A work head unit that detects the rotational position of suction nozzle with first Q-axis encoder positioned facing component holding section that holds a component. With the work head unit, it is desirable to detect the orientation of component holding section at two locations: suction nozzle and syringe member.

A component mounter provided with a first raising and lowering device configured to raise and lower a raising and lowering member, and a second raising and lowering device provided on the raising and lowering member and configured to relatively raise a suction nozzle with respect to the raising and lowering member. The component mounter performs, among multiple types of operations of lowering the suction nozzle, a cleaning operation of cleaning the suction nozzle and a discarding operation of discarding a component for which an error occurred via a first operation mode of lowering the suction nozzle by driving the first raising and lowering device. Also, the component mounter performs pickup operation of picking up the component and mounting operation of mounting the component via a second operation mode of lowering the suction nozzle by driving the first raising and lowering device and the second raising and lowering device.

A mounting target working device includes a mounting target holding unit that holds a mounting target. The mounting target holding unit includes a lift mechanism that moves the mounting target in an upward-downward direction, a tilt mechanism attached to the lift mechanism and that tilts the mounting target, and a rotation mechanism attached to the tilt mechanism and that rotates the mounting target. The rotation mechanism is supported in a cantilever manner by the tilt mechanism.

A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; and a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool having a contact portion for contacting the die during a transfer from the die supply source to the substrate, the bond head including a spring portion engaged with the bond tool such that the spring portion is configured to compress during pressing of the die against the substrate using the contact portion of the bond tool.

A component mounting device includes: a holding body, pressing mechanism to press the holding body to move on a given route, position detector to detect a position of the holding body, and controller to control the mechanism. The route including: a start position of the holding body at which an insertion pin held by the body is separated from an insertion hole of a substrate, a first position range wherein the insertion pin is partially inserted, and a section position range wherein the insertion pin is fully inserted. When the holding body is pressed by a first pressing force to move on the given route from the start position toward the second position range, the controller controls the pressing mechanism to press the holding body by a pressing force different from the first pressing force, when the holding body stops at a position before or within the first position range.

An example robot end effector includes a memory module gripper that to selectively grip a memory module, and a CPU gripper that is to selectively grip a processor and/or a heatsink. The CPU gripper is attached to the memory module gripper such that they are movable relative to the one another between a first configuration and a second configuration.

When determining whether an insertion component provided with a positioning-use protruding section and a surface-mounting-use electrode section can be mounted onto a circuit board provided with a positioning hole into which the positioning-use protruding section is inserted and a land for connecting the surface-mounting-use electrode section, an image is captured of the positioning-use protruding sections and the surface-mounting-use electrode sections of the insertion component either separately or simultaneously by a component imaging camera, and the positions of the positioning-use protruding sections and the positions of the surface-mounting-use electrode sections are recognized by processing the captured image. The position deviation amount between the surface-mounting-use electrode sections of the insertion component and the lands of the circuit board is calculated, and by determining whether the position deviation amount is within a tolerance range, it is determined whether the insertion component can be mounted on the circuit board.

In a suction nozzle held on a mounting head of a component mounting machine, a nozzle section that sucks a component is swingably provided on a nozzle holder section of the suction nozzle, and an orientation of the nozzle section is changed by 90 to a downward orientation or a lateral orientation by swinging the nozzle section. The component is sucked by the nozzle section from above in a state in which the orientation of the nozzle section of the suction nozzle is downward in a component suction operation, and the component is mounted on an object such as a circuit board in a state in which the orientation of the component sucked by the nozzle section is set to the lateral orientation by the nozzle section the orientation of which is changed by 90 to the lateral orientation by swinging the nozzle section in the component mounting operation.

Embodiments relate to placing one or more light emitting diodes (LEDs) onto a printed circuit board (PCB). Voltage differences are applied to the PCB such that, if properly placed, the one or more LEDs emit light. A camera records the placement and any light emitted from the one or more LEDs. Based upon the images from the camera, a controller can adjust placement parameters of the LEDs until they emit light. Among other advantages, the placement of the LEDs on the PCB can be adjusted in real time and allows insight into the causes of failed LED placement.

A foreign object damage (FOD) prevention system utilizing a plurality of RFID chips attached to a tool to detect misplaced or detached components from each particular tool. Reverse triangulation accountability (RTA) incorporates a reader and an object to be ranged and vectored (positioned accurately) by use of two radio transmitters completing a triangle. The system may also facilitate location of a misplaced undamaged tool.