A component mounting machine including a component supply device to supply a component to a supply position; a component transfer device to use a component mounting tool to pick up the component from the supply position and mount the component on a board; a component detecting section to detect whether the component is present at the supply position before or while the component is being picked up by the component mounting tool; a holding detecting section to detect whether the component mounting tool is holding the component following pickup; and a remaining detecting section to detect whether the component remains at the supply position in a case in which it is detected by the holding detecting section that the component is not being held by the component mounting tool; and a dropped determining section to determine whether the component has dropped.

A system places a pin into at least one hole on an article. The system generally includes a moveable base on which the article is located, a press head for holding and inserting the pin into the hole, a first vision system to capture a first image of a designated hole on the article, and a second vision system to capture second and third images of the held pin relative to the press head respectively from two vantage points. A computing unit is configured to assign a relative coordinate consisting of a X-value and a Y-value being correspondingly indicative to an actual location of the hole, compute relative deviations presented between the held pin and the designated hole, and move the base to adjust the article in a manner correcting or compensating for the computed deviation prior to inserting the held pin into the hole.

This disclosure provides a pick-and-place device including base, carrying mechanism, driving mechanism and clamping mechanism. Carrying mechanism includes first side part, second side part, two conveyor assemblies and two first driving devices. Conveyor assemblies are respectively disposed on first side part and second side part and configured to carry circuit board. First driving devices are respectively connected to conveyor assemblies so as to respectively turn conveyor assemblies. Driving mechanism is disposed on base. Clamping mechanism includes base plate, clamping assembly and second driving device. Base plate is movably disposed on base via driving mechanism. Clamping assembly includes first claw and second claw are disposed on base plate and configured to pick and place circuit board. Second driving device is disposed on base plate. Second driving device is connected to clamping assembly so as to move first claw and second claw toward or away from each other.

A component delivery device includes an actuator that displaces an outer sleeve and an inner rod positioned within a cavity of the outer sleeve together from a retracted configuration to an extended configuration to move an ejectable component in relation to a feed head. The actuator further displaces the outer sleeve and not the inner rod to an ejection configuration to displace the ejectable component toward a workpiece. Displacing the outer sleeve and not the inner rod causes the outer sleeve to translate over the inner rod and compresses a biasing member that is disposed within the cavity and in engagement with the inner rod.

A component chuck device moves a pusher member downward when negative pressure is supplied, and holds a posture of a component by causing the pusher member to abut with an upper face of the component that is gripped in a gripping mechanism. Then, the component chuck device releases gripping of the component when supply of negative pressure is stopped, and a lead of the component is inserted into a hole of a substrate while holding the posture of the component by moving the pusher member downward while remaining abutted with the upper face of the component.

An electronic component mounting machine including a component supply device to supply a radial lead component to a supply position by feeding a carrier tape holding multiple radial lead components; and a component transfer device to collect the radial lead component supplied to the supply position and mount the radial lead component to a predetermined mounting position. The component supply device includes a locking section engageable with the feed holes of the carrier tape, and a tape feed section for feeding the carrier tape by sliding the locking section in engagement with the feed hole. The component transfer device includes a component holding section to hold the component main body of the radial lead component held by the carrier tape, and a position control section to control the position of the component holding section when holding the component main body.

A lead wire insertion method for inserting a lead wire of an electronic component with a lead wire into a through hole formed in the wiring board includes a third step of placing a jig on the wiring board so that one side surface of the jig faces the another electronic component, and a bottom side end of an inner wall of a guide hole of the jig is fitted to a through hole formed in the wiring board, in which the guide hole is opened and formed in the one side surface of the jig so that a cross-sectional area becomes smaller from a top surface to a bottom surface.

In a rotary head type component mounter, among a specified quantity of suction nozzles held by a rotary head, multiple suction nozzles are lowered simultaneously. When the rotary head is moved by a head moving mechanism to a nozzle exchange area and exchange of suction nozzles is performed, two station reference marks of the nozzle station are imaged by a mark imaging camera, image recognition is performed of the positions of the two station reference marks, and the position and angle of the nozzle station is calculated. Then, the position and angle of the rotary head is corrected to be aligned with the position and angle of the nozzle station, multiple of the suction nozzles held on the rotary head are lowered simultaneously by Z-axis driving mechanisms and simultaneously exchanged with multiple of the suction nozzles in the nozzle station.

A mounting device is provided with a first raising and lowering drive section that raises and lowers a syringe member to which a suction nozzle that picks up a component is attached, and a second raising and lowering drive section that raises and lowers the suction nozzle with respect to the syringe member to which the suction nozzle is attached. The mounting device controls a raising and lowering operation of the first raising and lowering drive section based on height information that includes at least one of information of the thickness of the component or information of the stage height of a transfer stage.

A receiving device for components. The receiving device is designed to be adjusted in a controlled manner relative to a deposit point at least partly along a first, second, and/or third axis by at least one linear drive and/or move a support guided by the receiving device along one of the first and/or second axes by a drive. The receiving device has a position sensor which is paired with a component deposit point in order to detect a component which has only been partly deposited in a pocket of the support at the component deposit point, where the position sensor is connected to the receiving device laterally of the support such that the position sensor is moved directly together with the receiving device.