In a component mounter provided with a holding tool configured to hold leaded component, a moving device configured to move the holding tool, and an imaging device configured to image a leaded component held by the holding tool, the lengths of the pair of leads of leaded component are different. With respect to this, operation of the moving devices is controlled based on imaging data of the leaded component captured by the imaging device, and the tip section of long lead of the pair of leads of the leaded component held by the holding tool is inserted in a through-hole. Next, leaded component is moved such that short lead is positioned above a through-hole, and the short lead is inserted into the through-hole. That is, the pair of leads are inserted into the through-holes in order of proximity of the tips to circuit board, closer leads being inserted earlier.

Electronic component supply device of the present invention includes multiple feeders each having an individual control section configured to operate by use of operation software to control a tape feeding mechanism, a host control section capable of holding update software configured to be replaced with at least part of the operation software, and multiple information transmission sections connected between the host control section and the individual control sections of the multiple feeders so as to transmit information and configured to transmit the update software from the host control section to the individual control sections independently of one another. According to this configuration, the multiple information transmission sections can transmit the update software to the different feeders in parallel in terms of time, whereby the updating time can be shortened significantly compared with a case where update software is transmitted sequentially to multiple feeders.

A mounting device which mounts an electronic component onto a substrate with a simple configuration, is provided. The mounting device includes a holding part configured to hold an electronic component, and a regulating part configured to regulate a radial position of a lead of the electronic component. The regulating part is capable of regulating the position of the lead at a first part, and is capable of regulating the position of the lead at a second part more distant from the holding part than the first part. By the holding part and the regulating part moving relatively to each other while the holding part holding the electronic component, the regulating part moves between a position at which the position of the lead is regulated at the first part and a position at which the position of the lead is regulated at the second part.

If the moving direction of a suction nozzle during raising and lowering deviates from a vertical direction, appropriate work cannot be guaranteed because the holding position of a component by the suction nozzle will vary depending on the holding height of the component by the suction nozzle. Thus, a component loaded at a specified height (H) position from the upper surface of a stage is held by a suction nozzle, and that component is loaded at a specified position. Then, the component is imaged and the loading position (first height component loading position) of the component is calculated. Further, the component loaded on the stage is held by the suction nozzle and the component is loaded at the above specified position. Then, the component is imaged and the component loading position (second height component loading position) is calculated. Next, the deviation amount between the first height component loading position and the second height component loading position is calculated. Thus, appropriate mounting can be guaranteed by performing correction of the component holding position, correction of the component loading position, or the like, based on the deviation amount.

A component mounter includes a mounting head configured to revolve multiple nozzle holders to which multiple pickup nozzles can detachably be attached individually in a circumferential direction and to allow the multiple pickup nozzles to rotate on their own axes while being interlocked with each other and two Z-axis drive devices provided at two locations on a revolving orbit of the multiple pickup nozzles to raise and lower the pickup nozzles situated at the two locations. Then, when a component supplied from a component supply device can be picked up at any of multiple different nozzle angles of the pickup nozzle, the component mounter moves the pickup nozzle to a revolving angle at which the pickup nozzle can be raised and lowered and then lowers the pickup nozzle to pick up the component at a nozzle angle of the multiple nozzle angles which involves a smaller moving amount.

A component mounter provided with head, a device for moving head, transfer unit, and a mounting controller. Round plate is an example of a container for paste. The mounting controller, in the first operation mode, images components held by multiple nozzles using an imaging device before transfer is performed, and recognizes the position and/or orientation of each component based on the image of each component. Further, the head and the head moving device are controlled based on the position and/or orientation of each component such that a coating layer is transferred to connection terminals of each component at a transfer area of each of the components set in advance that does not include a margin based on the holding deviation of each component.

A light emitting component mounter includes a luminance distribution measurer, a head moving mechanism, and a component mounting processor. The luminance distribution measurer causes the light to emit a light and measures a luminance distribution of a light emitter and detects a position of a luminance distribution center in the light emitter based on the measured luminance distribution. The head moving mechanism moves a mounting head. The component mounting processor controls the head moving mechanism based on the position detected by the luminance distribution measure.

A component mounting robot system includes a component transfer robot which transfers a mounting component including a mounting portion to a base component's mounting position; and a jig which corrects the mounting portion's position of the mounting component transferred by the component transfer robot to mounting position, wherein the jig includes a guide portion which corrects the mounting portion's position of the mounting component to the mounting position, and wherein the component transfer robot includes a holding section which holds the mounting component so that a posture of the mounting component is changeable. In this configuration, it becomes possible to construct the component mounting robot system which can correct position of the mounting portion of the mounting component, by changing the posture of the body of the mounting component and guiding the mounting portion to the mounting position even in a case where the mounting component has a cylindrical shape.

Manufacturing of a high-resolution sensor device is enabled. An optical component mounting device (100) includes a pressing portion (3), which presses an optical component from a side on which a suction portion (1) is disposed after the suction portion (1) stops sucking.

A component mounting device which mounts on a board electronic components including a fitting component to be attached by a mechanical fitting or engagement to a to-be-attached part formed in the board. The component mounting device includes a moving and mounting head which holds and takes out the fitting component by a holding unit from a component supply part to move and mount the fitting component on the to-be-attached part of the board, and a pressing head which presses the fitting component that is moved and mounted on the to-be-attached part by a pressing unit to attach the fitting component to the to-be-attached part.