A work machine comprising a work head configured to hold an electrical component having multiple lead terminals; a moving device configured to move the work head in the up-down direction; an imaging device configured to image the electrical component held with work head while being illuminated from the side; and a control device configured to control the operation of the work head and the moving device; wherein the control device calculates the inclination of an electrical component held by the work head based on imaging data of lead terminals of the electrical component imaged by the imaging device while the work head is moved in the up-down direction by the moving device, so that the mounting work of the electrical component is performed by taking the calculated inclination into account.

A component mounting device moves a board height sensor horizontally to multiple measuring points and measures heights of the front surface of the board at the multiple measuring points. Subsequently, the component mounting device obtains a positional deviation in the horizontal direction of a target mounting position on the front surface of the board based on the heights of the front surface of the board so measured. In addition, the component mounting device obtains a positional deviation in a vertical direction of the target mounting position based on a measured height in the vertical direction of the front surface of the board. Then, the component mounting device corrects the target mounting position based on the positional deviation in the horizontal direction and the positional deviation in the vertical direction that are so obtained and mounts a component in the target mounting position so corrected.

A component mounter including a mounting head having multiple holding bodies, a revolving mechanism configured to revolve the multiple holding bodies along a revolution trajectory, a rotating mechanism configured to cause the multiple holding bodies to rotate on their axes in synchronism with each other, a detection section configured to detect a component located in one or more component detection positions which are different from the component pickup positions on the revolution trajectory from a side thereof; and a control section. The control section performs component pickup processing for causing the mounting head to cause at least one of the holding bodies located in the component pickup position to pick up and hold the component and holding body revolving processing for causing the revolving mechanism to locate the holding body that does not hold the component.

A receiving device for components. The receiving device is designed to be adjusted in a controlled manner relative to a deposit point at least partly along a first, second, and/or third axis by at least one linear drive and/or move a support guided by the receiving device along one of the first and/or second axes by a drive. The receiving device has a position sensor which is paired with a component deposit point in order to detect a component which has only been partly deposited in a pocket of the support at the component deposit point, where the position sensor is connected to the receiving device laterally of the support such that the position sensor is moved directly together with the receiving device.

A device (150) for supplying components (197) for a placement machine (100) is described, wherein the components (197) are provided in the form of a continuous material (295). The device (150) has (a) a chassis (252); (b) a transport device (260) attached to the chassis (252) for transporting the continuous material (295) along a transport track towards a pick-up position; and (c) a cutting device (270) which is configured to cut off a section (296) at a leading end of the continuous material (295), wherein the cut-off section (296) represents a supplied component (197). Also described is a placement system (BS) having such a component supplying device (150), and a method for supplying components (197) cut off from a continuous material (295) to a placement machine.

A calculation device for a work machine comprising a holding head including a holding tool configured to hold a lead component comprising a lead and a body and a moving device configured to move the holding head, the calculation device calculating a release position of the lead component held by the holding tool, when the work machine mounts the lead component on a board by inserting the lead of the lead component held by the holding tool into a hole formed on the board by operating the moving device.

An information processing device configured to determine a mounting position of a tape feeder to any one of multiple feeder mounting sections formed in a work machine, in which mounting positions of two or more tape feeders configured to supply components of holding target held by two or more holding tools of a work head disposed in the work machine are determined to any one of the multiple feeder mounting sections based on position information indicating supply positions of the two or more tape feeders, so that a difference in an amount of deviation of the supply positions of the two or more tape feeders is within a predetermined range.

The invention relates to an apparatus for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. At least one reference mark is attached to the bond head or the component gripper.

A resin shaping device configured to cure a resin placed in a mold in a state in which the mold is pressed against a substrate, the resin shaping device comprising: a substrate holding unit configured to hold the substrate in an orientation such that a forming face for forming a resin part on the substrate faces vertically downward; a head configured to hold the mold from vertically below; a head drive unit configured to cause the head to face a position for formation of a resin part on the substrate, and then cause vertically upward movement of the head so that the head approaches the substrate holding unit and presses the mold from vertically below the substrate; and a resin curing unit configured to cure the resin placed in the mold in a state in which the mold is pressed against the substrate.

A component mounting device moves a board height sensor horizontally to multiple measuring points and measures heights of the front surface of the board at the multiple measuring points. Subsequently, the component mounting device obtains a positional deviation in the horizontal direction of a target mounting position on the front surface of the board based on the heights of the front surface of the board so measured. In addition, the component mounting device obtains a positional deviation in a vertical direction of the target mounting position based on a measured height in the vertical direction of the front surface of the board. Then, the component mounting device corrects the target mounting position based on the positional deviation in the horizontal direction and the positional deviation in the vertical direction that are so obtained and mounts a component in the target mounting position so corrected.