A radio wave absorber including: a support; and a linear absorber that is disposed on at least one surface of the support, has an occupancy per unit volume on the support of 0.05 to 0.70, includes a radio wave absorption material and a binder, and has a maximum length on a cross section perpendicular to a longitudinal direction of 25% or less of a wavelength of the radio wave, and a manufacturing method thereof.

An electromagnetic wave absorber includes ground carbon particles derived from carbon nanotubes. With such a configuration, the electromagnetic wave absorber achieves both stretchability and electrical conductivity.

The invention relates to a composite material for shielding electromagnetic radiation, a raw material for additive manufacturing methods and a product comprising the material as well as a method of manufacturing the product. The composite material according to the invention can serve as a material protecting electronic elements, electronic devices or living organisms from electromagnetic radiation in the microwave and terahertz range (0.3-10000 GHz).

A method of forming a metal magnetic film includes forming the metal magnetic film by a plating process, wherein the metal magnetic film comprises a permalloy and carbon atoms and a content of the carbon atoms is 0.3 to 3.0 at % based on a total amount of the carbon atoms and metal elements.

A shield package is disclosed including: a package in which an electronic component is mounted on a substrate, the electronic component being sealed with sealing material; and a shield layer including a first layer and a second layer that are sequentially laminated on the package, in which the first layer made from a conductive resin composition having 100 parts by mass of a binder component, 400 parts by mass to 1800 parts by mass of metal particles, and 0.3 part by mass to 40 parts by mass of a curing agent, the metal particles include at least spherical metal particles and flaky metal particles, and the second layer made from a conductive resin composition containing a binder component, metal particles haying an average particle diameter of 10 nm to 500 nm, metal particles having an average particle diameter of 1 μm to 50 μm, and a radical polymerization initiator.

A method, system and paint for suppressing emission of high frequency electromagnetic radiation from an electronic system, the electronic system including at least one power supply unit, at least one printed circuit board (PCB) and at least one integrated circuit are provided. The method includes providing an electrically conductive housing configured to accommodate and encase the electronic system, the housing having an inner conductive surface, and applying a layer of an electromagnetic absorbing paint to the inner conductive surface of the housing to substantially cover the inner surface by the layer, the electromagnetic absorbing paint comprises a liquid matrix and an electromagnetic absorbing material.

Disclosed are exemplary embodiments of thermally-conductive electromagnetic interference (EMI) absorbers including aluminum powder.

An electromagnetic wave absorbing sheet includes a metallic base and an electromagnetic wave absorption film formed on the metallic base. The electromagnetic wave absorption film contains MTC-substituted ε—Fe.sub.2O.sub.3, black titanium oxide, a conductive filler, and a resin. The MTC-substituted ε—Fe.sub.2O.sub.3 is a crystal belonging to the same space group as an ε—Fe.sub.2O.sub.3 crystal and containing Ti, Co, Fe, and at least one element selected from the group consisting of Ga, In, Al, and Rh. The proportion of the conductive filler to the electromagnetic wave absorption film is equal to or greater than 0.1% by volume and equal to or less than 10% by volume.

According to various aspects, exemplary embodiments are disclosed of thermally-conductive EMI absorbers that generally includes thermally-conductive particles, EMI absorbing particles, and silicon carbide. The silicon carbide is present in an amount sufficient to synergistically enhance thermal conductivity and/or EMI absorption. By way of example, an exemplary embodiment of a thermally-conductive EMI absorber may include silicon carbide, magnetic flakes, manganese zinc ferrite, alumina, and carbonyl iron.

Provided is a wind turbine, including a hollow tower carrying a nacelle, and at least one power electronics component emitting electromagnetic waves during operation, in particular an inverter located at the bottom of the tower, wherein the tower acts as a wave guide for an electromagnetic wave generated by the power electronics component, wherein the tower comprises at least one absorber element at least reducing the transport of the electromagnetic wave of the power electronics component along the tower.