Patent classifications
H05K9/0088
Encapsulated Circuit Module, And Production Method Therefor
To improve, in an encapsulated circuit module having a metal shield layer covering a surface of a resin layer containing filler, a shielding property of the shield layer against electromagnetic waves.
The encapsulated circuit module has a substrate 100 on which electronic components are mounted, covered with a first resin 400. A surface of the first resin 400 is covered with a shield layer 600 including a first metal covering layer 610 made of copper or iron and a second metal covering layer 620 made of nickel. Each of the first metal covering layer 610 and the second metal covering layer 620 is thicker than 5 μm.
Signal transmission cable
A signal transmission cable includes a signal line, an insulation layer covering the signal line, and a shield layer covering the insulation layer. A first oxygen amount A.sub.1 on an outer peripheral surface of the insulation layer is 1.2 times or greater than a second oxygen amount A.sub.2 inside the insulation layer, or a contact angle on the outer peripheral surface the insulation layer is 130° or less, or an adhesion-wetting surface energy on the outer peripheral surface the insulation layer is 27 mJ/m.sup.2 or greater, or a first amount of a hydroxy group on the outer peripheral surface of the insulation layer is greater than a second amount of a hydroxy group inside the insulation layer.
Electromagnetic wave absorber, article with electromagnetic wave absorber, and method for manufacturing electromagnetic wave absorber
An electromagnetic wave absorber (1a) includes a resistive layer (10), an electrically conductive layer (20) and a dielectric layer (30). The electrically conductive layer (20) has a sheet resistance lower than a sheet resistance of the resistive layer (10). The dielectric layer (30) is disposed between the resistive layer (10) and the electrically conductive layer (20). The electromagnetic wave absorber (1a) has a first slit (15). The first slit (15) extends, in the resistive layer (10), from a first principal surface (10a) distal to the dielectric layer (30) toward the dielectric layer (30) in a direction perpendicular to the first principal surface (10a) and divides the resistive layer (10) into a plurality of first blocks (17). Each of the first blocks (17) has a minimum dimension (D1) of 2 mm or more at the first principal surface (10a).
SHIELDING MEMBER AND ELECTRONIC DEVICE INCLUDING THE SAME
A shielding member is of a film type and includes an insulating layer, a shielding layer formed on a surface of the insulating layer, and a resin adhesive layer formed on a surface of the shielding layer. The resin adhesive layer may include a thermoplastic resin adhesive having an electrically conductive powder. The resin adhesive layer of the shielding member stably maintains connection with the ground after curing, thereby providing a stable operating environment of the electronic device.
METHOD FOR PRODUCING ELECTRICAL WIRING MEMBER AND ELECTRICAL WIRING MEMBER
[Object] To provide a method for producing an electrical wiring member having a layered structure of copper wiring and a blackening layer and to provide the electrical wiring member through a search for a material for the blackening layer, the material being etched at a rate close to that for the copper wiring under conditions where etching controllability is ensured. [Solution] A method for producing an electrical wiring member according to the present invention includes a step of forming, on at least one main surface of a substrate, a layered film 6 of a Cu layer 3 and CuNO-based blackening layers (2a and 2b); a step of forming a resist layer 4a in a predetermined region on the layered film 6; and a step of removing a partial region of the layered film 6 by bringing the layered film 6 into contact with an etchant.
Panel for broadband electromagnetic shielding
A panel for an electromagnetic shield includes a light-weight, porous, electrically-conductive core layer of metallic foam having generally parallel opposed surfaces and a face sheet having rigidity properties superior to the rigidity properties of the core layer laminated to a surface of the core layer. Alternatively, a panel for a broadband electromagnetic shield includes a composite fiber-reinforced core having opposed surfaces and a layered electrically-conductive composite cover disposed on a surface of the core. The cover includes a first stratum of porous metal exhibiting pronounced low-frequency electromagnetic shielding properties and a second stratum of electrically-conductive elements exhibiting pronounced high-frequency electromagnetic shielding properties secured in an overlapping electrically-continuous relationship to the first stratum, the first stratum being a metallic lattice, and the electrically-conductive elements being a non-woven veil of electrically-nonconductive metal-coated fibers.
Radiofrequency Shield for Hybrid Imaging Devices
The invention relates to a hybrid medical PET-SPECT/MR imaging device comprising at least one scintillating crystal and at least one module for detecting radiation which contains at least one matrix of photodetectors and an electronics section, such that said module has a mechanical structure, the external, internal or both surfaces of which are divided into at least two sections, of which at least one is coated in graphene, and the rest in non-ferromagnetic conductive material, or all the sections are coated in graphene, and such that the coating forms a Faraday cage. The invention also relates to a shielding against radiofrequency for a medical imaging device, comprising a graphene coating, which is continuous or in bands, on all the faces of the mechanical structure of the detection module of the device, or a graphene coating, continuous or in bands, on at least one face, combined with a coating of non-ferromagnetic conductive materials on the remaining faces, and said shielding forming a Faraday cage.
Electromagnetic wave shielding material
Provided is an electromagnetic wave shielding material that can exhibit improved electromagnetic wave shielding property, light-weight property and formability. The present invention relates to an electromagnetic wave shielding material comprising a laminate in which N number of metal foils each having a thickness of 5 to 100 μm and N+1 number of resin layers each having a thickness of 5 μm or more are alternately laminated or a laminate in which N+1 number of metal foils each having a thickness of 5 to 100 μm and N number of resin layers each having a thickness of 5 μm or more are alternately laminated, N being an integer of 2 or more, wherein thickness of the laminate is from 100 to 500 μm, and wherein, when a thickness center of the laminate is used as a reference, for all pairs of interfaces at which sequences of the resin layers and the metal foils on both upper and lower sides of the reference correspond to each other, distances from the reference to the interfaces have an error of within ±10%.
EMI SHIELDING STRUCTURE AND MANUFACTURING METHOD THEREFOR
An electromagnetic interference (EMI) shielding structure and a method for manufacturing are provided. The EMI shielding structure includes a printed circuit board (PCB) on which a plurality of elements are mounted, an insulation molding member configured to cover the plurality of elements, a conductive shielding dam formed along a side surface of the insulation molding member, and a conductive shielding member formed on a top surface of the insulation molding member.
Motor stator anti-interferences structure
A motor stator anti-interference structure includes: a silicon steel sheet assembly, the silicon steel sheet assembly including multiple silicon steel sheets held between an insulation support assembly; a winding assembly wound on the silicon steel sheet assembly and the insulation support assembly; and a connection member inlaid in the silicon steel sheet assembly to contact all the silicon steel sheets. All the silicon steel sheets are connected to a grounding end of a circuit board through the connection member so as to increase contact area between the connection member and the silicon steel sheet assembly. The electromagnetic interference is conducted through the connection member to the grounding end of the circuit board.