A method of mounting components on a PCB includes drawing a component, transporting the component to a starting position, taring the sensor, moving the sensor in Z-axis until the component contacts the board surface, activating the regulator, transmitting from the regulator a signal to a industrial robot as Z-axis offset, releasing the components from the industrial robot if the Z-axis offset is greater than or equal to a preset parameter and establishing the current position of the component as a starting point, moving the component if the Z-axis offset is less than the preset parameter beginning from the current position, arresting movement of the component when the sensor detects an opening edge in the board, moving the component away from the opening edge based on data from the sensor, repeating steps while a change in the component movement is executed.

When a mounting head is moved upward of a rear side conveyor across and over a front side conveyor after a component suction operation, it is determined whether or not there is a possibility that a component sucked by a suction nozzle may interfere with a component mounted on a circuit board on the front side conveyor. When so determined, a head lifting mechanism is caused to lift up the mounting head to a position where the component sucked by the suction nozzle does not interfere with the mounted component. Thereafter, the mounting head is moved upward of the rear side conveyor, and the head lifting mechanism is caused to lower down the mounting head to an initial height position. Thereafter, the component is mounted on a circuit board on the rear side conveyor.

A component mounting system is a system in which a mounting machine and an inspection device are connected to a management device so as to enable data communication therewith. The mounting machine includes a mounting analysis unit that acquires suction position shift data for each component mounting operation of a mounting head. The inspection device includes an inspection analysis unit that acquires mounting position shift data corresponding to each of a plurality of target mounting positions. The management device includes a mark generating unit and a display unit. Based on each suction position shift data and each mounting position shift data, the mark generating unit generates a suction shift mark and a mounting shift mark each of which visualizes the direction and the size of a positional shift. The display unit displays each suction shift mark or each mounting shift mark at each marking position on board graphics.

An electronic circuit component mounting head which mounts electronic circuit components to a circuit substrate is provided. The mounting head includes a rotating/raising/lowering axis held on a head main body as to be capable of rotation and of being raised/lowered, a suction nozzle held on the rotating/raising/lowering axis as to be capable of being raised/lowered and not capable of being rotated relatively, and the rotating/raising/lowering axis and suction nozzle can be rotated as necessary by an electric motor. A raising/lowering driving member is held on head main body as to be capable of being raised/lowered, and is raised/lowered by a first linear motor. A first engaging section of the raising/lowering driving member is engaged with the rotating/raising/lowering axis, and a second engaging section of a second linear motor is held on the raising/lowering driving member engaged with suction nozzle.

A component mounting device includes a head unit including a mounting head configured to mount a component on a substrate, a component feeder configured to feed the component to the mounting head, and an imager provided on the head unit and configured to be able to image a component feeding location of the component feeder from a plurality of directions. The component mounting device further includes a controller configured to acquire a horizontal position and a vertical height position of the component at the component feeding location based on images of the component feeding location captured from the plurality of directions by the imager.

A component mounter includes a component transfer device, a tool station, and a control device. The component transfer device is provided with a head main body, and a tool holding device configured to hold a nozzle tool and provided to be raisable and lowerable with respect to the head main body and rotatable around a rotation axis line. The tool station is configured to be able to store an exchange-use nozzle tool at multiple different storage angles. The control device of the component mounter includes an angle acquiring section that acquires the storage angle of the exchange-use nozzle tool in the tool station, and an exchange control section that, during the nozzle tool exchange processing, rotates the tool holding device based on the storage angle of the nozzle tool, and performs angle alignment of the nozzle tool with respect to the head main body.

In a rotary head type component mounter, before using two suction nozzles of rotary head to pick up the leading components in component supply tape set in two tape feeders, rotary head is moved in the XY directions by head moving mechanism and rotated by head rotating mechanism such that the pickup points of the two suction nozzles are positioned on two straight lines and extending in the tape feeding direction of each tape feeder passing through the ideal pickup points of the leading components of the two tape feeders, and the leading components are fed to component pickup positions and that are the pickup points of the suction nozzles on the two straight lines. Then, the two suction nozzles of rotary head are lowered simultaneously to pick up the two component simultaneously using the two suction nozzles.

In a work machine which includes a working head including a lifting and lowering unit including a working device and a first lifting and lowering device which lifts and lowers the working device, and a second lifting and lowering device which lifts and lowers the lifting and lowering unit, a positional deviation (Δx, Δy) of the working device in a direction which is perpendicular to a lifting and lowering direction is eliminated. Since the positional deviation is caused by both an inclination of a lifting and lowering axis line L.sub.1 of the working device by the first lifting and lowering device and an inclination of a lifting and lowering axis line L.sub.2 of the lifting and lowering unit by the second lifting and lowering device, based on positional deviation data a target moving position is corrected.

A work head unit that detects the rotational position of suction nozzle with first Q-axis encoder positioned facing component holding section that holds a component. With the work head unit, it is desirable to detect the orientation of component holding section at two locations: suction nozzle and syringe member.

A board work machine that includes a rotary head with multiple positions is provided for lowering nozzle holders and is able to continue operating even though it is determined that the nozzle holder cannot be lowered at one of the multiple positions. In step S1 in a Z shaft updating process, when determining based on Z shaft table that a lifting and lowering operation function is not effective and that an assigned Z shaft is not used for lifting and lowering, CPU lifts up and lowers a Z shaft that differs from the assigned Z shaft in step S11. Mounter can continue mounting work by using the Z shaft that differs from the assigned Z shaft.