The technology relates to a memory insertion machine for inserting memory modules into memory sockets on a circuit board. The memory insertion machine may include one or more insertion rods moveably mounted to one or more vertical guides, one or more profilometers, and an insertion controller. The insertion controller may be configured to apply an insertion force to a memory module in a memory socket, by controlling the movement of the one or more insertion rods on the one or more vertical guides. The insertion controller may be further configured to determine, based on information received from the one or more profilometers, a measured distance between a top of the memory module and a top of the memory socket.

A component transfer device includes a detector configured to detect a rotation angle of a driving motor that moves a pair of gripping sections, or a position of the gripping sections, and a motor control section configured to perform position feedback control of the driving motor based on a detection signal of the detector and a position command signal from the transfer control device. A transfer control device is provided with a torque monitoring section configured to monitor a value of a command torque applied to the driving motor from the motor control section, and a gripping state determining section configured to determine that there was a change in a gripping state of the component when, with the pair of gripping sections in a state gripping the component, the command torque monitored by the torque monitoring section drops to a value smaller than a first threshold value.

Provided is equipment for transferring a vacuum chamber that solves a problem of heat dissipation of a driver by (i) placing a permanent magnet, which is a stator structure of a linear motor and causes linear motion, inside a vacuum chamber and (ii) by placing a coil of a driver structure outside the vacuum chamber. Under this structure, (i) no cable is installed in inside the chamber, and (ii) heat generated from the driver structure can be smoothly dissipated. The transfer equipment includes: a first-axis linear coil (24) that is fixed to an outside of the vacuum chamber at a bottom surface of the housing (11) of the vacuum chamber (10); a first-axis slider (60) that is installed inside the vacuum chamber (10) and moves in a first-axis direction relative to a bottom of an inner space of the vacuum chamber (10); and a first-axis linear permanent magnet (63). The first-axis linear permanent magnet (63) is arranged in the first-axis direction, is installed in a lower portion of the first-axis slider (60), and slidingly moves together with the first-axis slider (60).

An assembly system comprises a fixing device configured to fix a housing and a pressing mechanism adapted to assemble a contact into the housing. The pressing mechanism includes a fixing block having a contact guiding slot adapted to receive the contact therein and a movable block movably mounted on the fixing block and adapted to press the contact downward. The movable block is moved downward to press the contact received in the contact guiding slot into a contact installation slot of the housing in a condition in which the contact guiding slot of the fixing block is aligned with the contact installation slot of the housing.

A shaft device includes a nut support including a shaft hole, a spline shaft extending through the shaft hole of the nut support, a spline nut having a tubular shape, a bearing of thrust type rotatably supporting the spline nut relative to the nut support, and a biasing member configured to bias the bearing in an axial direction of the spline shaft. The spline nut is disposed coaxially with a portion of the spline shaft protruding upward from the shaft hole and connected to the spline shaft through a spline mechanism.

A spindle bank for a pick-and-place machine comprises a base including a plurality of mount locations, each of the plurality of mount locations configured to receive a mountable spindle module including at least one pick-and-place spindle and nozzle, a bearing system attachable to a movement axis of a pick-and-place machine such that the spindle bank is movable along the movement axis, and a power delivery system configured to deliver electrical power to each of the plurality of mount locations, wherein each of the plurality of mount locations is configured to deliver the electrical power to each of the mountable spindle modules when mounted.

A component mounting device including a component mounting head that mounts a component on a board by using a first raising and lowering device and a second raising and lowering device. The second raising and lowering device causes an engaging member to engage with an engaged member of a suction nozzle, and by further advancing the engaging member causes the suction nozzle to advance against a biasing force of biasing member. Further, a control device is configured to cause the engaging member to move in the advancing direction by using the actuator of the second raising and lowering device and detect an engaging position in a vertical direction at which engaging member engages with engaged member.

This application relates to a substrate pick-and-place equipment and method. The equipment includes: a bearer platform, configured to bear a substrate; a retractable apparatus, including: a foldable bracket, disposed above the bearer platform and foldable along a horizontal direction; a plurality of suction structures, disposed on a bottom of the foldable bracket, where the suction structures are evenly distributed in a coverage area of the foldable bracket, and are configured to suck the substrate; a first drive unit, configured to drive the foldable bracket to extend and retract along the horizontal direction; and a second drive unit, configured to drive the retractable apparatus to rise and descend along a vertical direction; and a conveying apparatus, operating between the bearer platform and the foldable bracket. In the substrate pick-and-place method, a substrate is picked and placed from an upward side by using a suction structure.

An operation checking device of an electronic component mounting machine is provided with a first memory section configured to memorize an operation program of the electronic component mounting machine including at least a collection operation of an electronic component by a collecting device; a second memory section configured to memorize shape data of the electronic component and shape data of the collecting device; a first acquiring section configured to acquire information of the electronic components and information of the collecting device based on the operation program required for a current operation memorized on the first memory section; and a second acquiring section configured to acquire corresponding shape data of the electronic component and shape data of the collecting device from the second memory section based on the information of the electronic component and the information of the collecting device acquired by the first acquiring section.

A method for replacing an element of a display device includes: forming a structure with a first liquid layer between a first micro device and a conductive pad of a substrate in which the first micro device is gripped by a capillary force produced by the first liquid layer; evaporating the first liquid layer such that the first micro device is bound to the substrate; determining if the first micro device is malfunctioned or misplaced; removing the first micro device when the first micro device is malfunctioned or misplaced; forming an another structure with a second liquid layer between a second micro device and the conductive pad of the substrate in which the second micro device is gripped by a capillary force produced by the second liquid layer; and evaporating the second liquid layer such that the second micro device is bound to the substrate.