A bending device is provided in a tape feeder. In the bending device, lead wires of a bending target lead component that has reached a bending position of lead component tape fed by a feeding device are bent. In addition, as the lead wires are cut by a cutting device, bent lead components are separated from a carrier tape, and the bent lead components are supplied one by one. In this manner, in the tape feeder, as the lead wires of the lead component tape are bent, the bent lead components are supplied