A component supply device including a main body provided with an introducing region into which a component supply tape holding components is introduced and configured to supply the components by sending the component supply tape introduced into the main body via the introducing region in a longitudinal direction of the component supply tape. The device comprises a tape supporter insertable into the introducing region while supporting the component supply tape, and a clamping mechanism configured to sandwich and hold at least a part of a supported part of the component supply tape supported by the tape supporter with respect to the tape supporter. The component supply tape is introduced into the main body by inserting the tape supporter into the introducing region with the component supply tape held by the clamping mechanism.

There are provided a wind-up drum that is easily detached in a state in which a wound tape is fastened, a tape feeder including the wind-up drum, and a component mounting machine capable of mounting the tape feeder. A wind-up drum includes a tape holding member including an insertion hole for inserting a support shaft of a rotating device and configured to hold a wound tape, and a wound member attached to the tape holding member, configured to wind up the tape by rotating the support shaft by the rotating device in a state in which the support shaft is mounted, and including a rotating member that rotates in contact with the support shaft when the wound member is detached from the support shaft in a state in which the tape is wound.

Data associated with an electronics component within a placement process performed by a placement machine is recorded by using the camera to image a machine-readable code located on the component tape which expresses data associated with an electronics component to be picked up by the placement head. The camera could be located within the feeder or the placement head.

A component mounting device includes a component supply device that supplies a component to a component supply position by using a component housing tape, a head unit provided with a suction nozzle that can be moved up and down, a first image capturing unit that captures the component supplied to the component supply position, and a component posture determination unit that determines the posture of the component supplied to the component supply position. Based on a captured image captured by the first image capturing unit, the component posture determination unit determines whether the component takes an abnormal posture protruding from a component housing part in a direction intersecting the vertical direction on a horizontal plane in the component housing tape.

A circuit board tape includes substrate units each including a sprocket-hole region, a layout region and a joining mark. There are odd and more than three sprocket holes on the sprocket-hole region. An imaginary line extended from the joining mark is extended to between a first layout and a second layout located on the layout region. The amount of the sprocket holes between the imaginary lines of the adjacent substrate units is odd. The circuit board tape is cut along the imaginary lines of the different substrate units so as to remove the defective substrate unit from the circuit board tape and divide the circuit board tape into a front tape and a rear tape. After joining the front and rear tapes, the region where a first layout on the front tape and a second layout on the rear tape are located is defined as a combined layout region.

A tape loading device includes a feeder holding stand configured to hold a feeder, an acquisition section configured to acquire identification information of the feeder held by the feeder holding stand and identification information of a reel on which a carrier tape accommodating multiple components is wound, a loading section configured to load the carrier tape unwound from the reel into the feeder, and a control device configured to control an operation of the loading section based on a determination result of whether the carrier tape is loadable into the feeder by a management device.

A component mounting machine includes an imaging device configured to image a supply position, to which a component is supplied from a component supply device, from above, a component detecting sensor configured to detect the component. A control device acquires component information related to the component supplied by the component supply device when a predetermined determination condition is established. Then the control device selects from multiple processing including first determination processing for determining presence or absence of a component shortage of the component supply device by determining presence or absence of the component at the supply position based on a captured image, and second determination processing for determining presence or absence of a component shortage of the component supply device by detecting the presence or absence of the component at the supply position by the component detecting sensor.

A component supply device including an accommodation body installation unit in which one or more accommodation bodies each accommodating components are installable, the component supply device sequentially operates the one or more accommodation bodies to supply each of the components to a predetermined component supply position. The component supply device comprises a supply state detector which detects a supply state of components in total accommodated in the one or more accommodation bodies installed on the accommodation body installation unit, a determination unit which determines, based on the supply state, a state of the accommodation body installation unit among (i) an installation disabled state, (ii) an installation enabled state, and (iii) an installation required state, and a notifier which notifies a worker of the state of the accommodation body installation unit determined by the determination unit.

A carrier tape holding electrical components to a reel around which the carrier tape is wound is provided. Furthermore, the present disclosure is related to a pick-and-place apparatus for receiving this carrier tape and for picking and placing the electrical components arranged in the carrier tape. The carrier tape according to an aspect of the present disclosure includes an adhesive film that forms a bottom wall of the cavities in which a plurality of electrical components is arranged. The adhesive of the adhesive film is configured to substantially release the attachment of the electrical component as a result of heating the adhesive and/or as a result of irradiating the adhesive using light, such as visible light, infrared light, or ultraviolet light, for the purpose of allowing the electrical component to be removed from the cavity using a pick-and-place apparatus.

A method in an automated Surface Mount Device (SMD) warehouse configured to store bins at predetermined positions within said automated Surface Mount Device (SMD) warehouse, the method comprising receiving a bin at a port of said automated Surface Mount Device (SMD) warehouse and scanning an identity tag attached to said bin to obtain a bin ID.