A mounting head is configured to be detachably attached to a mounting device main body. This mounting head includes a storage section having multiple storage areas, and a storage control section configured to acquire multiple operation data relating to an operation of the mounting head individually at different timings and store the multiple operation data individually in the multiple storage areas in such a state that the mounting head is attached to the mounting device main body.

A spindle bank for a pick-and-place machine comprises a base including a plurality of mount locations, each of the plurality of mount locations configured to receive a mountable spindle module including at least one pick-and-place spindle and nozzle, a bearing system attachable to a movement axis of a pick-and-place machine such that the spindle bank is movable along the movement axis, and a power delivery system configured to deliver electrical power to each of the plurality of mount locations, wherein each of the plurality of mount locations is configured to deliver the electrical power to each of the mountable spindle modules when mounted.

A component mounting device includes a conveyance unit that conveys a placement member on which a mounting target is placed, a head unit movable in a horizontal plane, and a controller. The controller transfers the mounting target from the conveyance unit to a transfer position by controlling movement of the head unit in the horizontal plane in a state in which the placement member is held by one or a plurality of heads of the head unit.

A board work system including ark arrangement members, on which are arranged multiple marks that have a specified relative positional relationship, are arranged straddling first work area in which first work head moves and second work area in which second work head moves, and, when performing work with respect to a board, which is a single board held by a board holding device in a state straddling the first work area and the second work area, based on positions of the marks in first work area measured based on image data of first imaging device that is moved along with the first work head and positions of the marks in second work area measured based on image data of second imaging device that is moved along with the second work head.

A flip-chip bonding apparatus for mounting semiconductor chips on a circuit board is provided with: a mounting head, to which a plurality of mounting nozzles for moving, in the vertical direction, mounting tools for vacuum-sucking the semiconductor chips are attached by being aligned in the Y direction, said mounting head moving in the Y direction; and an electronic component handling unit, that moves in the X direction perpendicular to the Y direction, picks up the semiconductor chips such that the semiconductor chips are aligned in the X direction, inverts the semiconductor chips, and at the same time, changes the alignment direction of the semiconductor chips from the X direction to the Y direction. Consequently, in the electronic component mounting apparatus, installation area can be saved and bonding speed can be increased with the simple configuration.

A variable pitch electronic component mass transfer apparatus is disclosed. A die-bond transfer head is disposed below each of the die-bond brackets. The die-bond connecting rod is provided with die-bond movable nodes arranged equidistantly. Each of the die-bond movable node is hinged to one of the die-bond brackets. An output end of the die-bond linear motor drives the die-bond connecting rod to move telescopically. A flip-chip transfer head is disposed below each of the flip-chip brackets. The flip-chip connecting rod is provided with flip-chip movable nodes arranged equidistantly. Each of the flip-chip movable nodes is hinged to one of the flip-chip brackets. An output end of the flip-chip linear motor drives the flip-chip connecting rod to move telescopically. An output end of the connecting rod rotating motor is connected to the flip-chip rail, and is configured to turn over the flip-chip rail.

A component pickup apparatus includes a component pickup unit including a plurality of nozzles, each of the plurality of nozzles configured to adsorb a component; a light emitter configured to emit light toward the plurality of nozzles; an image splitter configured to receive an image of the plurality of nozzles generated by the light and configured to split the image of the plurality of nozzles into different groups; and an image capturer configured to capture an image outputted from the image splitter. The image splitter is configured to guide a first image of a first group of the plurality of nozzles to a first row of the image capturer and guide a second image of a second group of the plurality of nozzles to a second row of the image capturer.

Disclosed is a dispensing head that includes a first spindle configured for movement in a vertical direction, a first nozzle operatively attached to the spindle, a heater device removably attachable to the dispensing head. The heater device includes a heat source and an opening configured to receive the first nozzle. The heat source is configured to heat the first nozzle above an ambient temperature. An assembly system is further disclosed, along with a method of heating a nozzle.

A spindle for a pick-and-place machine includes a shaft including a length extending between a first end and a second end, the shaft including an outer body and a hollow interior, a nozzle tip disposed at the first end of the shaft, the nozzle tip configured to contact an electronic component for manipulation of the electronic component, and a theta gear disposed on the shaft, the theta gear configured to engage with a motor of a pick-and-place head. The spindle is configured to be removably attachable from the pick-and-place head. A dispensing head spindle module, spindle bank and assembly machine incorporating the spindle are disclosed.

A pick-and-place spindle module comprises: a modular body structure including a first receiving location configured to receive a spindle; a first z-axis motor configured to move a spindle received in the first receiving location in a z-axis; a first theta motor configured to rotate a spindle received in the receiving location; a first motion control chip each attached to the body structure, the first motion control chip configured to control the first z-axis motor and the first theta motor; and a mechanical attachment mechanism, the mechanical attachment mechanism configured to facilitate attachment of the modular body structure to a spindle bank.