There is provided a component mounting machine in which when detecting a lowermost end position of a component sucked by a suction nozzle, a lower edge position of the component is detected at predetermined intervals from a left side and a right side using the lowermost end position as a reference. The component mounting machine derives an approximate straight line obtained by approximating multiple lower edge positions detected from the side having a larger detection number and the lowermost end position and an angle of the approximate straight line is detected as the suction angle of the component. Accordingly, the component mounting machine can appropriately detect the suction angle of the component with a simple process and correctly determine the suction posture of the component.

A rotary head, on which are arranged in a circumferential direction multiple nozzle holders each holding a suction nozzle, is provided with, separately to first negative pressure supply unit that supplies negative pressure to the suction openings of all the suction nozzles, second negative pressure supply unit that supplies negative pressure to the suction nozzle held by the nozzle holder that is lowerable when that nozzle holder is lowered. Accordingly, when performing pickup operation and mounting operation using the suction nozzle, the state of the suction nozzle is not affected by the state of the other suction nozzles.

A shaft device includes a nut support including a shaft hole, a spline shaft extending through the shaft hole of the nut support, a spline nut having a tubular shape, a bearing of thrust type rotatably supporting the spline nut relative to the nut support, and a biasing member configured to bias the bearing in an axial direction of the spline shaft. The spline nut is disposed coaxially with a portion of the spline shaft protruding upward from the shaft hole and connected to the spline shaft through a spline mechanism.

A spindle bank for a pick-and-place machine comprises a base including a plurality of mount locations, each of the plurality of mount locations configured to receive a mountable spindle module including at least one pick-and-place spindle and nozzle, a bearing system attachable to a movement axis of a pick-and-place machine such that the spindle bank is movable along the movement axis, and a power delivery system configured to deliver electrical power to each of the plurality of mount locations, wherein each of the plurality of mount locations is configured to deliver the electrical power to each of the mountable spindle modules when mounted.

The mounting device comprises: a mounting head, having a pickup member picking up a component, which moves and places the component at a placement position by picking up the component with the pickup member from a supply section having a holding member holding the component; an imaging section configured to image the component held by the mounting head; and a control section configured to execute: a first placement process in which the component is picked up by the mounting head, positional deviation is corrected based on imaging results of the component captured by the imaging section, and the component is placed at the placement position, and a second placement process in which the component is placed at the placement position by omitting the imaging process by the imaging section at the mounting head when the positional deviation is within a predetermined allowable range.

A component mounting device includes a conveyance unit that conveys a placement member on which a mounting target is placed, a head unit movable in a horizontal plane, and a controller. The controller transfers the mounting target from the conveyance unit to a transfer position by controlling movement of the head unit in the horizontal plane in a state in which the placement member is held by one or a plurality of heads of the head unit.

A component placing device to place a component on a board, including: a shaft having a lower portion and an upper portion; a component holder that is attached to the lower portion of the shaft in a state of being vertically displaceable and has a suction hole for holding the component by a negative pressure; an elastic body that biases the component holder downward with respect to the shaft; a servo motor that raises and lowers the shaft; and a controller that sets a thrust limit value for limiting a thrust of the servo motor and limits the thrust of the servo motor to be equal to or lower than the thrust limit value when the component holder is lowered toward the board. The thrust limit value is set within a range in which a load is smaller than a force by which the elastic body biases the component holder.

A device for handling components that is designed and equipped to handle components with multiple lateral surfaces and/or edges of the lateral surfaces. The device has at least one receiving tool, which is arranged on a turning device, for a respective component of the components, where the receiving tool is designed and equipped to receive the respective component on one of the component cover surfaces. The turning device is designed and equipped to rotate the receiving tool on a turning plane about a turning axis, and in the process optionally convey a component located on the receiving tool from a receiving position to one or more orientation positions, optionally one or more inspecting positions, a setting-down position, and optionally an ejecting position. The device also has a holding and supplying device, which faces the receiving position, for a component supply, and a discharge device.

A component mounting device includes a mounting head that mounts a component at a mounting position on a substrate, an imaging unit capable of imaging the mounting position from a plurality of fields of view, imaging directions of which are different from each other, and a controller that selects a success or failure determination field of view used for success or failure determination of whether or not the component has been mounted at the mounting position from the plurality of fields of view according to a state of a shield around the mounting position.

A flip-chip bonding apparatus for mounting semiconductor chips on a circuit board is provided with: a mounting head, to which a plurality of mounting nozzles for moving, in the vertical direction, mounting tools for vacuum-sucking the semiconductor chips are attached by being aligned in the Y direction, said mounting head moving in the Y direction; and an electronic component handling unit, that moves in the X direction perpendicular to the Y direction, picks up the semiconductor chips such that the semiconductor chips are aligned in the X direction, inverts the semiconductor chips, and at the same time, changes the alignment direction of the semiconductor chips from the X direction to the Y direction. Consequently, in the electronic component mounting apparatus, installation area can be saved and bonding speed can be increased with the simple configuration.