequency range.

An electronic device is provided. The device comprises a singulated carrier portion, a substrate molded onto the singulated carrier portion, and conductive traces disposed on the substrate. The substrate comprises a polymer composition that includes an aromatic polymer and an electrically conductive filler, wherein the polymer composition exhibits a surface resistivity of from about 1×10.sup.12 ohms to about 1×10.sup.18 ohms as determined in accordance with ASTM D257-14.

Semiconductor device package assemblies and associated methods are disclosed herein. The semiconductor device package assembly includes (1) a base component having a front side and a back side, the base component having a first metallization structure at the front side; (2) a semiconductor device package having a first side, a second side with a recess, and a second metallization structure at the first side and a contacting region exposed in the recess at the second side; (3) an interconnect structure at least partially positioned in the recess at the second side of the semiconductor device package; and (4) a thermoset material or structure between the front side of the base component and the second side of the semiconductor device package. The interconnect structure is in the thermoset material and includes discrete conductive particles electrically coupled to one another.