A molded interconnect device that comprises a substrate and conductive elements disposed on the substrate is provided. The substrate comprising a polymer composition containing a polymer matrix that includes a thermotropic liquid crystalline polymer and from about 10 parts to about 80 parts by weight of a mineral filler per 100 parts by weight of the polymer matrix. The mineral filler has an average diameter of about 25 micrometers or less. The polymer composition contains copper in an amount of about 1,000 parts per million or less and chromium in an amount of about 2,000 parts per million or less, and further exhibits a surface resistivity of about 1×1014 ohm or more.

The objective of the present teaching is to provide a porous material including carbon nanohorns. The porous material includes carbon nanohorns and has a predetermined three-dimensional shape.

The present disclosure provides a flexible circuit board and a display panel. The flexible circuit board is in a non-display region of a display panel and provided with a driving circuit for driving the display panel thereon. The flexible circuit board includes a first main body portion, a second main body portion, and a foldable portion, and the foldable portion is between the first main body portion and the second main body portion. The foldable portion is capable of being bent to fold the second main body portion such that the second main body portion overlaps the first main body portion.

A process for preparing an electrically conductive, adhesive tape that includes: (a) providing an article comprising a substrate and a network of electrically conductive metal traces defining cells that are transparent to visible light on the substrate; (b) embedding the network of electrically conductive traces in a polymer matrix having a surface on which a pressure sensitive adhesive is deposited; and (c) removing the substrate to form the electrically conductive, adhesive tape.

A tangible device such as a credit card shaped device that includes at least one waffler carved therein. A bottom stabilizing material in the shape of a film or sheet is placed within the waffler. A nano-scaled metal in powdered form that is ferromagnetic in nanoscale, such as gold, is then added above the bottom stabilizing film. A ferromagnetic powder in nanoscale is added to the nano-scaled metal and a top stabilizing film is placed thereon. Ceramic powder is then used to further stabilize the composition and finally all the components are sealed within the waffler. The nano-scaled metals can be affixed to the stabilizing films using atomic layer deposition. The present invention is used to neutralize the electromagnetic contamination emitted from a plurality of electronic devices by organizing the polarity of the spin of the element particles within their radiation.

An electromagnetic wave absorbing laminated transparent base material includes a plurality of sheets of transparent base materials; and an electromagnetic wave absorbing particle dispersoid including at least electromagnetic wave absorbing particles and a thermoplastic resin. The electromagnetic wave absorbing particles contain hexagonal tungsten bronze having oxygen deficiency. The tungsten bronze is expressed by a general formula: M.sub.xWO.sub.3−y (where one or more elements M include at least one or more species selected from among K, Rb, and Cs, 0.15≤x≤0.33, and 0<y≤0.46). Oxygen vacancy concentration N.sub.V in the electromagnetic wave absorbing particles is greater than or equal to 4.3×10.sup.14 cm.sup.−3 and less than or equal to 8.0×10.sup.21 cm.sup.−3. The electromagnetic wave absorbing particle dispersoid is arranged between the plurality of sheets of the transparent base materials.

The present disclosure relates to a radar apparatus including a circuit board provided inside a housing having an upper side open, and on which an RF element is mounted on an upper surface, and a cavity having an open lower side and coupled to the upper surface of the circuit board for accommodating the RF element, wherein the cavity includes a coupling portion extending downwardly in a region of a surface coupled to the circuit board, and the coupling portion is inserted into a coupling hole formed in the circuit board to contact a ground plane of the circuit board.

An electromagnetic interference (EMI) shielded device which includes an object to be shielded and an EMI shielding material encompassing the object. The EMI shielding material is made up of, but not limited to a broadband biopolymer or polymer dissolved in organic solvents and shielding guest material. The specific makeup of the shielding material and fabrication procedure of the shielding material is also included herein.

A magnetic field shielding structure includes a magnetic field generating source configured to generate a magnetic field. The magnetic field shielding structure further includes a shielding member that includes a pair of layers. The pair of layers includes a layer having high magnetic permeability, and a layer having low magnetic permeability laminated with the layer having high magnetic permeability. The layer having high magnetic permeability is closer to the magnetic field generating source than the layer having low magnetic permeability.

An example control component for controlling an engine component includes a housing. The housing defines a cavity configured to receive control circuitry configured to control the engine. The housing includes an exterior layer defining an exterior surface of the housing and an interior polymeric layer defining an interior surface of the housing. The interior polymeric layer is adjacent to and substantially coextensive with the exterior layer. The interior polymeric layer includes an electrically and thermally conductive material. An example technique includes forming the exterior layer and forming the interior polymeric layer.