The disclosure relates to an electronic device including: a circuit board; a first component disposed on the circuit board; a shield can disposed to surround at least a part of the first component and including an opening; and a nanofiber film disposed on the shield can to cover the opening, wherein the nanofiber film includes a first layer, a second layer, and a third layer sequentially laminated in a first direction, the first layer or the third layer having a lower electrical resistance value than an electrical resistance value of the second layer in a second direction different from the first direction, and the second layer has a lower electrical resistance value than an electrical resistance value of the first layer or the third layer in the first direction.

A polymer-sheathed multi-filamentary strand for use in braided covers for wiring harnesses intended for use in challenging embodiments comprises a core of glass filaments wrapped in an aramid yarn, and sheathed in a siloxane-modified polyetherimide polymer. Shielding against electromagnetic interference may also be provided.

A polymer composition containing a thermoplastic polymer and an electromagnetic interference filler is provided. At a thickness of 3.2 millimeters and over a frequency range from 2 GHz to 18 GHz, the composition may exhibit an average absorbency of about 25% or greater and an average electromagnetic interference shielding effectiveness of about 40 decibels or more, as determined in accordance with ASTM D4935-18.

Provided is a thermoplastic resin composition for a radar cover which exhibits excellent mechanical properties as well as a good balance between electromagnetic reflection loss and electromagnetic penetration loss, which is required for a radar protection, by including 85 wt % to 95 wt % of a thermoplastic resin, 1 wt % to 5 wt % of carbon nanotubes, and 3 wt % to 10 wt % of carbon black, wherein a weight ratio of the carbon nanotubes to the carbon black is in a range of 3:7 to 1:7.

Earpieces and methods of forming earpieces for radio frequency (RF) mitigation are provided. An earpiece is configured to be inserted in an ear canal. The earpiece includes an insertion element and a sealing section disposed on the insertion element and configured to conform to the ear canal. The sealing section is configured to substantially mitigate radio frequency (RF) transmission and to substantially isolate the ear canal from an ambient environment.

A Faraday enclosure apparatus and method for manufacturing same are disclosure. The enclosure may comprise one or more sewn seam portions constructed to prevent signal leakage through stitch apertures in the seam. A vestibule section facilitates signal-shielded movement of electronic devices between the ambient environment and the main cavity of the enclosure. A connector filter may be mounted to extend through a wall of the enclosure to manage wired power and signal communications entering and exiting the main cavity of the enclosure. Foldable side walls facilitate the collapsibility of the enclosure for compact transport and storage.

A panel for an electromagnetic shield includes a light-weight, porous, electrically-conductive core layer of metallic foam having generally parallel opposed surfaces and a face sheet having rigidity properties superior to the rigidity properties of the core layer laminated to a surface of the core layer. Alternatively, a panel for a broadband electromagnetic shield includes a composite fiber-reinforced core having opposed surfaces and a layered electrically-conductive composite cover disposed on a surface of the core. The cover includes a first stratum of porous metal exhibiting pronounced low-frequency electromagnetic shielding properties and a second stratum of electrically-conductive elements exhibiting pronounced high-frequency electromagnetic shielding properties secured in an overlapping electrically-continuous relationship to the first stratum, the first stratum being a metallic lattice, and the electrically-conductive elements being a non-woven veil of electrically-nonconductive metal-coated fibers.

An RFI/EMI shielding material composed of a conductive multi-fiber having a plurality of metalized monofilaments, each monofilament having a core of stainless steel or low carbon steel with an initial diameter and at least two layers of metal or metal alloy electroplated on the core which is drawn after electroplating to a final diameter less than the initial diameter, in the range of about 45-80 μm.

This disclosure relates to electromagnetic absorbing materials, and, more particularly, to a flocked carbon fiber composite material and methods for forming thereof. The flocked carbon fiber material comprises electrostatically applied carbon fibers, having a Z-plane component; electromagnetic modifiers; a substrate; a bonding agent; and an encapsulation agent. The method for forming said flocked carbon fiber composite material comprises preparing carbon fiber strands; separating carbon fiber strand clumps into carbon fiber strands; separating carbon fiber strands into carbon fibers; applying a bonding agent to a substrate; and electrostatically applying the carbon fibers to the substrate. The flocking device used to perform this method comprises an insulative section; a high voltage power source; a container attached to the insulative section; and a filtering section attached to the container.

An electronic device and a shielding film are disclosed herein. The electronic device includes a printed circuit board and at least one electrical component mounted on the printed circuit board. The shielding film is disposed on at least a part of the printed circuit board to block electromagnetic waves generated by the printed circuit board and/or the electronic component. The shielding film includes a plurality of layers, and is attached to at least part of the printed circuit board and contacting an upper side surface of the electronic component, wherein at least part of the shielding film includes a nano-conductive fiber and is electrically connected with a ground part of the printed circuit board through the nano-conductive fiber.