A pick-and-place spindle module comprises a modular body structure including a first receiving location configured to receive a spindle, a first z-axis motor configured to move a spindle received in the first receiving location in a z-axis, a first theta motor configured to rotate a spindle received in the receiving location, an air distribution system including an air distribution port, the air distribution system configured to deliver received air from the air distribution port to a spindle received in the first receiving location, an electrical distribution system including an electrical distribution port, and a mechanical attachment mechanism, the mechanical attachment mechanism configured to facilitate attachment of the modular body structure to a spindle bank such that the air distribution port is connected to receive air from the spindle bank and the electrical distribution port is configured to receive electricity from the spindle bank.

A component mounting method includes independent mounting and cross lane alternate mounting. The independent mounting performs an operation of mounting a component on a first board carried in a first board transport lane from a first component supplier, and an operation of mounting a component on a second board carried in a second board transport lane from a second component supplier. The cross lane alternate mounting alternately performs an operation of mounting the component on the first board carried in the first board transport lane from the second component supplier, and an operation of mounting the component on the second board carried in the second board transport lane from the first component supplier.

A method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. Micro devices being attached to a donor substrate with a donor force. The donor substrate and receiver substrate are aligned and brought together so that selected micro devices meet corresponding contact pads. A receiver force is generated to hold selected micro devices to the contact pads on the receiver substrate. The donor force is weakened and the substrates are moved apart leaving selected micro devices on the receiver substrate. Several methods of generating the receiver force are disclosed, including adhesive, mechanical and electrostatic techniques.

A component mounting method includes independent mounting and cross lane alternate mounting. The independent mounting performs an operation of mounting a component on a first board carried in a first board transport lane from a first component supplier, and an operation of mounting a component on a second board carried in a second board transport lane from a second component supplier. The cross lane alternate mounting alternately performs an operation of mounting the component on the first board carried in the first board transport lane from the second component supplier, and an operation of mounting the component on the second board carried in the second board transport lane from the first component supplier.

A calculation device for a work machine comprising a holding head including a holding tool configured to hold a lead component comprising a lead and a body and a moving device configured to move the holding head, the calculation device calculating a release position of the lead component held by the holding tool, when the work machine mounts the lead component on a board by inserting the lead of the lead component held by the holding tool into a hole formed on the board by operating the moving device.

A board work system including ark arrangement members, on which are arranged multiple marks that have a specified relative positional relationship, are arranged straddling first work area in which first work head moves and second work area in which second work head moves, and, when performing work with respect to a board, which is a single board held by a board holding device in a state straddling the first work area and the second work area, based on positions of the marks in first work area measured based on image data of first imaging device that is moved along with the first work head and positions of the marks in second work area measured based on image data of second imaging device that is moved along with the second work head.

A component mounter of the present disclosure including a mounting head configured to pick up components and mount the components onto a substrate; a head moving device configured to move the mounting head in parallel to a horizontal plane; and a conveyance device configured to convey the substrate in a conveyance direction parallel to the horizontal plane. The mounting head includes multiple nozzles configured to pick up and hold the components by a negative pressure, multiple switching valves provided corresponding to each of the multiple nozzles and configured to switch whether the negative pressure is supplied to the corresponding nozzle, a nozzle moving device configured to change which nozzle is positioned at each of a first nozzle position and a second nozzle position for moving the multiple nozzles and performing at least one of picking up and mounting of the components, a first driving device, and a second driving device.

A mounting target working device includes a mounting target holding unit that holds a mounting target. The mounting target holding unit includes a lift mechanism that moves the mounting target in an upward-downward direction, a tilt mechanism attached to the lift mechanism and that tilts the mounting target, and a rotation mechanism attached to the tilt mechanism and that rotates the mounting target. The rotation mechanism is supported in a cantilever manner by the tilt mechanism.

An example robot end effector includes a memory module gripper that to selectively grip a memory module, and a CPU gripper that is to selectively grip a processor and/or a heatsink. The CPU gripper is attached to the memory module gripper such that they are movable relative to the one another between a first configuration and a second configuration.

A movement error detection apparatus includes a movable region inside mark made of a projected image arranged in a movable region of a movable conveyor of each of first and second substrate conveyance devices; and a pair of movable region outside marks respectively provided on both sides of the movable region inside mark and arranged at a position outside the movable region of the movable conveyor and outward of a substrate at a work position; an imaging device which moves together with a mounting head; and a control device that selects two marks, among the marks, which are positioned on both outer sides of the substrate and are closest to the substrate, and causes the first substrate recognition camera to image the marks, as well as obtaining a movement error of the first mounting head on the basis of the two mark images.